Abstract: A connector structure according to an embodiment of the present disclosure includes a second connector and a first connector coupled to the second connector. The first connector includes a first insulator, a first conductive connection terminal disposed on the first insulator, a second conductive connection terminal spaced apart from the first conductive connection terminal to form a single row structure on the first insulator together with the first conductive connection terminal, and a first barrier structure disposed between the first conductive connection terminal and the second conductive connection terminal on the first insulator.

Abstract: An antenna module according to an embodiment of the present invention includes a plurality of first sensing electrode rows, a plurality of second sensing electrode columns spaced apart from the first sensing electrode rows, an insulating interlayer formed between the first sensing electrode rows and the second sensing electrode columns, and an antenna unit inserted in at least one second sensing electrode column of the second sensing electrode columns to be electrically and physically separated from the second sensing electrode columns. The antenna unit does not overlap the first sensing electrode rows in a planar view.

Abstract: An electrode connection structure includes a substrate layer, a plurality of pads on the substrate layer, and an insulation layer at least partially covering the substrate layer and the pads. The insulation layer includes a plurality of holes on the pads and at least one first groove line extending between the pads neighboring each other.

Abstract: An antenna device according to an embodiment of the present invention includes a substrate layer, an antenna unit formed on a top surface of the substrate layer, a circuit wiring disposed on the top surface of the substrate layer and directly connected to the antenna unit, a stress compensation layer covering the circuit wiring on the top surface of the substrate layer and having a thickness greater than a thickness of the substrate layer, a first dielectric layer formed on a bottom surface of the substrate layer to overlap the circuit wiring in a planar view, and a first ground layer overlapping the circuit wiring in the planar view with the first dielectric layer or the stress compensation layer interposed therebetween.

Abstract: An antenna structure according to an embodiment of the present invention includes a dielectric layer, a radiator disposed on the dielectric layer, a transmission line branching from the radiator, a signal pad electrically connected to the radiator through the transmission line on the dielectric layer, and an external circuit structure bonded to the signal pad. The signal pad includes a bonding region that is bonded to the external circuit structure and a margin region that is not bonded to the external circuit structure and is adjacent to the bonding region. An area ratio of the margin region relative to the bonding region in the signal pad is 0.05 or more and less than 0.5.

Abstract: An antenna package according to an embodiment of the present disclosure includes a first antenna device including a first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the first circuit board, a second antenna unit integrated with the second circuit board, and an antenna driving integrated circuit chip mounted on the second circuit board and electrically connected to the first antenna unit and the second antenna unit. Multi-axial radiation is implemented using the antenna package with high efficiency and reliability.

Abstract: A plate connecting assembly according to an embodiment includes a first frame, with an upper portion and a lower portion of the first frame making a predetermined angle with each other, and a second frame having a first support portion facing the upper portion and a second support portion facing the lower portion. In the plate connecting assembly, a first fixation-subject object is fixed between the upper portion and the first support portion, a second fixation-subject is fixed between the lower portion and the second support portion, and thus the first and second fixation-subject objects are fixed in such a manner that an angle therebetween is the same as an angle that the upper portion and the lower portion make with each other.

Abstract: Reducing an overlay error in nanoimprint lithography includes forming an imprinted substrate having pairs of corresponding peripheral overlay marks and corresponding central overlay marks on the imprinted substrate. An in-plane overlay error is assessed based on relative positions of corresponding central overlay marks, and a combined overlay error is assessed based on relative positions of corresponding peripheral overlay marks. A difference between the combined overlay error and the in-plane overlay error is assessed to yield an adjusted overlay error for each pair of corresponding peripheral overlay marks.

Abstract: An antenna element according to an embodiment of the present invention includes a radiation body including a contact part which is concave toward the transmission line, a transmission line disposed on a different layer from the radiation body and connected to the radiation body through the contact part, and a signal pad connected to an end of the transmission line.

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, and a first circuit board electrically connected to the antenna device. The first circuit board includes a first core layer, a first circuit wiring layer formed on one surface of the first core layer and electrically connected to the antenna unit, a first connector connected to an end portion of the first circuit wiring layer on the one surface of the first core layer, and a first shielding barrier disposed on the other surface opposite to the one surface of the first core layer. The first shielding barrier at least partially covers the first connector in a planar view.

