Patents by Inventor Bradley Jendersee

Bradley Jendersee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020049492
    Abstract: An endoprosthesis is provided having an expandable, generally cylindrical body portion defining an inside surface and an outside surface. The inside surface is preferably regular and smooth to yield a low coefficient of friction, while the outside surface is modified to yield a relatively high coefficient of friction with a vessel surface, includes a macroscopic surface modification to engage the vessel surface, or includes an adhesive coating that bonds the stent to the vessel surface.
    Type: Application
    Filed: October 30, 2001
    Publication date: April 25, 2002
    Inventors: Robert Lashinski, Bradley Jendersee, Michael D. Boneau
  • Patent number: 6309411
    Abstract: An endoprosthesis is provided having an expandable, generally cylindrical body portion defining an inside surface and an outside surface. The inside surface is preferably regular and smooth to yield a low coefficient of friction, while the outside surface is modified to yield a relatively high coefficient of friction with a vessel surface, includes a macroscopic surface modification to engage the vessel surface, or includes an adhesive coating that bonds the stent to the vessel surface.
    Type: Grant
    Filed: June 5, 1998
    Date of Patent: October 30, 2001
    Assignee: Medtronic Ave, Inc.
    Inventors: Robert Lashinski, Bradley Jendersee, Michael D. Boneau
  • Patent number: 6309402
    Abstract: A encapsulated stent device for implantation within the vascular system includes a balloon of a balloon catheter formed around and adhered to a wire-like stent so that the outer surface of the device is more regular for delivery through the vascular system without an exterior sheath. The encapsulation securely anchors the stent to the balloon and maintains a low profile for negotiation of tortuous and narrowed vessels. Encapsulation requires placement of the stent over the balloon, placement of a sheath over the stent on the balloon, heating and preferably pressurization of the balloon to cause it to expand around the stent within the sheath, and cooling while preferably maintaining pressure to cause the balloon to adhere to the stent and to set the shape of the expanded balloon. Retainers may be placed at the distal and/or proximal ends of the stent during the encapsulation process, or the balloon material may expand to form retainers.
    Type: Grant
    Filed: November 10, 1998
    Date of Patent: October 30, 2001
    Assignee: Medtronic Ave, Inc.
    Inventors: Bradley A. Jendersee, Robert D. Lashinski, Michael D. Bonneau
  • Patent number: 5817152
    Abstract: An endoprosthetic device comprises at least two short stent segments welded together to form a connected stent. Each stent segment defines a single wire having straight sections integrally formed between axial turns. The welds are placed between stent segments at one or more aligned adjacent axial turns. The welded connected stent is flexible enough to allow it to pass through sharp turns and to be implanted to conform to the contour of the lesion to be treated. In one aspect of the invention all adjacent axial turns are welded together. In another aspect of the invention, selected adjacent axial turns are welded together to create a generally balanced spiral pattern of welds surrounding the cylindrical connected stent.
    Type: Grant
    Filed: May 30, 1995
    Date of Patent: October 6, 1998
    Inventors: Matthew Birdsall, Bradley Jendersee, Robert Lashinski, Michael D. Boneau