Patents by Inventor Bong-Ju Lee

Bong-Ju Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10530443
    Abstract: An electronic device is provided. The electronic device includes a first antenna configured to transmit a first transmission signal having a first phase, a second antenna configured to transmit a second transmission signal having a second phase, a transceiver electrically connected to the first antenna and the second antenna, and a processor. The transceiver is configured to identify a first feedback transmission signal including part of the first transmission signal and a second feedback transmission signal including part of the second transmission signal and calculate a correlation for the first and second feedback transmission signals. The processor is configured to predict radiation power radiated from the electronic device based on at least the part of the correlation, control the transceiver to adjust at least one of the first phase or the second phase, and change the predicted radiation power to a predetermined value based on an operation for the adjustment.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: January 7, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Han-Yeop Lee, Dong-Il Yang, Bong-Sup Son, Dong-Ju Lee, Won-Jin Choi, Hyo-Seok Na
  • Patent number: 10522497
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads, an active surface on which the connection pads are disposed, and an inactive surface opposing the active surface, and disposed in the recess portion so that the inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers of the frame and the connection pads of the semiconductor chip to each other, wherein the stopper layer includes an insulating material.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: December 31, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong Ho Lee, Bong Ju Cho, Young Gwan Ko, Jin Su Kim, Shang Hoon Seo, Jeong Il Lee
  • Patent number: 10504825
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; first metal bumps disposed on the connection pads; second metal bumps disposed on an uppermost wiring layer of the wiring layers; an encapsulant covering at least portions of each of the frame, the semiconductor chip, and the first and second metal bumps and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads and the uppermost wiring layer through the first and second metal bumps.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: December 10, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong Il Lee, Jeong Ho Lee, Jin Su Kim, Bong Ju Cho
  • Patent number: 10453788
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers disposed on the insulating layers, and connection via layers penetrating through the insulating layers and electrically connecting the wiring layers to each other, and having a recess portion; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and an active surface of the semiconductor chip and including one or more redistribution layers electrically connecting the wiring layers and the connection pads to each other, in which the recess portion includes walls having different inclined angles.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: October 22, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong II Lee, Jeong Ho Lee, Jin Su Kim, Bong Ju Cho
  • Publication number: 20190285625
    Abstract: A biosensor includes a solution chamber containing primary antibodies, secondary antibodies, and measuring substances, an injection fluid transfer unit for connection the solution chamber to an injection port, and a discharging transfer unit for connecting the solution chamber to a discharging port.
    Type: Application
    Filed: March 12, 2019
    Publication date: September 19, 2019
    Inventors: Bong Kyu KIM, Chang-Geun AHN, Kwang Hyo CHUNG, Eun-Ju JEONG, Chul HUH, Seunghwan KIM, Jin Tae KIM, Won Kyoung LEE
  • Publication number: 20190289729
    Abstract: Disclosed is a display apparatus including an LED module having a first fastening member, a front bracket having a second fastening member on which the LED module is mounted by an attractive force generated between the first and second fastening members, and at least one level adjusting member disposed on the LED module and configured to adjust a level difference between the LED module and another adjacent LED module.
    Type: Application
    Filed: March 14, 2019
    Publication date: September 19, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Huu Lam Vuong NGUYEN, Bong Ju LEE, Kwang Sung HWANG
  • Patent number: 10347586
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion and a stopper layer disposed on a bottom surface of the recess portion; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is disposed on the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; a connection member disposed on the frame and an active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers and the connection pads to each other; and a guide pattern disposed adjacent to a wall of the recess portion and disposed in the frame. An edge of the bottom surface of the recess portion has a groove portion.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: July 9, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Su Kim, Jeong Ho Lee, Shang Hoon Seo, Bong Ju Cho
  • Publication number: 20190172781
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers disposed on the insulating layers, and connection via layers penetrating through the insulating layers and electrically connecting the wiring layers to each other, and having a recess portion; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and an active surface of the semiconductor chip and including one or more redistribution layers electrically connecting the wiring layers and the connection pads to each other, in which the recess portion includes walls having different inclined angles.
