Abstract: A vaporization heater for a fluid vaporization device and a method for vaporizing fluid are provided. The vaporization heater includes at least two fluid reservoirs and heating elements made of an electrically conductive material selected from the group consisting of a conductive mesh and an interwoven wire located within each of the at least two fluid reservoirs. The at least two fluid reservoirs and the heating elements therefor define a fluid volume sufficient to capture and retain a fixed volume of fluid that is ejected from an ejection head associated with a fluid supply cartridge in the fluid vaporization device. The fluid supply cartridge contains at least two different fluids. Application of electrical energy to the heating elements vaporizes the fixed volume of fluid in the at least two fluid reservoirs.

Abstract: A vaporization heater for a fluid vaporization device and a method for vaporizing fluid are provided. The vaporization heater includes at least two fluid reservoirs and heating elements made of an electrically conductive material selected from the group consisting of a conductive mesh and an interwoven wire located within each of the at least two fluid reservoirs. The at least two fluid reservoirs and the heating elements therefor define a fluid volume sufficient to capture and retain a fixed volume of fluid that is ejected from an ejection head associated with a fluid supply cartridge in the fluid vaporization device. The fluid supply cartridge contains at least two different fluids. Application of electrical energy to the heating elements vaporizes the fixed volume of fluid in the at least two fluid reservoirs.

Abstract: A heater for a vaporization device includes a fluid reservoir and a porous and permeable heating element made of an electrically conductive material and located within the reservoir. The reservoir and the heating element located within the reservoir define a fluid volume sufficient to capture and retain a fixed volume of fluid ejected from an ejection head in the vaporization device. Application of electrical energy to the heating element vaporizes the fixed volume of fluid in a fixed amount of time.

Abstract: A heater for a vaporization device includes a fluid reservoir and a porous and permeable heating element made of an electrically conductive material and located within the reservoir. The reservoir and the heating element located within the reservoir define a fluid volume sufficient to capture and retain a fixed volume of fluid ejected from an ejection head in the vaporization device. Application of electrical energy to the heating element vaporizes the fixed volume of fluid in a fixed amount of time.

Abstract: A heating element for a vaporizing device, a vaporizing device containing the heating element, and a method for vaporizing fluid ejected by an ejection head. The heating element includes a conductive material deposited onto an insulative substrate, a protective layer deposited onto the conductive layer, and a porous layer having a porosity of at least about 50% deposited onto the protective layer. The heating element has an effective surface area (ESA) for fluid vaporization that is greater than a planar surface area defined by dimensions of the heating element so that a fluid contact surface of the heating element is greater than the planar surface area of the heating element.

Abstract: A heating element for a vaporizing device, a vaporizing device containing the heating element, and a method for vaporizing fluid ejected by an ejection head. The heating element includes a conductive material deposited onto an insulative substrate, a protective layer deposited onto the conductive layer, and a porous layer having a porosity of at least about 50% deposited onto the protective layer. The heating element has an effective surface area (ESA) for fluid vaporization that is greater than a planar surface area defined by dimensions of the heating element so that a fluid contact surface of the heating element is greater than the planar surface area of the heating element.

Abstract: A heater element for a vaporizing device, a vaporizing device containing the heater element, and a method for vaporizing fluid ejected by an ejection head. The heater element includes a conductive material having a concave area. The concave area of the heater element captures and vaporizes fluid ejected from an ejection head in the vaporization device. The concave area of the heating element has a cavity volume that is at least sufficient to retain an entire volume of liquid to be vaporized.

Abstract: A heater element for a vaporizing device, a vaporizing device containing the heater element, and a method for vaporizing fluid ejected by an ejection head. The heater element includes a conductive material having a concave area. The concave area of the heater element captures and vaporizes fluid ejected from an ejection head in the vaporization device. The concave area of the heating element has a cavity volume that is at least sufficient to retain an entire volume of liquid to be vaporized.

Abstract: Micro-fluid ejection heads have anti-reflective coatings. The coatings destructively interfere with light at wavelengths of interest during subsequent photo imaging processing, such as during nozzle plate imaging. Methods include determining wavelengths of photoresists. Layers are applied to the substrate and anodized. They form an oxidized layer of a predetermined thickness and reflectivity that essentially eliminates stray and scattered light during production of nozzle plates. Process conditions include voltages, biasing, lengths of time, and bathing solutions, to name a few. Tantalum and titanium oxides define further embodiments as do layer thicknesses and light wavelengths.

Abstract: A micro-fluid ejection device structure and method therefor having improved low energy design. The devices include a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

Abstract: Micro-fluid ejection heads have anti-reflective coatings. The coatings destructively interfere with light at wavelengths of interest during subsequent photo imaging processing, such as during nozzle plate imaging. Methods include determining wavelengths of photoresists. Layers are applied to the substrate and anodized. They form an oxidized layer of a predetermined thickness and reflectivity that essentially eliminates stray and scattered light during production of nozzle plates. Process conditions include voltages, biasing, lengths of time, and bathing solutions, to name a few. Tantalum and titanium oxides define further embodiments as do layer thicknesses and light wavelengths.

Abstract: A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

Abstract: A substantially inorganic planarization layer for a micro-fluid ejection head substrate and method therefor. The planarization layer includes a plurality of layers composed of one or more dielectric compounds and at least one spin on glass (SOG) layer having a total thickness ranging from about 1 microns to about 15 microns deposited over a second metal layer of the micro-fluid ejection head substrate. A top most layer of the planarization layer is selected from one or more of the dielectric compounds and a hard mask material.

Abstract: A micro-fluid ejection device structure and method therefor having improved low energy design. The devices include a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

Abstract: A micro-fluid ejection device structure and method therefor having improved low energy design. The devices includes a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

Abstract: A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

Abstract: The present disclosure is directed to a micro-fluid ejection head for a micro-fluid ejection device. The head includes a semiconductor substrate, a fluid ejection actuator supported by the semiconductor substrate, a nozzle member containing nozzle holes attached to the substrate for expelling droplets of fluid from one or more nozzle holes in the nozzle member upon activation of the ejection actuator. The substrate further includes a thermal insulating barrier layer between the semiconductor substrate and the fluid ejection actuator. The thermal insulating barrier layer includes a porous, substantially impermeable material having a thermal conductivity of less than about 1 W/m-K.

Abstract: A micro-fluid ejection device structure and method therefor having improved low energy design. The devices includes a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

Abstract: A semiconductor substrate for a micro-fluid ejection head. The substrate includes a plurality of fluid ejection actuators disposed on the substrate. Each of the fluid ejection actuators includes a thin heater stack comprising a thin film heater and one or more protective layers adjacent the heater. The thin film heater is made of a tantalum-aluminum-nitride thin film material having a nano-crystalline structure consisting essentially of AlN, TaN, and TaAl alloys, and has a sheet resistance ranging from about 30 to about 100 ohms per square. The thin film material contains from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

Abstract: An ink jet printhead for an ink jet printer and method for making an improved printhead. The printhead includes a nozzle plate attached to a heater chip. The heater chip is a semiconductor substrate having a resistive layer deposited on the substrate, a dielectric layer deposited on the resistive layer, a cavitation layer for contact with ink, and an adhesion layer between the dielectric layer and cavitation layer. The adhesion layer is selected from the group consisting of tantalum nitride (TaN), tantalum oxide (TaO), silicon nitride (SiN), and titanium nitride (TiN), provided the adhesion layer and cavitation layer are selected so that the adhesion layer has no elemental component in common with the cavitation layer when the dielectric layer is comprised of SiC/SiN. Adhesion between the dielectric layer and cavitation layer is significantly enhanced by the invention.