Patents by Inventor Boshen Liang

Boshen Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for transferring a layer to a substrate
    Patent number: 12214580
    Abstract: The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: February 4, 2025
    Assignees: IMEC VZW, Katholieke Universiteit Leuven, KU LEUVEN R&D
    Inventors: Boshen Liang, Dominika Wysocka, David Cheyns
  • Method for Transferring a Layer to a Substrate
    Publication number: 20220396067
    Abstract: The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.
    Type: Application
    Filed: June 7, 2022
    Publication date: December 15, 2022
    Inventors: Boshen Liang, Dominika Wysocka, David Cheyns