    Type: Application
    Filed: May 24, 2018
    Publication date: June 6, 2019
    Inventors: Jeong Il LEE, Jeong Ho LEE, Jin Su KIM, Bong Ju CHO
  • Publication number: 20190165837
    Abstract: According to various embodiments disclosed herein, an electronic device includes a transceiver configured to generate a first signal and a second signal, a first coupler configured to receive the first signal from the transceiver and provide the first signal to the first antenna; a second coupler configured to receive the second signal from the transceiver and provide the second signal to the second antenna; and a control circuitry operatively connected to the transceiver. The control circuitry is configured to determine values associated with a phase difference between the first signal and the second signal at least partially based on the signals from the first coupler and the second coupler, and to cause the transceiver to adjust a phase of the first signal and/or a phase of the second signal using at least some of the values in order to reduce or remove the phase difference. Other embodiments have been provided.
    Type: Application
    Filed: October 17, 2018
    Publication date: May 30, 2019
    Inventors: Bong-Sup SON, Dong-Ju LEE, Won-Jin CHOI, Seok-Kun HYUNG, Sung-Jun KIM
  • Publication number: 20190164895
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion and a stopper layer disposed on a bottom surface of the recess portion; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is disposed on the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; a connection member disposed on the frame and an active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers and the connection pads to each other; and a guide pattern disposed adjacent to a wall of the recess portion and disposed in the frame. An edge of the bottom surface of the recess portion has a groove portion.
    Type: Application
    Filed: May 22, 2018
    Publication date: May 30, 2019
    Inventors: Jin Su KIM, Jeong Ho LEE, Shang Hoon SEO, Bong Ju CHO
  • Publication number: 20190159129
    Abstract: An electronic device includes a housing; a first antenna located at a first part of the housing; a second antenna located at a second part separated from the first part of the housing; a transceiver configured to generate a first signal and a second signal; a first coupler electrically connected between the first antenna and the transceiver and configured to receive the first signal from the transceiver and provide the received first signal to the first antenna; a second coupler electrically connected to the second antenna and the transceiver and configured to receive the second signal from the transceiver and provide the received second signal to the second antenna; and a control circuit operationally connected to the transceiver, wherein the control circuit is configured to determine at least one value related to gains of the first signal and the second signal based at least partially on the signals provided from the first coupler and the second coupler, determine whether the first signal has a higher gain
    Type: Application
    Filed: November 14, 2018
    Publication date: May 23, 2019
    Inventors: Won-Jin Choi, Dong-Ju Lee, Bong-Sup Son, Seok-Kun Hyung, Ji-Woo Lee
  • Publication number: 20190139876
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; first metal bumps disposed on the connection pads; second metal bumps disposed on an uppermost wiring layer of the wiring layers; an encapsulant covering at least portions of each of the frame, the semiconductor chip, and the first and second metal bumps and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads and the uppermost wiring layer through the first and second metal bumps.
    Type: Application
    Filed: May 24, 2018
    Publication date: May 9, 2019
    Inventors: Jeong Il LEE, Jeong Ho LEE, Jin Su KIM, Bong Ju CHO
  • Patent number: 9890628
    Abstract: A fracturing device using a shock wave of a plasma reaction includes a partition unit for partitioning a reaction space such that a reaction medium is accommodated therein, by sealing a part having a plurality of through-holes among well casing of a gas well provided at shale rock layer so as to extract shale gas and a probe for applying energy to the reaction medium such that the reaction medium generates shock wave by a plasma reaction as the energy is applied to the reaction medium accommodated inside the reaction space, so as to propagate shock wave to the shale rock layer.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: February 13, 2018
    Assignee: GREEN SCIENCE CO. LTD.
    Inventors: Yoong Wook Sin, Chang Woo Ok, Bong Ju Lee
  • Publication number: 20170138163
    Abstract: Provided is a fracturing device using a shock wave of a plasma reaction, the fracturing device comprising: a partition unit for partitioning a reaction space such that a reaction medium is accommodated therein, by sealing a part having a plurality of through-holes among well casing of a gas well provided at shale rock layer so as to extract shale gas; and a probe for applying energy to the reaction medium such that the reaction medium generates shock wave by a plasma reaction as the energy is applied to the reaction medium accommodated inside the reaction space, so as to propagate shock wave to the shale rock layer.
    Type: Application
    Filed: April 3, 2015
    Publication date: May 18, 2017
    Applicant: GREEN SCIENCE CO. LTD.
