Abstract: Disclosed herein is a display apparatus packing material. The display apparatus packing material includes a first area configured to cover a front surface of a display apparatus; a second area configured to cover sides of the display apparatus, and extending from edges of the first area; and a third area disposed between the first area and the second area such that the second area is bendable with respect to the first area, wherein the second area covers sides of the display apparatus when the second area is bent, and includes an adhesive member configured to be attached on the sides of the display apparatus.

Abstract: A coil component includes a body part in which a plurality of body sheets are stacked, an internal coil disposed in the body part and including a plurality of internal electrode patterns each disposed on a respective one of the plurality of body sheets, and an external electrode part electrically connected to both ends of the internal coil. A first internal area of a first internal electrode pattern disposed on one of the plurality of body sheets is smaller than a second internal area of a second internal electrode pattern disposed on another of the plurality of body sheets.

Abstract: A packaging box is formed of corrugated cardboard, wherein end portions of the packaging box are protruded relative to a middle portion of the packaging box so that the packaging box has a curved shape, and a corrugation direction of the corrugated cardboard is parallel to a longitudinal direction of the packaging box.

Abstract: A coil component includes a body part in which a plurality of body sheets are stacked, an internal coil disposed in the body part and including a plurality of internal electrode patterns each disposed on a respective one of the plurality of body sheets, and an external electrode part electrically connected to both ends of the internal coil. A first internal area of a first internal electrode pattern disposed on one of the plurality of body sheets is smaller than a second internal area of a second internal electrode pattern disposed on another of the plurality of body sheets.

Abstract: Disclosed herein is a display apparatus packing material. The display apparatus packing material includes a first area configured to cover a front surface of a display apparatus; a second area configured to cover sides of the display apparatus, and extending from edges of the first area; and a third area disposed between the first area and the second area such that the second area is bendable with respect to the first area, wherein the second area covers sides of the display apparatus when the second area is bent, and includes an adhesive member configured to be attached on the sides of the display apparatus.

Abstract: A multilayer electronic component includes a ceramic body including a plurality of insulating layers; an internal coil part in which a plurality of first internal coil patterns and a plurality of second internal coil patterns disposed on the insulating layers are connected to each other; and a first external electrode connected to first lead parts of the first and second internal coil patterns, and a second external electrode connected to second lead parts of the first and second internal coil patterns, wherein the first and second internal coil patterns are disposed on the insulating layers adjacent to each other and are connected to each other in parallel, and the via electrodes are disposed such that a plurality of via electrodes configure a single connection terminal.

Abstract: A packaging box is formed of corrugated cardboard, wherein end portions of the packaging box are protruded relative to a middle portion of the packaging box so that the packaging box has a curved shape, and a corrugation direction of the corrugated cardboard is parallel to a longitudinal direction of the packaging box.

Abstract: A multilayer inductor includes: a body; and internal electrodes disposed within the body and connected to each other through conductive vias, wherein widths of the internal electrodes have two or more different values within a range of 35 ?m to 55 ?m, and the internal electrodes include a first internal electrode and a second internal electrode having a width different from that of the first internal electrode.

Abstract: There are provided a chip component and a manufacturing method thereof. The chip component according to an exemplary embodiment of the present disclosure includes: a multilayer body including a plurality of insulating layers and having a bottom surface provided as a mounting surface and a top surface opposing the bottom surface; first external electrodes disposed on the bottom surface of the multilayer body; and second external electrodes disposed on both end surfaces of the multilayer body in a length direction of the multilayer body and the bottom surface of the multilayer body, wherein the second external electrodes are disposed to cover at least portions of the first external electrodes.

Abstract: There is provided a chip coil component including: a ceramic body in which a plurality of ceramic layers are disposed and of which a bottom surface is provided as a mounting surface; a first external electrode disposed on one end surface of the ceramic body in a length direction of the ceramic body and a top surface and the bottom surface of the ceramic body; and a second external electrode disposed on the other end surface of the ceramic body in the length direction of the ceramic body and the bottom surface of the ceramic body.

