Patents by Inventor Boong Kim

Boong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9275852
    Abstract: Provided is an apparatus for treating a substrate using a supercritical fluid. The substrate treating apparatus includes a housing, a support member disposed within the housing to support the substrate, a supercritical fluid supply unit in which the supercritical fluid is stored, a supply tube connecting the supercritical fluid supply unit to the housing to adjust an amount of supercritical fluid supplied from the supercritical fluid supply unit into the housing, and a vent tube branched from the supply tube to discharge the supercritical fluid remaining in the supply tube. A switching valve opening or closing the vent tube is disposed in the vent tube.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: March 1, 2016
    Assignee: Semes Co., Ltd.
    Inventors: KiBong Kim, Boong Kim, Gil Hun Song, Oh Jin Kwon
  • Patent number: 9136147
    Abstract: Provided are an apparatus and method for treating a substrate. More particularly, an apparatus and method for treating a substrate through a supercritical process are provided. The apparatus includes: a housing having an entrance in a predetermined surface thereof and providing a space for performing a high pressure process; a support member disposed in the housing to support a substrate; a door for opening and closing the entrance; and a pressing member configured to apply a force to the door so as to close the housing during the high pressure process.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: September 15, 2015
    Assignee: SEMES CO., LTD.
    Inventors: Joo Jib Park, Oh Jin Kwon, Sungho Jang, Boong Kim
  • Publication number: 20150155188
    Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus includes a process chamber in which a predetermined process is performed on a substrate, a pressure meter measuring a pressure within the process chamber, and a controller receiving the measured pressure value from the pressure meter to determine an opening time of the process chamber. The controller opens the process chamber when a set condition elapses from a time at which the pressure within the process chamber reaches a preset opening pressure.
    Type: Application
    Filed: December 1, 2014
    Publication date: June 4, 2015
    Inventors: In-II Jung, Woo-Young Kim, Young il Lee, Boong Kim
  • Patent number: 8881996
    Abstract: Provided is a single wafer processing apparatus for cleaning a substrate. The apparatus includes a substrate support member including a spin head to place a substrate thereon, a processing bowl disposed to surround the spin head and adapted to collect a processing fluid scattering from the substrate, and a swing nozzle unit adapted to inject the processing fluid to the substrate placed on the spin head by rotating in a swinging motion, wherein the swing nozzle unit includes a nozzle part including a nozzle body constituted by an inner resin pipe supplying an inner path where a processing fluid supply tube is disposed, a metal pipe disposed to surround the inner resin pipe, and an outer resin pipe disposed to surround the metal pipe, and a nozzle driver adapted to rotate the nozzle part in a ?-axis direction and move the nozzle part up and down in a z-axis direction.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: November 11, 2014
    Assignee: Semes Co., Ltd.
    Inventors: Taeho Kim, Boong Kim, Youngju Jeong
  • Publication number: 20130318815
    Abstract: Provided is an apparatus for treating a substrate using a supercritical fluid. The substrate treating apparatus includes a housing, a support member disposed within the housing to support the substrate, a supercritical fluid supply unit in which the supercritical fluid is stored, a supply tube connecting the supercritical fluid supply unit to the housing to adjust an amount of supercritical fluid supplied from the supercritical fluid supply unit into the housing, and a vent tube branched from the supply tube to discharge the supercritical fluid remaining in the supply tube. A switching valve opening or closing the vent tube is disposed in the vent tube.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 5, 2013
    Inventors: KiBong KIM, Boong KIM, Gil Hun SONG, Oh Jin KWON
  • Publication number: 20130318812
    Abstract: Provided is an apparatus and method for drying a substrate. The apparatus includes a housing, a substrate support member, a fluid supply member, and a discharge member. The housing provides a space in which a drying process is performed. The substrate support member is provided in the housing to support the substrate. The fluid supply member includes a supply line for supplying a process fluid of a supercritical state to the housing. The discharge member includes a discharge line for discharging the process fluid from the housing. Here, the supply line includes a first supply line provided to supply the process fluid to the housing at a first supply flow rate, and a second supply line provided to supply the process fluid to the housing at a second supply flow rate.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 5, 2013
    Inventors: Boong Kim, Ki Bong Kim, Gil Hun Song, Oh Jin Kwon
  • Publication number: 20130025155
    Abstract: Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.
    Type: Application
    Filed: July 27, 2012
    Publication date: January 31, 2013
    Applicant: SEMES CO., LTD.
    Inventors: Boong Kim, Oh Jin Kwon, Sungho Jang, Joo Jib Park
  • Publication number: 20130029282
    Abstract: Provided are an apparatus and method for treating a substrate. More particularly, an apparatus and method for treating a substrate through a supercritical process are provided. The apparatus includes: a housing having an entrance in a predetermined surface thereof and providing a space for performing a high pressure process; a support member disposed in the housing to support a substrate; a door for opening and closing the entrance; and a pressing member configured to apply a force to the door so as to close the housing during the high pressure process.
    Type: Application
    Filed: July 27, 2012
    Publication date: January 31, 2013
    Applicant: SEMES CO., LTD.
    Inventors: Joo Jib Park, Oh Jin Kwon, Sungho Jang, Boong Kim
  • Publication number: 20130028690
    Abstract: Provided are an apparatus and method for treating a substrate. More particularly, an apparatus and method for treating a substrate through a supercritical process are provided. The apparatus includes a housing having an entrance in a side thereof and providing a space for performing a process, a door for opening and closing the entrance, and a support member disposed on the door to receive a substrate thereon.
    Type: Application
    Filed: July 27, 2012
    Publication date: January 31, 2013
    Applicant: SEMES CO., LTD.
    Inventors: Joo Jib Park, Woo Young Kim, Oh Jin Kwon, Boong Kim
  • Publication number: 20110068200
    Abstract: Provided is a single wafer processing apparatus for cleaning a substrate. The apparatus includes a substrate support member including a spin head to place a substrate thereon, a processing bowl disposed to surround the spin head and adapted to collect a processing fluid scattering from the substrate, and a swing nozzle unit adapted to inject the processing fluid to the substrate placed on the spin head by rotating in a swinging motion, wherein the swing nozzle unit includes a nozzle part including a nozzle body constituted by an inner resin pipe supplying an inner path where a processing fluid supply tube is disposed, a metal pipe disposed to surround the inner resin pipe, and an outer resin pipe disposed to surround the metal pipe, and a nozzle driver adapted to rotate the nozzle part in a ?-axis direction and move the nozzle part up and down in a z-axis direction.
    Type: Application
    Filed: September 16, 2010
    Publication date: March 24, 2011
    Inventors: Taeho KIM, Boong Kim, Youngju Jeong