Patents by Inventor ByeongGu Kang

ByeongGu Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240422896
    Abstract: A disclosed circuit board includes an insulating core layer that has a first surface and a second surface opposing each other, an insulating auxiliary member of which at least a part is disposed in the insulating core layer and which has a coefficient of thermal expansion (CTE) different from that of the insulating core layer, a first substrate portion that includes a first insulating layer which is disposed on the first surface, and a first circuit wiring which is embedded in the first insulating layer, and a second substrate portion that includes a second insulating layer which is disposed on the second surface, and a second circuit wiring which is embedded in the second insulating layer.
    Type: Application
    Filed: April 18, 2024
    Publication date: December 19, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chulmun Kang, Bongbu Jung, Ho-Jae Lee, Byeonggu Kang
  • Publication number: 20240246396
    Abstract: A heat pump system for a vehicle is configured by including a valve, a first cooling apparatus, a second cooling apparatus, and a flow control line, to be configured for adjusting a temperature of a battery module by use of a single chiller where a refrigerant and a coolant are heat-exchanged, selectively recollecting waste heat of the electrical component and the battery module and using the same for heating of the vehicle interior, and forming a plurality of coolant flowing lines by a single valve according to selected mode of the vehicle.
    Type: Application
    Filed: June 13, 2023
    Publication date: July 25, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Seong-Bin JEONG, Dong Seok OH, Namho PARK, Wan Je CHO, Seung Hyun WON, Jungha PARK, ChangMin PARK, Ji Wan SON, Yeonho KIM, ByeongGu KANG, Jong Il PARK, Hyunjae LEE, JInsung PARK, Jae Yeon KIM, Yong Woong CHA
  • Publication number: 20240190211
    Abstract: An embodiment heat pump system of a vehicle includes a valve controlling a flow of a coolant, a first line having ends connected to the valve, a radiator and an electrical component on the first line, a second line having ends connected to the valve, a battery module on the second line, a first connection line including a first end connected to the valve, a chiller on the first connection line, a second connection line including ends connected to the second and first connection lines, and a third connection line including a first end connected to a second end of the first connection line and a second end connected to the first line between the radiator and the electrical component, wherein the valve operates such that the first, second, or first connection line is connected to another line or to itself depending on the selected mode.
    Type: Application
    Filed: June 7, 2023
    Publication date: June 13, 2024
    Inventors: Yong Woong Cha, Wan Je Cho, Jungha Park, Eon Soo Yun, ByeongGu Kang, Seongjae Lee, Jong Il Park, Jai Young An, Seong-Bin Jeong