Patents by Inventor Calin Miclaus

Calin Miclaus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10964613
    Abstract: A device includes a die comprising a sensor. The device also includes a substrate that is coupled to the die via the electrical coupling. The device further includes a packaging container. The packaging container and the substrate form a housing for the die. The packaging container comprises an opening that exposes at least a portion of the die to an environment external to the housing. The exposed surfaces of the die, interior of the housing, the electrical coupling, and the substrate to the environment external to the housing through the opening are coated with a conformal film. The conformal film prevents liquid, e.g., water, gas, etc., contact to the exposed surfaces of the die, the electrical coupling and the substrate.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: March 30, 2021
    Assignee: InvenSense, Inc.
    Inventor: Calin Miclaus
  • Patent number: 10893628
    Abstract: A circuit board cooling system comprises a cooling unit comprising fans, pressures sensors that measure air pressure at their locations, and a sensor processing unit coupled with the pressure sensors. The cooling unit operates according to an operating configuration and generates air flow to cool a portion of a circuit board. The pressure sensors comprise a first pressure sensor located between the portion of the circuit board and the cooling unit; and a second pressure sensor located such that the portion of the circuit board is between the second pressure sensor and the cooling unit. A sensor processing unit is configured to: obtain the air pressure data measured by the plurality of pressure sensors; and adjust the operating configuration of the cooling unit based on a cooling specification and a comparison of the obtained air pressure data measured by the first pressure sensor and the second pressure sensor.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: January 12, 2021
    Assignee: InvenSense, Inc.
    Inventors: Sankalp Dayal, Vamshi Gangumalla, Zaryab Hamavand, Calin Miclaus
  • Publication number: 20200087142
    Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
    Type: Application
    Filed: September 17, 2019
    Publication date: March 19, 2020
    Applicant: InvenSense, Inc.
    Inventors: Pei-Wen Yen, Ting-Yuan Liu, Jye Ren, Chung-Hsien Lin, Joseph Seeger, Calin Miclaus
  • Patent number: 10593176
    Abstract: A security system for a building comprises a pressure sensor and a computer system communicatively coupled with the pressure system. The pressure sensor coupled to a movable portion of a window in the building. The computer system is configured to: receive a first pressure measurement from the pressure sensor; compare the first pressure measurement to a reference pressure measurement; and based on the comparison, detect that the movable portion of the window has moved.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: March 17, 2020
    Assignee: InvenSense, Inc.
    Inventors: Vamshi Gangumalla, Sankalp Dayal, Calin Miclaus, Karthik Katingari, Rob Dick, Paul Schreier
  • Publication number: 20200033217
    Abstract: A device includes a sensor die, an electrical coupling, a substrate, a liquid detection unit, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The liquid detection unit electrically is coupled to the sensor die. The housing unit and the substrate are configured to house the sensor die, the liquid detection unit, and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The liquid detection unit detects presence of liquid within an interior environment of the housing unit. In some embodiments, the device further includes a gel filled within the interior environment of the housing unit covering the sensor die and the substrate. The gel, e.g., silicone, fluoro silicone, etc., is configured to protect the sensor die, the electrical coupling, and the substrate from exposure to the liquid.
    Type: Application
    Filed: July 22, 2019
    Publication date: January 30, 2020
    Inventors: Calin MICLAUS, Chung-Hsien LIN, Jye REN, Tim PIESSENS, Pei-Wen YEN, Manish SHARMA-KULAMARVA
  • Publication number: 20200031661
    Abstract: A device includes a sensor die, an electrical coupling, a substrate, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The housing unit and the substrate are configured to house the sensor die and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The housing unit may include a drainage configured to drain liquid, e.g., water, oil, etc., out from an interior environment of the housing unit to the environment external to the housing unit. In some embodiments the housing unit comprises a membrane barrier exposing the sensor die to an environment external to the housing unit while preventing liquid from the environment external to enter an interior environment of the housing unit. It is appreciated that in some embodiments, the membrane barrier may be porous and may be ePTFE.
    Type: Application
    Filed: July 23, 2019
    Publication date: January 30, 2020
    Inventors: Calin MICLAUS, Matthias SCHMIDT, Vijay WAKHARKAR, Milena VUJOSEVIC, Manish SHARMA-KULAMARVA
  • Publication number: 20190345024
    Abstract: A sensor includes a substrate, an electrode, a deformable membrane, and a compensating structure. The substrate includes a first side and a second side. The first side is opposite to the second side. The substrate comprises a cavity on the first side. The electrode is positioned at a bottom of the cavity on the first side of the substrate. The deformable membrane is positioned on the first side of the substrate. The deformable membrane encloses the cavity and deforms responsive to external stimuli. The compensation structure is connected to outer periphery of the deformable membrane. The compensation structure creates a bending force that is opposite to a bending force of the deformable membrane responsive to temperature changes and thermal coefficient mismatch.
    Type: Application
    Filed: August 22, 2018
    Publication date: November 14, 2019
    Inventors: Chung-Hsien LIN, Joseph SEEGER, Calin MICLAUS, Tsung Lin TANG, Pei-Wen YEN
  • Publication number: 20190311961
    Abstract: A device includes a die comprising a sensor. The device also includes a substrate that is coupled to the die via the electrical coupling. The device further includes a packaging container. The packaging container and the substrate form a housing for the die. The packaging container comprises an opening that exposes at least a portion of the die to an environment external to the housing. The exposed surfaces of the die, interior of the housing, the electrical coupling, and the substrate to the environment external to the housing through the opening are coated with a conformal film. The conformal film prevents liquid, e.g., water, gas, etc., contact to the exposed surfaces of the die, the electrical coupling and the substrate.
