Abstract: Methods and systems for the fabrication of composite materials are generally described. Certain inventive methods and systems can be used to fabricate composite materials with few or no defects. According to certain embodiments, composite materials are fabricated without the use of an autoclave. In some embodiments, composite materials are fabricated in low pressure environments.

Abstract: An energy storage device for storing electrical energy, for example for use in an aircraft, includes a cathode layer with at least one ply of carbon fibers, the carbon fibers being coated with a Li-ion containing coating and embedded in an electrolytic polymer matrix material, an anode layer including at least one ply of carbon fibers, the carbon fibers being embedded in an electrolytic polymer matrix material, a separator layer including at least one ply of fibers, the fibers being embedded in an electrolytic polymer matrix material, wherein the separator layer is sandwiched between the cathode layer and the anode layer, and carbon nanotubes extending between and partly into the separator layer and the cathode layer, or the separator layer and the anode layer, or the separator layer and the cathode layer and the separator layer and the anode layer.

Abstract: The disclosure generally relates to method and apparatus for forming three-dimensional MEMS. More specifically, the disclosure relates to a method of controlling out-of-plane buckling in microstructural devices so as to create micro-structures with out-of-plane dimensions which are 1×, 5×, 10×, 100× or 500× the film's thickness or above the surface of the wafer. An exemplary device formed according to the disclosed principles, includes a three dimensional accelerometer having microbridges extending both above and below the wafer surface.

Abstract: The disclosure generally relates to method and apparatus for forming three-dimensional MEMS. More specifically, the disclosure relates to a method of controlling out-of-plane buckling in microstructural devices so as to create micro-structures with out-of-plane dimensions which are 1×, 5×, 10×, 100× or 500× the film's thickness or above the surface of the wafer. An exemplary device formed according to the disclosed principles, includes a three dimensional accelerometer having microbridges extending both above and below the wafer surface.

Abstract: The disclosure generally relates to method and apparatus for forming three-dimensional MEMS. More specifically, the disclosure relates to a method of controlling out-of-plane buckling in microstructural devices so as to create micro-structures with out-of-plane dimensions which are 1×, 5×, 10×, 100× or 500× the film's thickness or above the surface of the wafer. An exemplary device formed according to the disclosed principles, includes a three dimensional accelerometer having microbridges extending both above and below the wafer surface.

Abstract: Method for tailoring permeability of materials. The method establishes a pattern of vertically aligned nanowires on a substrate and a physical shadow mask is provided to protect selected features of the pattern. A polymer is selectively infiltrated, using chemical vapor disposition, into interstices in the vertically aligned carbon nanotubes to establish a selected permeability. A cover over the infiltrated vertically aligned nanowires is provided.

Abstract: The disclosure generally relates to method and apparatus for forming three-dimensional MEMS. More specifically, the disclosure relates to a method of controlling out-of-plane buckling in microstructural devices so as to create micro-structures with out-of-plane dimensions which are 1×, 5×, 10×, 100× or 500× the film's thickness or above the surface of the wafer. An exemplary device formed according to the disclosed principles, includes a three dimensional accelerometer having microbridges extending both above and below the wafer surface.

Abstract: The disclosure generally relates to method and apparatus for forming three-dimensional MEMS. More specifically, the disclosure relates to a method of controlling out-of-plane buckling in microstructural devices so as to create micro-structures with out-of-plane dimensions which are 1×, 5×, 10×, 100× or 500× the film's thickness or above the surface of the wafer. An exemplary device formed according to the disclosed principles, includes a three dimensional accelerometer having microbridges extending both above and below the wafer surface.

Abstract: The disclosure generally relates to method and apparatus for forming three-dimensional MEMS. More specifically, the disclosure relates to a method of controlling out-of-plane buckling in microstructural devices so as to create micro-structures with out-of-plane dimensions which are 1×, 5×, 10×, 100× or 500× the film's thickness or above the surface of the wafer. An exemplary device formed according to the disclosed principles, includes a three dimensional accelerometer having microbridges extending both above and below the wafer surface.

Abstract: A hybrid nanocomposite architecture is presented. The architecture includes a first composite ply oriented at a first orientation. The architecture also includes a carbon nanotube (CNT) film layer including a plurality of CNT pellets disposed therein, each of the CNT bundles including a plurality of CNTs extending from the bottom surface of the CNT film layer to a top surface of the CNT film layer, the CNT film layer disposed in an abutting relationship with the first composite ply. The architecture further includes a second composite ply which may be oriented at a second orientation, the second composite ply disposed in an abutting relationship with the CNT film layer, and wherein the CNTs of the CNT film layer act as a penetrating bridge across an interface between the first composite ply and the second composite ply.

Abstract: A hybrid nanocomposite architecture is presented. The architecture includes a first composite ply oriented at a first orientation. The architecture also includes a carbon nanotube (CNT) film layer including a plurality of CNT pellets disposed therein, each of the CNT bundles including a plurality of CNTs extending from the bottom surface of the CNT film layer to a top surface of the CNT film layer, the CNT film layer disposed in an abutting relationship with the first composite ply. The architecture further includes a second composite ply which may be oriented at a second orientation, the second composite ply disposed in an abutting relationship with the CNT film layer, and wherein the CNTs of the CNT film layer act as a penetrating bridge across an interface between the first composite ply and the second composite ply.