Patents by Inventor Brian J. Black

Brian J. Black has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through the lead soldering
    Patent number: 4972989
    Abstract: A method of joining surface mount components includes screen printing a single layer of solder paste or other adhesive onto a substrate, positioning a component with a planar lead with a hole through the planar lead over the solder and mounting a second component over the hole in the first lead. The assembly is heated or otherwise processed until the solder or adhesive flows by capillary action through the hole and into the space between the components such that it forms solder joint between the stacked components.
    Type: Grant
    Filed: October 30, 1989
    Date of Patent: November 27, 1990
    Assignee: Motorola, Inc.
    Inventors: Brian J. Black, Lisa M. Leding