Abstract: A semiconductor device including an MRAM (magnetoresistive random-access memory) cell disposed above and in electrical contact with a VFET (vertical field effect transistor) access transistor.

Abstract: A bottom electrode structure for a magnetic tunnel junction (MTJ) containing device is provided. The bottom electrode structure includes a mesa portion that is laterally surrounded by a recessed region. The recessed region of the bottom electrode structure is laterally adjacent to a dielectric material, and a MTJ pillar is located on the mesa portion of the bottom electrode structure. Such a configuration shields the recessed region from impinging ions thus preventing deposition of resputtered conductive metal particles from the bottom electrode onto the MTJ pillar.

Abstract: An embedded magnetoresistive random-access memory (MRAM) device including a portion of a metal wiring layer above a semiconductor device and a bottom electrode over the portion of the metal wiring layer. The embedded MRAM where the bottom electrode connects to a first portion of a bottom surface of a magnetoresistive random access memory pillar and a sidewall spacer is on the magnetoresistive random access memory pillar. The embedded MRAM device includes a ring of inner metal is on the portion of the metal wiring layer surrounding a portion of the bottom electrode.

Abstract: A method of manufacturing a double magnetic tunnel junction device is provided. The method includes forming a first magnetic tunnel junction stack, forming a spin conducting layer on the first magnetic tunnel junction stack, forming a second magnetic tunnel junction stack on the spin conducting layer, and forming a dielectric spacer layer on surfaces of the spin conducting layer and the second magnetic tunnel junction stack. The second magnetic tunnel junction stack has a width that is less than a width of the first magnetic tunnel junction stack. Also, a width of the spin conducting layer increases in a thickness direction from a first side of the spin conducting layer adjacent to the second magnetic tunnel junction stack to a second side of the spin conducting layer adjacent to the first magnetic tunnel junction stack.

Abstract: Embodiments of the invention are directed to a method of fabricating a yoke arrangement of an inductor. A non-limiting example method includes forming a dielectric layer across from a major surface of a substrate. The method further includes configuring the dielectric layer such that it imparts a predetermined dielectric layer compressive stress on the substrate. A magnetic stack is formed on an opposite side of the dielectric layer from the substrate, wherein the magnetic stack includes one or more magnetic layers alternating with one or more insulating layers. The method further includes configuring the magnetic stack such that it imparts a predetermined magnetic stack tensile stress on the dielectric layer, wherein a net effect of the predetermined dielectric layer compressive stress and the predetermined magnetic stack tensile stress on the substrate is insufficient to cause a portion of the major surface of the substrate to be substantially non-planar.

Abstract: Embodiments are directed to a method of forming a laminated magnetic inductor and resulting structures having multiple magnetic layer thicknesses. A first magnetic stack having one or more magnetic layers alternating with one or more insulating layers is formed in a first inner region of the laminated magnetic inductor. A second magnetic stack is formed opposite a major surface of the first magnetic stack in an outer region of the laminated magnetic inductor. A third magnetic stack is formed opposite a major surface of the second magnetic stack in a second inner region of the laminated magnetic inductor. The magnetic layers are formed such that a thickness of a magnetic layer in each of the first and third magnetic stacks is less than a thickness of a magnetic layer in the second magnetic stack.

Abstract: A method of forming a vertical transport fin field effect transistor device is provided. The method includes replacing a portion of a sacrificial exclusion layer between one or more vertical fins and a substrate with a temporary inner spacer. The method further includes removing a portion of a fin layer and the sacrificial exclusion layer between the one or more vertical fins and the substrate, and forming a bottom source/drain on the temporary inner spacer and between the one or more vertical fins and the substrate. The method further includes replacing a portion of the bottom source/drain with a temporary gap filler, and replacing the temporary gap filler and temporary inner spacer with a wrap-around source/drain contact having an L-shaped cross-section.

Abstract: Embodiments of the invention include a method of using a sensor. The method includes accessing a sample and exposing the sample to the sensor. The sensor includes a sensing circuit having with a field effect transistor (FET) having a gate structure. A cavity is formed in a fill material that is over the gate structure. A probe of the sensor is within a portion of the cavity. An upper region of the probe is above a top surface of the fill material, and a lower region of the probe is below the top surface of the fill material. The probe structure includes a 3D sensing surface structure, and a liner is formed on the 3D sensing surface and configured to function as a recognition element. A portion of the liner is on the lower region of the probe and positioned between sidewalls of the cavity and the 3D sensing surface.

Abstract: A wearable monitoring system includes a first flexible substrate encapsulating a current ramping system to provide a current to an electrode in direct contact with a predetermined location of skin of a user to promote bodily fluid secretion, and a second flexible substrate placed over the predetermined location, the second flexible substrate having an integrated electrochemical sensor to determine bodily fluid concentration levels secreted through the skin.