Abstract: A multilayer electronic component includes a ceramic body including a plurality of insulating layers; an internal coil part in which a plurality of first internal coil patterns and a plurality of second internal coil patterns disposed on the insulating layers are connected to each other; and a first external electrode connected to first lead parts of the first and second internal coil patterns, and a second external electrode connected to second lead parts of the first and second internal coil patterns, wherein the first and second internal coil patterns are disposed on the insulating layers adjacent to each other and are connected to each other in parallel, and the via electrodes are disposed such that a plurality of via electrodes configure a single connection terminal.

Abstract: A chip coil component may include: a ceramic body in which a plurality of magnetic layers are stacked; and an internal coil part disposed inside the ceramic body and having a plurality of internal coil patterns disposed on the plurality of magnetic layers to be electrically connected. The ceramic body may include an active layer, which is a capacitance forming part, and first and second cover layers disposed on and below the active layer in a thickness direction of the ceramic body, and a thickness of the second cover layer may be greater than that of the first cover layer.

Abstract: According to example embodiments, an automatic packing apparatus includes at least one box supply unit configured to move a box stack upwards such that a product is inserted into a packing box of the box stack, the packing box being the uppermost box of the box stack, an inlet formation unit configured to lift the upper surface of the packing box to form an inlet on at least one unbonded side surface of the packing box, a product supply unit configured to transfer the product to the inlet; and a side surface bonding unit configured to bond the at least one unbonded side surface of the packing box. The at least one unbonded side surface includes the inlet and the packing box includes the product inserted therein.

Abstract: A multilayer electronic component in which when an internal coil is formed in a direction perpendicular with respect to a substrate mounting surface and external electrodes are only formed on one surface (a lower surface) of the chip element facing a substrate at the time of mounting the chip element, the one surface to which the internal coil is exposed and on which the external electrodes need to be formed may be easily distinguished, and a manufacturing method thereof.

Abstract: A coupling structure for a multi-layered chip filter includes a resonator layer including a resonator pattern with spaced areas and a coupling layer including at least two separated overlap portion patterns overlapped with the spaced areas of the resonator pattern respectively and a connecting portion pattern having multiple linear portions connecting the separated overlap portion patterns in an area not-overlapped with the resonator pattern.

Abstract: Disclosed herein is a multilayer type inductor for implementing high quality factor (Q factor), and more particularly, a multilayer type inductor, including: a ceramic body formed by laminating a plurality of ceramic sheets; a coil electrode provided between the ceramic sheets and having an outer peripheral formed in a curved surface; and a pair of external terminals provided at both side portions of the ceramic body.

Abstract: Disclosed herein is a multilayer inductor including: a multilayered body formed by alternately multilayering magnetic sheets and internal electrodes and a pair of external terminals provided at both end portions of the multilayered body, the internal electrodes being interlayer-connected through a via to form a coil, wherein a ratio (Ts/Te) between a space Ts between internal electrodes of upper and lower layers and a thickness Te of a single internal electrode and a ratio (Fw/W) between an inner width Fw of the internal electrode and a width W of the multilayered body are determined according to parasitic capacitance C generated between the internal electrodes of upper and lower layers, parasitic capacitance C generated between the internal electrodes and the external terminals, inductance L proportional to the number of layers of the internal electrodes, and inductance L proportional to an internal sectional area of the coil.

Abstract: There are provided a multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength, and a fabrication method thereof. Dummy electrodes connected to the outer electrodes are formed on cover areas and an active area of a ceramic main body. A multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength can be obtained.

Abstract: Disclosed herein is a laminated chip inductor including: a laminate including a plurality of first sheets having conductive patterns printed thereon and laminated in order; and a sheet having a discrimination via hole and provided on and/or under the laminate.