    Inventors: Yoong Wook SIN, Chang Woo OK, Bong Ju LEE
  • Patent number: 9546666
    Abstract: Provided is an impeller for a fuel pump of a vehicle capable of decreasing a magnitude of high frequency fluid noise due to high speed rotation of the impeller by upper and lower blades of impeller blades positioned between upper and lower casings of the fuel pump and coupled to a shaft of a driving motor to deliver a fuel by rotational force so as to have asymmetrical angles based on the center of a thickness of an impeller body in sucking the fuel from a fuel tank and supplying the fuel to an engine of an internal combustion engine.
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: January 17, 2017
    Assignee: COAVIS
    Inventors: Bong Ju Lee, Hyun Tae Lee, Seong Hwan Moon, Mun Sik Jeon, In Seok Sohn
  • Publication number: 20150050155
    Abstract: Provided is an impeller for a fuel pump of a vehicle capable of decreasing a magnitude of high frequency fluid noise due to high speed rotation of the impeller by upper and lower blades of impeller blades positioned between upper and lower casings of the fuel pump and coupled to a shaft of a driving motor to deliver a fuel by rotational force so as to have asymmetrical angles based on the center of a thickness of an impeller body in sucking the fuel from a fuel tank and supplying the fuel to an engine of an internal combustion engine.
    Type: Application
    Filed: July 11, 2014
    Publication date: February 19, 2015
    Inventors: Bong Ju LEE, Hyun Tae LEE, Seong Hwan MOON, Mun Sik JEON, In Seok Sohn
  • Patent number: 8926914
    Abstract: A liquid medium plasma discharge generating apparatus includes a main body; a power electrode, provided at one side within the main body, for receiving electric power; a diaphragm member provided within the main body, and consisting of a dielectric defining one or more holes or slits; and a liquid medium charged inside the main body, wherein a ground electrode may be further provided in the main body, opposite the power electrode with the diaphragm member therebetween, whereupon the diaphragm member is arranged contacting the ground electrode.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: January 6, 2015
    Assignee: Korea Basic Science Institute
    Inventors: Dong Chan Seok, Tai Hyeop Loh, Seung Ryul Yoo, Yong Cheol Hong, Bong Ju Lee
  • Patent number: 8648534
    Abstract: The present invention relates to the new structure antenna to create the uniform large area plasma using microwave. The microwave antenna to create the plasma of present invention comprises the waveguide, main body of antenna and the coaxial structure connecting part which connects said waveguide and said main body of antenna electrically, the main body of antenna comprises the conductive block in donut shape forming multiple slots, and notches are formed between the multiple slots of the conductive block and multiple permanent magnets are inserted into the notches. The multiple slots can be formed by passing through the inside and outside of the conductive block and the multiple slots can be formed with repetitive square wave pattern.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: February 11, 2014
    Assignee: Korea Basic Science Institute
    Inventors: Hyun Jong You, Soo Ouk Jang, Yong Ho Jung, Bong Ju Lee
  • Publication number: 20130252115
    Abstract: A generation system using a plasma gasifier, includes a plasma gasifier that combusts pulverized coal or biomass using plasma so as to generate a synthesis gas including hydrogen (H2) and carbon monoxide (CO), an impurity removing device that removes an impurity included in the generated synthesis gas, a gas storage tank in which the synthesis gas, an impurity of which has been removed by the impurity removing device, is stored, and a gas engine that combusts the synthesis gas stored in the gas storage tank so as to produce electricity.
    Type: Application
    Filed: December 3, 2010
    Publication date: September 26, 2013
    Applicant: KOREA BASIC SCIENCE INSTITUTE
    Inventors: Yong Cheol Hong, Dong Hun Shin, Bong Ju Lee, Han Sup Uhm, Sang Ju Lee, Hyeong Won Jeon
  • Publication number: 20120160692
    Abstract: A liquid medium plasma discharge generating apparatus includes a main body; a power electrode, provided at one side within the main body, for receiving electric power; a diaphragm member provided within the main body, and consisting of a dielectric defining one or more holes or slits; and a liquid medium charged inside the main body, wherein a ground electrode may be further provided in the main body, opposite the power electrode with the diaphragm member therebetween, whereupon the diaphragm member is arranged contacting the ground electrode.
    Type: Application
    Filed: July 21, 2010
    Publication date: June 28, 2012
    Applicant: KOREA BASIC SCIENCE INSTITUTE
    Inventors: Dong Chan Seok, Tai Hyeop Loh, Seung Ryul Yoo, Yong Cheol Hong, Bong Ju Lee