Patents by Inventor Buck W. Gremel

Buck W. Gremel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160147280
    Abstract: In one embodiment, a processor includes at least one core to execute instructions, one or more thermal sensors associated with the at least one core, and a power controller coupled to the at least one core. The power controller has a control logic to receive temperature information regarding the processor and dynamically determine a maximum allowable average power limit based at least in part on the temperature information. The control logic may further maintain a static maximum base operating frequency of the processor regardless of a value of the temperature information. Other embodiments are described and claimed.
    Type: Application
    Filed: November 26, 2014
    Publication date: May 26, 2016
    Inventors: Tessil Thomas, Lokesh Sharma, Buck W. Gremel, Ian M. Steiner
  • Patent number: 9336175
    Abstract: Methods and apparatus relating to low-overhead utilization-aware link-width modulation to reduce power consumption in interconnects are described. In one embodiment, link width modulation logic adjusts the width of an interconnect link. More particularly, the link width modulation logic causes the interconnect link to transition from a first width to a second width based on comparison of a utilization value associated with the interconnect link against at least one of a plurality of utilization threshold values. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: June 6, 2015
    Date of Patent: May 10, 2016
    Assignee: Intel Corporation
    Inventors: Ankush Varma, Buck W. Gremel, Robert G. Blankenship, Krishnakanth V. Sistla, Michael F. Cole
  • Publication number: 20150269105
    Abstract: Methods and apparatus relating to low-overhead utilization-aware link-width modulation to reduce power consumption in interconnects are described. In one embodiment, link width modulation logic adjusts the width of an interconnect link. More particularly, the link width modulation logic causes the interconnect link to transition from a first width to a second width based on comparison of a utilization value associated with the interconnect link against at least one of a plurality of utilization threshold values. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 6, 2015
    Publication date: September 24, 2015
    Applicant: Intel Corporation
    Inventors: Ankush Varma, Buck W. Gremel, Robert G. Blankenship, Krishnakanth V. Sistla, Michael F. Cole
  • Patent number: 9053244
    Abstract: Methods and apparatus relating to low-overhead utilization-aware link-width modulation to reduce power consumption in interconnects are described. In one embodiment, a link width modulation logic adjusts the width of an interconnect link. More particularly, the link width modulation logic causes the interconnect link to transition from a first width to a second width based on comparison of a utilization value associated with the interconnect link against at least one of a plurality of utilization threshold values. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: June 9, 2015
    Assignee: Intel Corporation
    Inventors: Ankush Varma, Buck W. Gremel, Robert G. Blankenship, Krishnakanth V. Sistla, Michael F. Cole
  • Patent number: 8935578
    Abstract: An apparatus and method are disclosed to optimize the latency and the power of a link operating inside a processor-based system. The apparatus and method include a latency meter built into a queue that does not rely on a queue-depth threshold. The apparatus and method also include feedback logic that optimizes power reduction around an increasing latency target to react to sluggish re-provisioning behavior imposed by the physical properties of the link.
    Type: Grant
    Filed: September 29, 2012
    Date of Patent: January 13, 2015
    Assignee: Intel Corporation
    Inventors: James W. Alexander, Buck W. Gremel, Pinkesh J. Shah, Malay Trivedi, Mohan K. Nair
  • Publication number: 20140095944
    Abstract: An apparatus and method are disclosed to optimize the latency and the power of a link operating inside a processor-based system. The apparatus and method include a latency meter built into a queue that does not rely on a queue-depth threshold. The apparatus and method also include feedback logic that optimizes power reduction around an increasing latency target to react to sluggish re-provisioning behavior imposed by the physical properties of the link.
    Type: Application
    Filed: September 29, 2012
    Publication date: April 3, 2014
    Inventors: James W. Alexander, Buck W. Gremel, Pinkesh J. Shah, Malay Trivedi, Mohan K. Nair
  • Publication number: 20140006673
    Abstract: Methods and apparatus relating to low-overhead utilization-aware link-width modulation to reduce power consumption in interconnects are described. In one embodiment, a link width modulation logic adjusts the width of an interconnect link. More particularly, the link width modulation logic causes the interconnect link to transition from a first width to a second width based on comparison of a utilization value associated with the interconnect link against at least one of a plurality of utilization threshold values. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 2, 2014
    Inventors: Ankush Varma, Buck W. Gremel, Robert G. Blankenship, Krishnakanth V. Sistla, Michael F. Cole
  • Patent number: 7257659
    Abstract: According to embodiments of the present invention, indicators on a PCI/PCI-X controlled by a Standard Hot-Plug Controller (SHPC) have non-fifty percent duty cycle blinking patterns that communicate to an operator a particular command being processed, whether the command was processed successfully, whether a “hard” or “soft” error occurred if the command was processed successfully, and whether power was applied to the slot if the command was not processed successfully.
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: August 14, 2007
    Assignee: Intel Corporation
    Inventors: Peter N. Martin, Buck W. Gremel
  • Patent number: 5912832
    Abstract: A method and apparatus for n-bit by n-bit multiplication is disclosed using paralleled 4-bit by 4-bit multipliers and cascaded adder structures. The cascaded adder structures may be used to produce non-pipelined, integer, n-bit by n-bit multipliers with higher throughput than systolic array multipliers of similar geometries.
    Type: Grant
    Filed: September 12, 1996
    Date of Patent: June 15, 1999
    Assignee: Board of Regents, The University of Texas System
    Inventors: Michael F. Flahie, Buck W. Gremel