Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The second internal interconnect can be coupled to the second electronic device and the first electronic device. The encapsulant can cover the substrate inner sidewall and the device stack, and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A size adjustment unit for a headwear having high decorativeness is provided. The size adjustment unit for a headwear having high decorativeness includes: a first band including a plurality of coupling protrusions; a second band including a plurality of coupling holes arranged to correspond to the coupling protrusions; a first decorative member that is attached to an outer surface of the first band; and a second decorative member that is attached to an outer surface of the second band.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The second internal interconnect can be coupled to the second electronic device and the first electronic device. The encapsulant can cover the substrate inner sidewall and the device stack, and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A golf cap having a ball marker proposed in the present invention includes: a ball marker which has a first coupling portion having one surface formed with a plurality of male members, e.g., hooks, or female members, e.g., loops, and a second coupling portion which corresponds to the first coupling portion, and has a plurality of female members when one surface of the first coupling portion has a plurality of male members, or has a plurality of male members when the one surface of the first coupling portion has a plurality of female members, so that the ball marker is attached to and detached from the second coupling portion, thereby improving convenience when carrying and using the ball marker, and improving detachable function between the ball marker and the cap in use.

Abstract: Headwear having an opening and a size adjustment device that are formed in a head receiving portion is provided, wherein the size adjustment device includes a first size adjustment unit that is disposed at a lower part of the opening and that can adjust a minute size, and a second size adjustment unit that is connected to the first size adjustment unit to adjust a size to a constant gap. Thereby, headwear that can adjust a minute size and that can satisfy various head sizes without an oppressive feeling can be provided.

Abstract: The present invention provides a headwear comprising a head receiving portion and a visor/peak, which is substantially improved in sweat absorption and evaporation performance, thereby achieving superior stain-resistant properties. A headwear according to the present invention comprises: a sweat band coupled along an inner lower edge of the crown including a sweat absorbing portion to absorb sweat and a sweat storing portion to store the sweat absorbed to the sweat absorbing portion; and a sweat evaporating portion surrounding at least a part of the visor of the headwear to evaporate moisture from the sweat stored in the sweat band by being connected with the sweat band.

Abstract: An apparatus for adorning a size control portion, formed in at least one of lower lateral sides of an opening portion of headwear according to an exemplary embodiment of the present invention includes an adorning portion having at least one face that is 3-dimensionally adorned, a support portion connected to the adorning portion to support the adorning portion, and a detachable coupling portion formed in a part of the support portion and detachably coupled to the size control portion. According to the present invention, an apparatus for freely and variously adorning a size control portion provided in a lower edge portion of a head receiving portion of headwear at low cost, and the adorning apparatus can be used in headwear.

Abstract: A size adjustment unit for a headwear having high decorativeness is provided. The size adjustment unit for a headwear having high decorativeness includes: a first band including a plurality of coupling protrusions; a second band including a plurality of coupling holes arranged to correspond to the coupling protrusions; a first decorative member that is attached to an outer surface of the first band; and a second decorative member that is attached to an outer surface of the second band.

Abstract: Headwear having an opening and a size adjustment device that are formed in a head receiving portion is provided, wherein the size adjustment device includes a first size adjustment unit that is disposed at a lower part of the opening and that can adjust a minute size, and a second size adjustment unit that is connected to the first size adjustment unit to adjust a size to a constant gap. Thereby, headwear that can adjust a minute size and that can satisfy various head sizes without an oppressive feeling can be provided.

Abstract: A sweat absorber according to an exemplary embodiment of the present invention includes a first sweat absorber extended in a head circumferential direction and a second sweat absorber partially surrounding the first sweat absorber and formed of a different material having a different strechability, and the sweat absorber is highly stretchable, provides wearing comfort, improves sweat absorbing capability, is quick drying, and has antibacterial and deodorization functions, and provides a temperature control function to maintain a constant temperature.

Abstract: Headwear having an opening and a size adjustment device that are formed in a head receiving portion is provided, wherein the size adjustment device includes a first size adjustment unit that is disposed at a lower part of the opening and that can adjust a minute size, and a second size adjustment unit that is connected to the first size adjustment unit to adjust a size to a constant gap. Thereby, headwear that can adjust a minute size and that can satisfy various head sizes without an oppressive feeling can be provided.

Abstract: A manufacturing method of a size headwear including a head covering portion put on a head and a size tape member disposed on a lower portion of the head covering portion, the head covering portion has a single circumferential length, includes forming a single set of patterns for forming a single set of pieces of the head covering portion; cutting a fabric into the single set of pieces according to the single set of patterns; sewing the cut pieces with each other and connecting the size tape member along a circumferential direction on a lower portion of the sewed pieces to form a raw size headwear; and putting a raw size headwear on a plurality of thermoforming apparatuses to thermoform a size headwear, wherein the thermoforming apparatuses have the respective different sizes. The size headwear thermoformed in this manner may be inexpensively and easily produced and maintain a predetermined stereoscopic shape due to stiffness so that it may improve an esthetic sense without doing the ironing.

Abstract: The present invention provides a headwear comprising a head receiving portion and a visor/peak, which is substantially improved in sweat absorption and evaporation performance, thereby achieving superior stain-resistant properties. A headwear according to the present invention comprises: a sweat band coupled along an inner lower edge of the crown including a sweat absorbing portion to absorb sweat and a sweat storing portion to store the sweat absorbed to the sweat absorbing portion; and a sweat evaporating portion surrounding at least a part of the visor of the headwear to evaporate moisture from the sweat stored in the sweat band by being connected with the sweat band.