    Type: Application
    Filed: April 8, 2019
    Publication date: October 10, 2019
    Inventor: Calin MICLAUS
  • Publication number: 20190150316
    Abstract: A circuit board cooling system comprises a cooling unit comprising fans, pressures sensors that measure air pressure at their locations, and a sensor processing unit coupled with the pressure sensors. The cooling unit operates according to an operating configuration and generates air flow to cool a portion of a circuit board. The pressure sensors comprise a first pressure sensor located between the portion of the circuit board and the cooling unit; and a second pressure sensor located such that the portion of the circuit board is between the second pressure sensor and the cooling unit. A sensor processing unit is configured to: obtain the air pressure data measured by the plurality of pressure sensors; and adjust the operating configuration of the cooling unit based on a cooling specification and a comparison of the obtained air pressure data measured by the first pressure sensor and the second pressure sensor.
    Type: Application
    Filed: January 11, 2019
    Publication date: May 16, 2019
    Applicant: InvenSense, Inc.
    Inventors: Sankalp DAYAL, Vamshi GANGUMALLA, Zaryab HAMAVAND, Calin MICLAUS
  • Publication number: 20190124795
    Abstract: A circuit board cooling system comprises a circuit board, a processor disposed on the circuit board, a cooling unit operating according to an operating configuration to generate air flow to cool a portion of the circuit board, a plurality of pressure sensors configured to measure air pressure data at their respective locations, and a sensor processing unit coupled with the plurality of pressure sensors. The plurality of pressure sensors comprises a first pressure sensor located between the processor and the cooling unit and a second pressure sensor located such that the processor is between the second pressure sensor and the cooling unit. The sensor processing unit: obtains the air pressure data measured by the plurality of pressure sensors; compares the obtained air pressure data to reference air pressure data for the operating configuration; and based on the comparison, determines that a disturbance to the air flow exists.
    Type: Application
    Filed: August 17, 2018
    Publication date: April 25, 2019
    Applicant: InvenSense, Inc.
    Inventors: Sankalp DAYAL, Vamshi GANGUMALLA, Zaryab HAMAVAND, Calin MICLAUS
  • Publication number: 20190088098
    Abstract: A security system for a building comprises a pressure sensor and a computer system communicatively coupled with the pressure system. The pressure sensor coupled to a movable portion of a window in the building. The computer system is configured to: receive a first pressure measurement from the pressure sensor; compare the first pressure measurement to a reference pressure measurement; and based on the comparison, detect that the movable portion of the window has moved.
    Type: Application
    Filed: November 14, 2018
    Publication date: March 21, 2019
    Applicant: InvenSense, Inc.
    Inventors: Vamshi GANGUMALLA, Sankalp DAYAL, Calin MICLAUS, Karthik KATINGARI, Rob DICK, Paul SCHREIER
  • Patent number: 8196475
    Abstract: Described herein is a method for integrating MEMS with submicron semiconductor electrical circuits such as CMOS to provide more complex signal processing, on-chip calibration and integration with RF technologies. A MEMS sensor is provided having an upper layer, an insulating layer into which a cavity has been formed and a handle layer. The upper layer acts as both the substrate of the semiconductor electrical circuit and as the active MEMS element. The remainder of the circuitry is fabricated either in or on the upper layer. In a preferred method of the present invention a first wafer assembly and a second wafer assembly are fabricated such that a MEMS sensor and the substrate of at least one semiconductive electrical circuit is formed.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: June 12, 2012
    Assignee: Kavlico Corporation
    Inventors: Peter Seesink, Horst Obermeier, Omar Abed, Dan Rodriguez, Robert Hunter, Calin Miclaus
  • Publication number: 20100229651
    Abstract: Described herein is a method for integrating MEMS with submicron semiconductor electrical circuits such as CMOS to provide more complex signal processing, on-chip calibration and integration with RF technologies. A MEMS sensor is provided having an upper layer, an insulating layer into which a cavity has been formed and a handle layer. The upper layer acts as both the substrate of the semiconductor electrical circuit and as the active MEMS element. The remainder of the circuitry is fabricated either in or on the upper layer. In a preferred method of the present invention a first wafer assembly and a second wafer assembly are fabricated such that a MEMS sensor and the substrate of at least one semiconductive electrical circuit is formed.
    Type: Application
    Filed: March 16, 2009
    Publication date: September 16, 2010
    Applicant: KAVLICO CORPORATION
    Inventors: Peter Seesink, Horst Obermeier, Omar Abed, Dan Rodriguez, Robert Hunter, Calin Miclaus
  • Patent number: 7515039
    Abstract: A method for monitoring pressure is described herein. The method includes the steps of performing an accurate measurement of pressure and performing an approximate measurement of pressure. Then, providing a notification signal if a difference between the approximate measurement and the accurate measurement is greater than a predetermined value. An apparatus for performing the method is also disclosed.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: April 7, 2009
    Assignee: Kavlico Corporation
    Inventors: Gary Casey, Calin Miclaus
  • Publication number: 20070279201
    Abstract: A method for monitoring pressure is described herein. The method includes the steps of performing an accurate measurement of pressure and performing an approximate measurement of pressure. Then, providing a notification signal if a difference between the approximate measurement and the accurate measurement is greater than a predetermined value. An apparatus for performing the method is also disclosed.
    Type: Application
    Filed: June 5, 2006
    Publication date: December 6, 2007
    Applicant: Kavlico Corporation
    Inventors: Gary Casey, Calin Miclaus