Patents by Inventor Brian Joseph Scherer

Brian Joseph Scherer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9472783
    Abstract: The present techniques provide systems and methods for protecting electronic devices such as organic light emitting devices (OLEDs) from adverse environmental effects using a thin film encapsulation with reduced process time. In some embodiments, the process time of forming a graded barrier over the OLED structure may take less than 5 minutes, and may result in substantially similar barrier properties as those of metal and epoxy sealants and/or typical thin film encapsulations. The process time of forming the barrier may be reduced by increasing deposition rates for organic and/or inorganic materials, reducing the thicknesses of organic and/or inorganic layers, and/or varying the number of zones in the barrier.
    Type: Grant
    Filed: October 12, 2009
    Date of Patent: October 18, 2016
    Assignee: General Electric Company
    Inventors: Ahmet Gun Erlat, George Theodore Dalakos, Brian Joseph Scherer
  • Patent number: 8753711
    Abstract: The present techniques provide systems and methods for protecting electronic devices, such as organic light emitting devices (OLEDs) from adverse environmental effects. The edges of the devices may also be protected by a edge protection coating to reduce the adverse affects of a lateral ingress of adverse environmental conditions. In some embodiments, inorganic materials, or a combination of inorganic and organic materials, are deposited over the device to form a edge protection coating which extends approximately 3 millimeter or less beyond the edges of the device. In other embodiments, the device may be encapsulated with an organic region, and with an inorganic region, or the device may be encapsulated with inorganic materials, which may form the edge protection coating and may be combined with ultra high barrier technology. The coatings formed over the device may extend beyond the edges of the device to ensure lateral protection.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: June 17, 2014
    Assignee: General Electric Company
    Inventors: Ahmet Gun Erlat, George Theodore Dalakos, Brian Joseph Scherer
  • Patent number: 8318265
    Abstract: Methods for improving coating or etching uniformity of non-conductive substrates in plasma-mediated processes generally include applying an electrically conductive coating to the non-conductive substrate prior to plasma processing. The electrically conductive coating is disposed in electrical communication with a metallic electrode of a plasma reactor. By disposing a conductive layer on the non-conductive substrate, a uniform electric potential is created during plasma processing can be built up on the non-conductive, which is equivalent to that of the metallic electrode upon which it is disposed during plasma processing.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: November 27, 2012
    Assignee: General Electric Company
    Inventors: Brian Joseph Scherer, Ahmet Gun Erlat, Min Yan
  • Patent number: 8033885
    Abstract: In a method for depositing a barrier coating, a device is provided comprising a first portion and a second portion where a surface of the second portion is in a shadow zone. The device is pretreated wherein the pretreating alters a deposition rate of the barrier coating on a surface exposed to the pretreating. The shadow zone is substantially unexposed to the pretreating. A barrier coating is deposited wherein the barrier coating substantially conforms to a profile of the device. The coating may be a graded-composition barrier coating wherein a composition of the coating varies substantially continuously across a thickness thereof. The first portion may include a flexible, substantially transparent substrate. The second portion may include an electronic device. The barrier coating and first portion may encapsulate the second portion. The method is a single, commercially advantageous, barrier deposition process, enabling increased product throughput and low process tact time.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: October 11, 2011
    Assignee: General Electric Company
    Inventors: Ahmet Gun Erlat, George Theodore Dalakos, Min Yan, Shelia Neumann Tandon, Brian Joseph Scherer
  • Patent number: 8034419
    Abstract: Disclosed is a method relating to graded-composition barrier coatings comprising first and second materials in first and second zones. The compositions of one or both zones vary substantially continuously across a thickness of the zone in order to achieve improved properties such as barrier, flexibility, adhesion, optics, thickness, and tact time. The graded-composition barrier coatings find utility in preventing exposure of devices such as organic electro-luminescent devices (OLEDs) to reactive species found in the environment.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: October 11, 2011
    Assignee: General Electric Company
    Inventors: Ahmet Gun Erlat, Anil Duggal, Min Yan, Sheila Tandon, Brian Joseph Scherer
  • Publication number: 20110151200
    Abstract: The present techniques provide systems and methods for protecting electronic devices, such as organic light emitting devices (OLEDs) from adverse environmental effects. The edges of the devices may also be protected by a edge protection coating to reduce the adverse affects of a lateral ingress of adverse environmental conditions. In some embodiments, inorganic materials, or a combination of inorganic and organic materials, are deposited over the device to form a edge protection coating which extends approximately 3 millimeter or less beyond the edges of the device. In other embodiments, the device may be encapsulated with an organic region, and with an inorganic region, or the device may be encapsulated with inorganic materials, which may form the edge protection coating and may be combined with ultra high barrier technology. The coatings formed over the device may extend beyond the edges of the device to ensure lateral protection.
