Patents by Inventor Buck Gremel

Buck Gremel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11841752
    Abstract: In one embodiment, a processor includes at least one core to execute instructions, one or more thermal sensors associated with the at least one core, and a power controller coupled to the at least one core. The power controller has a control logic to receive temperature information regarding the processor and dynamically determine a maximum allowable average power limit based at least in part on the temperature information. The control logic may further maintain a static maximum base operating frequency of the processor regardless of a value of the temperature information. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: December 12, 2023
    Assignee: Intel Corporation
    Inventors: Tessil Thomas, Lokesh Sharma, Buck Gremel, Ian Steiner
  • Publication number: 20210294400
    Abstract: In one embodiment, a processor includes at least one core to execute instructions, one or more thermal sensors associated with the at least one core, and a power controller coupled to the at least one core. The power controller has a control logic to receive temperature information regarding the processor and dynamically determine a maximum allowable average power limit based at least in part on the temperature information. The control logic may further maintain a static maximum base operating frequency of the processor regardless of a value of the temperature information. Other embodiments are described and claimed.
    Type: Application
    Filed: June 3, 2021
    Publication date: September 23, 2021
    Applicant: Intel Corporation
    Inventors: Tessil Thomas, Lokesh Sharma, Buck Gremel, Ian Steiner
  • Patent number: 11079819
    Abstract: In one embodiment, a processor includes at least one core to execute instructions, one or more thermal sensors associated with the at least one core, and a power controller coupled to the at least one core. The power controller has a control logic to receive temperature information regarding the processor and dynamically determine a maximum allowable average power limit based at least in part on the temperature information. The control logic may further maintain a static maximum base operating frequency of the processor regardless of a value of the temperature information. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: August 3, 2021
    Assignee: Intel Corporation
    Inventors: Tessil Thomas, Lokesh Sharma, Buck Gremel, Ian Steiner
  • Publication number: 20190107872
    Abstract: In one embodiment, a processor includes at least one core to execute instructions, one or more thermal sensors associated with the at least one core, and a power controller coupled to the at least one core. The power controller has a control logic to receive temperature information regarding the processor and dynamically determine a maximum allowable average power limit based at least in part on the temperature information. The control logic may further maintain a static maximum base operating frequency of the processor regardless of a value of the temperature information. Other embodiments are described and claimed.
    Type: Application
    Filed: December 11, 2018
    Publication date: April 11, 2019
    Inventors: Tessil Thomas, Lokesh Sharma, Buck Gremel, Ian Steiner
  • Patent number: 7353313
    Abstract: An enhanced general input/output (EGIO) communication architecture, protocol and related methods are presented. The elements of an EGIO architecture may include one or more of a root complex (e.g., implemented within a bridge), a switch, and end-points, each incorporating at least a subset of EGIO features to support EGIO communication between such elements.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: April 1, 2008
    Assignee: Intel Corporation
    Inventors: Eric R. Wehage, Jasmin Ajanovic, David Harriman, David M. Lee, Blaise Fanning, Buck Gremel, Ken Creta, Wayne Moore
  • Publication number: 20070038793
    Abstract: An enhanced general input/output communication architecture, protocol and related methods are presented.
    Type: Application
    Filed: October 23, 2006
    Publication date: February 15, 2007
    Inventors: Eric Wehage, Jasmin Ajanovic, David Harriman, David Lee, Blaise Fanning, Buck Gremel, Ken Creta, Wayne Moore
  • Patent number: 7152128
    Abstract: An enhanced general input/output communication architecture, protocol and related methods are presented. In one embodiment, a method is described comprising receiving a datagram at general input/output (GIO) interface from a remote GIO interface coupled through a GIO link, validating content of one or more packets embedded within the received datagram, and issuing an acknowledgment to the remote GIO interface that the datagram was successfully received on positive validation of the datagram before promoting the embedded packets to a transaction layer of the GIO interface. Other embodiments are also described.
    Type: Grant
    Filed: August 23, 2002
    Date of Patent: December 19, 2006
    Assignee: Intel Corporation
    Inventors: Eric R. Wehage, Jasmin Ajanovic, David Harriman, David M. Lee, Blaise Fanning, Buck Gremel, Ken Creta, Wayne Moore
  • Publication number: 20050149658
    Abstract: According to embodiments of the present invention, indicators on a PCI/PCI-X controlled by a Standard Hot-Plug Controller (SHPC) have non-fifty percent duty cycle blinking patterns that communicate to an operator a particular command being processed, whether the command was processed successfully, whether a “hard” or “soft” error occurred if the command was processed successfully, and whether power was applied to the slot if the command was not processed successfully.
    Type: Application
    Filed: December 31, 2003
    Publication date: July 7, 2005
    Inventors: Peter Martin, Buck Gremel
  • Publication number: 20050144339
    Abstract: A receiving device in which transaction layer packets are speculatively forwarded, is disclosed. The receiving device includes a physical layer, a link layer, a transaction layer, and a core. Transaction layer packets are forwarded to the transaction layer before processing at the link layer is completed, and without the use of memory storage at the link layer. A link layer engine checks the sequence number only and not the CRC before forwarding the packet to the transaction layer. This allows the transaction layer to pre-process the packet, such as verifying header information. However, the transaction layer is unable to make the transaction globally available until the link layer has verified the CRC of the packet. The simultaneous processing of the packet by both the link layer and the transaction layer may reduce latency and lessens the amount of memory needed for processing.
    Type: Application
    Filed: December 24, 2003
    Publication date: June 30, 2005
    Inventors: Mahesh Wagh, Buck Gremel, Naveen Bohra
  • Publication number: 20030145134
    Abstract: An enhanced general input/output communication architecture, protocol and related methods are presented.
    Type: Application
    Filed: August 23, 2002
    Publication date: July 31, 2003
    Inventors: Eric R. Wehage, Jasmin Ajanovic, David Harriman, David M. Lee, Blaise Fanning, Buck Gremel, Ken Creta, Wayne Moore
  • Publication number: 20030115513
    Abstract: A point-to-point interconnection and communication architecture, protocol and related methods is presented.
    Type: Application
    Filed: September 30, 2001
    Publication date: June 19, 2003
    Inventors: David Harriman, Jasmin Ajanovic, Buck Gremel