Abstract: An electrostatic discharge (ESD) structure for use in an integrated circuit (IC). The ESD structure comprises a metallic resistor and a metallic capacitor that are electrically coupled in series to form a resistor-capacitor (RC) component having an appropriate RC time constant. The RC component maintains a level of charge between ground and a shunt node to ensure that, during an ESD event, electrostatic charge on a power supply, VDD, associated with the ESD structure is shunted via a shunt path from said power supply VDD to said ground. By using metal to create the metal resistor and capacitor, charge leakage problems that result from parasitic capacitance associated with using an RC component comprised of either a poly, active, or nwell resistor in combination a diode are eliminated. By eliminating such charge leakage problems, a more reliable RC component, and thus a more reliable RC time constant, are obtained.

Abstract: An electrostatic discharge (ESD) structure for use in an integrated circuit (IC). The ESD structure comprises a metallic resistor and a metallic capacitor that are electrically coupled in series to form a resistor-capacitor (RC) component having an appropriate RC time constant. The RC component maintains a level of charge between ground and a shunt node to ensure that, during an ESD event, electrostatic charge on a power supply, VDD, associated with the ESD structure is shunted via a shunt path from said power supply VDD to said ground. By using metal to create the metal resistor and capacitor, charge leakage problems that result from parasitic capacitance associated with using an RC component comprised of either a poly, active, or nwell resistor in combination a diode are eliminated. By eliminating such charge leakage problems, a more reliable RC component, and thus a more reliable RC time constant, are obtained.

Abstract: A method for increasing the layer density uniformity across a conductive layer, which comprises a plurality of functional blocks, of an integrated circuit is presented. Increased uniformity is achieved by tiling a plurality of capacitors in between the functional blocks. The configuration of the capacitor array and number of the capacitor cells in the array is arranged so as to provide approximate uniformity in the conductor-to-non-conductor density across the entire conductive layer. The capacitor array may be used to reduce power supply switching noise by coupling one or more of the capacitor cells making up the capacitor array between a high power rail and a low power rail.