Patents by Inventor Brooks Henderson

Brooks Henderson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200111942
    Abstract: Corrosion resistant thermoelectric devices and methods of manufacturing them are disclosed herein. In some embodiments, a corrosion resistant thermoelectric device includes a semiconductor layer; a corrosion resistant top metallization layer formed on a top surface of the semiconductor layer; and a corrosion resistant bottom metallization layer formed on a bottom surface of the semiconductor layer, where the bottom surface of the semiconductor layer is opposite of the top surface of the semiconductor layer. In this way, the corrosion resistance of the device is provided by the intrinsic properties of the materials used rather than provided by the packaging or a surface coating. As such, the corrosion protection can be ensured and verified by control of the materials used to construct the device. This approach is also less susceptible to damage from shipment, handling, integration, attachment, and assembly operations because the corrosion protection is intrinsic to the materials used in construction.
    Type: Application
    Filed: March 7, 2019
    Publication date: April 9, 2020
    Inventors: Robert Therrien, Alex Guichard, Brooks Henderson, Steve Seel, Ananthakrishnan Narayanan, Pablo Cantu, Kevin Oswalt, Swathi Upadhayay, Rajesh Bikky, Jason Reed
  • Publication number: 20160343924
    Abstract: Light emitting devices include an LED that includes an n-type semiconductor layer and a p-type semiconductor layer that is stacked on top of the n-type semiconductor layer. A p-contact metallization stack is on top of the p-type semiconductor layer. An opening extends through the p-type semiconductor layer and the p-contact metallization stack that has a first region that penetrates the p-type semiconductor layer to expose the n-type semiconductor layer and a second region that penetrates the p-contact metallization stack. A bond metal stack is on top of the p-contact metallization stack, and a metal spacer layer is provided between the bond metal stack and the stacked semiconductor layers. The metal spacer layer fills the first region and at least partly fills the second region of the opening so that a lower surface of the bond metal stack is above a top surface of the p-type semiconductor layer.
    Type: Application
    Filed: May 21, 2015
    Publication date: November 24, 2016
    Inventors: Bradley Earl Williams, Christopher Brooks Henderson
  • Patent number: 4583084
    Abstract: A patient monitor includes an enclosure which is secured to the bed of a patient. The enclosure is electrically connected with a nurse's call panel and the enclosure serves to mount a jack which is electrically connected to the nurse's call panel. This jack includes a normally closed switch which is opened when a mating plug is installed in the jack. The plug is connected by a cord to the gown of the patient in the bed. When the patient attempts to leave the bed the patient's motion pulls the plug from the jack, thereby allowing the switch to close and signalling via the call panel the patient's attempt to leave the bed.
    Type: Grant
    Filed: January 27, 1984
    Date of Patent: April 15, 1986
    Assignee: Lutheran General Hospital, Inc.
    Inventors: Brooks Henderson, Kevin Treu