Abstract: A touch sensor includes a substrate layer, a plurality of sensing electrodes on the substrate layer, the sensing electrodes including electrode lines therein, and dummy patterns disposed between the sensing electrodes by a pattern period corresponding to that of the electrode lines included in the sensing electrodes. Electrode visibility is reduced by the dummy patterns, and optical and electrical properties of the touch sensor are also improved.

Abstract: An antenna element according to an embodiment includes: a first radiation body disposed in a first direction; a second radiation body disposed in a second direction; a signal pad configured to supply a signal to the first radiation body and the second radiation body; a first transmission line which extends from the signal pad in the first direction to be connected to the first radiation body; and a second transmission line which extends from the signal pad in the second direction to be connected to the second radiation body.

Abstract: An antenna element according to an embodiment includes a radiation body formed in a mesh structure, a first transmission line and a second transmission line connected to the radiation body and formed in a mesh structure, and a first signal pad and a second signal pad which are respectively connected to the first transmission line and the second transmission line and are formed in a bent shape with a solid structure.

Abstract: An electrode structure combined with an antenna according to an embodiment of the present disclosure includes a substrate layer, sensing electrodes, a bridge electrode and an antenna unit. The sensing electrodes are arranged on the substrate layer, and include first sensing electrodes arranged along a first direction parallel to a top surface of the substrate layer, and second sensing electrodes arranged along a second direction parallel to the top surface of the substrate layer and intersecting the first direction. The bridge electrode connects the first sensing electrodes neighboring in the first direction. The antenna unit is disposed at the same layer as that of the bridge electrode, and includes a radiator overlapping the sensing electrodes in a planar view.

Abstract: An antenna package according to an exemplary embodiment of the present invention includes a first antenna device which includes a first antenna unit including a first radiator, a second antenna device which includes a second antenna unit including a second radiator whose polarization direction is perpendicular to the first radiator, a first circuit board electrically connected with the first antenna unit, a second circuit board electrically connected with the second antenna unit, and a third circuit board on which at least one antenna driving integrated circuit (IC) chip electrically and independently connected to the first circuit board and the second circuit board is mounted. By supplying power to two antenna devices having different polarization directions, respectively, signal interference and signal loss may be prevented, and dual polarization may be implemented.

Abstract: A touch sensing electrode structure includes sensing electrodes, each of which including a plurality of unit patterns, and traces electrically connected to the sensing electrodes. The traces include at least two trace lines and trace bridges connecting the at least two trace lines to each other. An electrode visibility due to a pattern deviation is reduced and a reliability of the trace is improved by the trace bridge.

Abstract: A chuck assembly for holding a plate comprises a member configured to hold the plate, the member including a flexible portion configured to have a central opening, and a first cavity formed by the flexible portion, wherein the plate is held by the flexible portion by reducing pressure in the first cavity, a light-transmitting member covering the central opening of the member, and a fluid path in communication with a second cavity defined by the member, the plate held by the member and the light-transmitting member for pressurizing the second cavity.

Abstract: A high performance touch sensor according to the present invention comprises: a substrate; a first detection electrode formed on the substrate; an insulation layer formed on the first detection electrode; a second detection electrode formed on the insulation layer; and a protection layer formed on the second detection electrode, wherein one of the first detection electrode and the second detection electrode has a triple-film structure including a metal oxide and a thin film metal laminated on each other, and the other one includes a metal pattern. Therefore, the present invention can implement touch sensor having a high resolution and a large area while simultaneously satisfying a low resistance characteristic and an optical characteristic, facilitate progress of a high-temperature process, and diversify the substrate.

Abstract: A system and method of imprinting a formable material on a substrate includes a feature with a template. The substrate is initially held with a first back pressure. After which the template is brought into contact with the formable material. A template strain tensor above the feature may be greater than a strain threshold. The substrate is then held with a second back pressure less than the first back pressure, after which the substrate strain below the feature increases. After which the formable material is solidified.

Abstract: A touch sensor includes a substrate layer, a plurality of sensing electrodes on the substrate layer, and a dummy line between the sensing electrodes, the dummy line extending along a boundary of the sensing electrode. Electrode visibility is reduced by the dummy line, and touch sensitivity of the touch sensor is also improved.