Abstract: A sensing and treatment device includes an array of metal nanorod electrodes formed on a substrate, the array including first electrodes for sensing, and second electrodes for electrical pulsation. A data processing system is configured to monitor a parameter using the first electrodes and to activate the electrical pulsation in the second electrodes in accordance with a reading of the parameter.

Abstract: Systems and methods for operating a digital-to-analog converter (DAC) are described. In an example, a device can receive a digital input. The device can generate a clock signal having frequency in radio frequency (RF) range. The device can combine the digital input with the clock signal to generate a first voltage signal. The device can convert the first voltage signal into a second voltage signal having at least two phases. The device can convert the second voltage signal into a current signal. The device can distribute the current signal to at least one current mode DAC.

Abstract: A method of manufacturing a double magnetic tunnel junction device is provided. The method includes forming a first magnetic tunnel junction stack, forming a spin conducting layer on the first magnetic tunnel junction stack, and forming a second magnetic tunnel junction stack on the spin conducting layer. The second magnetic tunnel junction stack has a width that is greater than a width of the first magnetic tunnel junction stack.

Abstract: A sensing and treatment device includes an array of metal nanorod electrodes formed on a substrate, the array including first electrodes for sensing, and second electrodes for electrical pulsation. A data processing system is configured to monitor a parameter using the first electrodes and to activate the electrical pulsation in the second electrodes in accordance with a reading of the parameter.

Abstract: A within-chip magnetic field control device is formed in proximity to a Josephson Junction (JJ) structure. The within-chip magnetic field control device includes wiring structures that are located laterally adjacent to the JJ structure. In some embodiments, the magnetic field control device also includes, in addition to the wiring structures, a conductive plate that is connected to the wiring structures and is located beneath the JJ structure. Use of electrical current through the wiring structures induces, either directly or indirectly, a magnetic field into the JJ structure. The strength of the field can be modulated by the amount of current passing through the wiring structures. The magnetic field can be turned off as needed by ceasing to allow current to flow through the wiring structures.

Abstract: A physical vapor deposition (PVD) target that includes a body composed of material that is reactive with an oxygen containing atmosphere; and a non-reactive cap layer encapsulating at least a sputter surface of the body. The non-reactive cap layer is a barrier obstructing the diffusion of oxygen containing species to the body of the PVD target.

Abstract: Embodiments of the invention are directed to a sensor that includes a sensing circuit and a probe communicatively coupled to the sensing circuit. The probe includes a three-dimensional (3D) sensing surface coated with a recognition element and configured to, based at least in part on the 3D sensing surface interacting with a predetermined material, generate a first measurement. In some embodiments, the 3D sensing surface is shaped as a pyramid, a cone, or a cylinder to increase the sensing surface area over a two-dimensional (2D) sensing surface. In some embodiments, the 3D sensing surface facilitates penetration of the 3D sensing surface through the wall of the biological cell.

Abstract: A high input impedance magnetic balun/transformer having a phase balancing network (PBN) and method of operating. The balun is fully configurable and trimmable post fabrication using independently adjustable resistive and reactive parts by changing the resistance of a programmed transistor, e.g., NMOS. Parallel connected legs each having a field effect transistors (FETs) that make up NMOS device alter the impedance at the balun output terminals. The ground terminal of a secondary winding or coil at an unbalanced, single-ended side is connected to a phase balancing network. The phase balancing network includes at least two parallel legs, each leg having a resistive element in the form of a transistor device and at least one leg including a capacitive element. The transistor device at a leg can be operated in a linear region to trim the resistance and capacitances at the unbalanced side in order to achieve proper phase balancing and amplitude matching.

Abstract: A method of forming a vertical transport fin field effect transistor device is provided. The method includes replacing a portion of a sacrificial exclusion layer between one or more vertical fins and a substrate with a temporary inner spacer. The method further includes removing a portion of a fin layer and the sacrificial exclusion layer between the one or more vertical fins and the substrate, and forming a bottom source/drain on the temporary inner spacer and between the one or more vertical fins and the substrate. The method further includes replacing a portion of the bottom source/drain with a temporary gap filler, and replacing the temporary gap filler and temporary inner spacer with a wrap-around source/drain contact having an L-shaped cross-section.

Abstract: A wearable monitoring system includes a first flexible substrate encapsulating a current ramping system to provide a current to an electrode in direct contact with a predetermined location of skin of a user to promote bodily fluid secretion, and a second flexible substrate placed over the predetermined location, the second flexible substrate having an integrated electrochemical sensor to determine bodily fluid concentration levels secreted through the skin.

Abstract: Embodiments are directed to a method of forming a laminated magnetic inductor and resulting structures having anisotropic magnetic layers. A first magnetic stack is formed having one or more magnetic layers alternating with one or more insulating layers. A trench is formed in the first magnetic stack oriented such that an axis of the trench is perpendicular to a hard axis of the magnetic inductor. The trench is filled with a dielectric material.