Patents by Inventor C. K. Lau

C. K. Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6391720
    Abstract: A method for forming a self-aligned, recessed channel, MOSFET device that alleviates the problems due to short channel and hot carrier effects while reducing inter-electrode capacitance is described. A substrate with an active area encompassed by a shallow trench isolation (STI) region is provided. A mask oxide layer is then patterned and etched to expose the substrate and a portion of the STI region. The surface is etched and the mask oxide layer is eroded away while creating a gate recess in the unmasked area. A thin pad oxide layer is then grown overlying the surface followed by a deposition of a thick silicon nitride layer covering the surface and filling the gate recess. The top surface is planarized exposing the pad oxide layer. An additional oxide layer is grown causing the pad oxide layer to thicken. A portion of the silicon nitride layer is etched away and additional oxide layer is again grown causing the pad oxide layer to further thicken.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: May 21, 2002
    Assignees: Chartered Semiconductor Manufacturing Ltd., National University of Singapore
    Inventors: Sneedharan Pillai Sneelal, Francis Youg Wee Poh, James Yong Meng Lee, Alex See, C. K. Lau, Ganesh Shankar Samudra
  • Patent number: 6201283
    Abstract: A field effect transistor with a double sided airbridge comprises a substrate containing a conductive region and source, drain and gate electrodes disposed on the substrate. The gate electrode has a finger portion with a first end secured to the substrate between the source and drain electrodes and a second end, and a double sided airbridge portion flaring outwardly from the second end and having opposed first and second extremities. A first gate pad is disposed on said substrate outwardly from the source electrode and is connected to the first extremity. A second gate pad is disposed on said substrate outwardly from the drain electrodes and is connected to the second extremity. The gate pads serve to support the airbridge gate finger so as to reduce stress on the gate finger. The first and second gate pads receive and transmit signals through the airbridge and to and from the gate finger.
    Type: Grant
    Filed: September 8, 1999
    Date of Patent: March 13, 2001
    Assignee: TRW Inc.
    Inventors: Richard Lai, Yaochung Chen, Huan-Chun Yen, James C. K. Lau
  • Patent number: 5823554
    Abstract: A folding, pedal-driven vehicle having a universal joint transmission system is provided. A human-powered ground vehicle having a motive power input assembly that includes foot pedals to drive a front-wheel of the vehicle through a universal joint drive gear system is also provided. Folding, recumbent vehicles for one or two riders are also provided and each includes a transmission system having a pedal-drive power input assembly pivotally connected to a universal joint which in turn is pivotally connected to a drive connection for driving a front wheel of the vehicle.
    Type: Grant
    Filed: December 13, 1995
    Date of Patent: October 20, 1998
    Inventor: James C. K. Lau
  • Patent number: 5486015
    Abstract: This invention discloses a front wheel steering, front wheel drive, light weight, foldable, ground transportation vehicle. The disclosed vehicle is constructed for convenient manual transformation between a deployed operating configuration, for transporting one or more passengers, and a compactly folded position, for facilitating toting the vehicle about as well as stowing it away. Two-wheel and three-wheel versions of the vehicle are set forth. Both such embodiments can utilize basically the same drive and steering constructions.
    Type: Grant
    Filed: April 13, 1994
    Date of Patent: January 23, 1996
    Inventor: James C. K. Lau
  • Patent number: 5479109
    Abstract: An electrical testing device is provided for testing integrated circuits located on a wafer. The testing device employs a multi-layer test circuit having a plurality of contacts for contacting the integrated circuits on a wafer. The layers of the test circuit are embedded in a flexible transparent dielectric material which allows vertical flexing of the contacts and visual transparency through the circuit. Alignment markers are provided on the circuit and wafer and one or more viewing tubes may be used to allow a user to view the alignment markers so as to bring the circuit into proper alignment with the wafer. A microscope may further be employed with each viewing tube to provide accurate alignment examination. A stretching fixture is mounted on the circuit which enables a user to stretch the circuit to achieve a larger size when necessary.
    Type: Grant
    Filed: January 28, 1994
    Date of Patent: December 26, 1995
    Assignee: TRW Inc.
    Inventors: James C. K. Lau, Richard P. Malmgren, Kenneth Lui
  • Patent number: 5430257
    Abstract: An apparatus for mounting a waveguide window or conduction member into a housing such that a smooth gradient of the coefficient of thermal expansion exists between the housing and the window or conduction member, thereby reducing the internal stress which results from ambient temperature variations. The apparatus comprises a frame member for mounting a feedthrough member into a housing. The frame member includes a buffer section having a plurality of sections, each section having a material which progressively varies the coefficient of thermal expansion. The frame member further includes additional stress relief features and structural elements facilitating manufacture and assembly of the apparatus.
    Type: Grant
    Filed: August 12, 1992
    Date of Patent: July 4, 1995
    Assignee: TRW Inc.
    Inventors: James C.-K. Lau, Kenneth Lui, James A. Hathaway, Ronald A. DePace
  • Patent number: 5376226
    Abstract: A connector is disclosed for electrically coupling groups of contact points formed on a first and second electronic circuit chip. The connector is constructed by applying a layer of dielectric material to a planar electrically conductive base, lithographically printing a pattern onto the dielectric material, etching the pattern and creating a plurality of wells extending through the dielectric material and a matching plurality of cavities in the surface of the base, and electroplating the pattern and filling the wells with an electrically conductive electroplate material. The electroplate thereby forms a plurality of conductive members, each extending through the dielectric material. The base is then removed from the dielectric material, thereby forming a connector board having the conductive members extending therethrough for electrically coupling the first and second groups of contact points on the circuit chips.
    Type: Grant
    Filed: January 28, 1993
    Date of Patent: December 27, 1994
    Assignee: TRW Inc.
    Inventors: James C. K. Lau, Richard P. Malmgren, Ronald A. DePace