    Type: Application
    Filed: December 18, 2009
    Publication date: June 23, 2011
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Ahmet Gun Erlat, George Theodore Dalakos, Brian Joseph Scherer
  • Publication number: 20110086183
    Abstract: The present techniques provide systems and methods for protecting electronic devices such as organic light emitting devices (OLEDs) from adverse environmental effects using a thin film encapsulation with reduced process time. In some embodiments, the process time of forming a graded barrier over the OLED structure may take less than 5 minutes, and may result in substantially similar barrier properties as those of metal and epoxy sealants and/or typical thin film encapsulations. The process time of forming the barrier may be reduced by increasing deposition rates for organic and/or inorganic materials, reducing the thicknesses of organic and/or inorganic layers, and/or varying the number of zones in the barrier.
    Type: Application
    Filed: October 12, 2009
    Publication date: April 14, 2011
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Ahmet Gun Erlat, George Theodore Dalakos, Brian Joseph Scherer
  • Publication number: 20100080929
    Abstract: An improvement of a baseline method for depositing a coating on a device having a surface where the surface includes a first portion and a second portion, where the second portion is in a shadow zone, and where the coating is deposited using a first predetermined set of process parameters having a first ratio of a thickness of the coating on the second portion to a thickness of the coating on the first portion. In the improved method, the coating is deposited using a second predetermined set of process parameters such that the coating substantially conforms to a profile of the device and a second ratio of a thickness of the coating on the second portion to a thickness of the coating on the first portion is greater than the first ratio. The method is a single, commercially advantageous deposition process, enabling increased product throughput and low process tact time.
    Type: Application
    Filed: September 30, 2008
    Publication date: April 1, 2010
    Applicant: General Electric Company
    Inventors: Ahmet Gun ERLAT, George Theodore Dalakos, Min Yan, Sheila Neumann Tandon, Brian Joseph Scherer
  • Publication number: 20100079060
    Abstract: In a method for depositing a barrier coating, a device is provided comprising a first portion and a second portion where a surface of the second portion is in a shadow zone. The device is pretreated wherein the pretreating alters a deposition rate of the barrier coating on a surface exposed to the pretreating. The shadow zone is substantially unexposed to the pretreating. A barrier coating is deposited wherein the barrier coating substantially conforms to a profile of the device. The coating may be a graded-composition barrier coating wherein a composition of the coating varies substantially continuously across a thickness thereof. The first portion may include a flexible, substantially transparent substrate. The second portion may include an electronic device. The barrier coating and first portion may encapsulate the second portion. The method is a single, commercially advantageous, barrier deposition process, enabling increased product throughput and low process tact time.
    Type: Application
    Filed: September 30, 2008
    Publication date: April 1, 2010
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Ahmet Gun ERLAT, George Theodore DALAKOS, Min YAN, Sheila Neumann TANDON, Brian Joseph SCHERER
  • Publication number: 20090311444
    Abstract: Methods for improving coating or etching uniformity of non-conductive substrates in plasma-mediated processes generally include applying an electrically conductive coating to the non-conductive substrate prior to plasma processing. The electrically conductive coating is disposed in electrical communication with a metallic electrode of a plasma reactor. By disposing a conductive layer on the non-conductive substrate, a uniform electric potential is created during plasma processing can be built up on the non-conductive, which is equivalent to that of the metallic electrode upon which it is disposed during plasma processing.
    Type: Application
    Filed: June 12, 2008
    Publication date: December 17, 2009
    Applicant: General Electric Company
    Inventors: Brian Joseph Scherer, Ahmet Gun Erlat, Min Yan
  • Publication number: 20090297813
    Abstract: Methods and apparatus are disclosed relating to graded-composition barrier coatings comprising first and second materials in first and second zones. The compositions of one or both zones vary substantially continuously across a thickness of the zone in order to achieve improved properties such as barrier, flexibility, adhesion, optics, thickness and tact time. The graded-composition barrier coatings find utility in preventing exposure of devices such as organic electro-luminescent devices (OLEDs) to reactive species found in the environment.
    Type: Application
    Filed: December 1, 2008
    Publication date: December 3, 2009
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Ahmet Gun Erlat, Anil Duggal, Min Yan, Sheila Tandon, Brian Joseph Scherer
  • Publication number: 20090110892
    Abstract: Methods and apparatus are disclosed relating to graded-composition barrier coatings comprising first and second materials in first and second zones. The compositions of one or both zones vary substantially continuously across a thickness of the zone in order to achieve improved properties such as barrier, flexibility, adhesion, optics, thickness and tact time. The graded-composition barrier coatings find utility in preventing exposure of devices such as organic electro-luminescent devices (OLEDs) to reactive species found in the environment.
    Type: Application
    Filed: December 1, 2008
    Publication date: April 30, 2009
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Ahmet Gun ERLAT, Anil Duggal, Min Yan, Sheila Tandon, Brian Joseph Scherer