Patents by Inventor Calin Miclaus
Calin Miclaus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11768122Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.Type: GrantFiled: October 12, 2022Date of Patent: September 26, 2023Assignee: InvenSense, Inc.Inventors: Calin Miclaus, Chung-Hsien Lin, Jye Ren, Tim Piessens, Pei-Wen Yen, Manish Sharma-Kulamarva
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Publication number: 20230089813Abstract: A method includes depositing a passivation layer on a substrate; depositing and patterning a first polysilicon layer on the passivation layer; depositing and patterning a first oxide layer on the first polysilicon layer forming a patterned first oxide layer; depositing and patterning a second polysilicon layer on the patterned first oxide layer. A portion of the second polysilicon layer directly contacts a portion of the first polysilicon layer. A portion of the patterned second polysilicon layer corresponds to a bottom electrode. A second oxide layer is deposited on the patterned second polysilicon layer and on an exposed portion of the patterned first oxide layer. A portion of the second oxide layer corresponding to a sensing cavity is etched, exposing the bottom electrode. Another substrate is bonded to the second oxide layer enclosing the sensing cavity. A top electrode is disposed within the another substrate and positioned over the bottom electrode.Type: ApplicationFiled: September 21, 2022Publication date: March 23, 2023Inventors: Weng Shen Su, Chung-Hsien Lin, Yaoching Wang, Tsung Lin Tang, Ting-Yuan Liu, Calin Miclaus
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Publication number: 20230035487Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.Type: ApplicationFiled: October 12, 2022Publication date: February 2, 2023Inventors: Calin Miclaus, Chung-Hsien Lin, Jye Ren, Tim Piessens, Pei-Wen Yen, Manish Sharma-Kulamarva
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Publication number: 20230030211Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires forming electrodes, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit by measuring a capacitance between the electrodes and by detecting a change between the measured capacitance and a capacitance between the electrodes in absence of moisture.Type: ApplicationFiled: October 12, 2022Publication date: February 2, 2023Inventors: Calin Miclaus, Chung-Hsien Lin, Jye Ren, Tim Piessens, Pei-Wen Yen, Manish Sharma-Kulamarva
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Patent number: 11499884Abstract: A device includes a sensor die, an electrical coupling, a substrate, a liquid detection unit, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The liquid detection unit electrically is coupled to the sensor die. The housing unit and the substrate are configured to house the sensor die, the liquid detection unit, and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The liquid detection unit detects presence of liquid within an interior environment of the housing unit. In some embodiments, the device further includes a gel filled within the interior environment of the housing unit covering the sensor die and the substrate. The gel, e.g., silicone, fluoro silicone, etc., is configured to protect the sensor die, the electrical coupling, and the substrate from exposure to the liquid.Type: GrantFiled: July 22, 2019Date of Patent: November 15, 2022Assignee: InvenSense, Inc.Inventors: Calin Miclaus, Chung-Hsien Lin, Jye Ren, Tim Piessens, Pei-Wen Yen, Manish Sharma-Kulamarva
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Publication number: 20220098030Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.Type: ApplicationFiled: December 13, 2021Publication date: March 31, 2022Inventors: Pei-Wen Yen, Ting-Yuan Liu, Jye Ren, Chung-Hsien Lin, Joseph Seeger, Calin Miclaus
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Patent number: 11225409Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.Type: GrantFiled: September 17, 2019Date of Patent: January 18, 2022Assignee: InvenSense, Inc.Inventors: Pei-Wen Yen, Ting-Yuan Liu, Jye Ren, Chung-Hsien Lin, Joseph Seeger, Calin Miclaus
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Patent number: 11027967Abstract: A sensor includes a substrate, an electrode, a deformable membrane, and a compensating structure. The substrate includes a first side and a second side. The first side is opposite to the second side. The substrate comprises a cavity on the first side. The electrode is positioned at a bottom of the cavity on the first side of the substrate. The deformable membrane is positioned on the first side of the substrate. The deformable membrane encloses the cavity and deforms responsive to external stimuli. The compensation structure is connected to outer periphery of the deformable membrane. The compensation structure creates a bending force that is opposite to a bending force of the deformable membrane responsive to temperature changes and thermal coefficient mismatch.Type: GrantFiled: August 22, 2018Date of Patent: June 8, 2021Assignee: InvenSense, Inc.Inventors: Chung-Hsien Lin, Joseph Seeger, Calin Miclaus, Tsung Lin Tang, Pei-Wen Yen
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Patent number: 11006550Abstract: A circuit board cooling system includes a circuit board with a processor disposed thereon, a cooling unit operating according to an operating configuration to generate air flow to cool a portion of the circuit board, and a plurality of pressure sensors that are coupled with a sensor processing unit and configured to measure air pressure data at their respective locations. The pressure sensors include a first pressure sensor located between the processor and the cooling unit and a second pressure sensor located such that the processor is between the second pressure sensor and the cooling unit. Air pressure data measured by the plurality of pressure sensors is obtained by the sensor processing unit. The sensor processing unit compares the obtained air pressure data to reference air pressure data for the operating configuration and, based on the comparison, determines that a disturbance to the air flow exists.Type: GrantFiled: August 17, 2018Date of Patent: May 11, 2021Assignee: InvenSense, Inc.Inventors: Sankalp Dayal, Vamshi Gangumalla, Zaryab Hamavand, Calin Miclaus
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Patent number: 10964613Abstract: A device includes a die comprising a sensor. The device also includes a substrate that is coupled to the die via the electrical coupling. The device further includes a packaging container. The packaging container and the substrate form a housing for the die. The packaging container comprises an opening that exposes at least a portion of the die to an environment external to the housing. The exposed surfaces of the die, interior of the housing, the electrical coupling, and the substrate to the environment external to the housing through the opening are coated with a conformal film. The conformal film prevents liquid, e.g., water, gas, etc., contact to the exposed surfaces of the die, the electrical coupling and the substrate.Type: GrantFiled: April 8, 2019Date of Patent: March 30, 2021Assignee: InvenSense, Inc.Inventor: Calin Miclaus
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Patent number: 10893628Abstract: A circuit board cooling system comprises a cooling unit comprising fans, pressures sensors that measure air pressure at their locations, and a sensor processing unit coupled with the pressure sensors. The cooling unit operates according to an operating configuration and generates air flow to cool a portion of a circuit board. The pressure sensors comprise a first pressure sensor located between the portion of the circuit board and the cooling unit; and a second pressure sensor located such that the portion of the circuit board is between the second pressure sensor and the cooling unit. A sensor processing unit is configured to: obtain the air pressure data measured by the plurality of pressure sensors; and adjust the operating configuration of the cooling unit based on a cooling specification and a comparison of the obtained air pressure data measured by the first pressure sensor and the second pressure sensor.Type: GrantFiled: January 11, 2019Date of Patent: January 12, 2021Assignee: InvenSense, Inc.Inventors: Sankalp Dayal, Vamshi Gangumalla, Zaryab Hamavand, Calin Miclaus
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Publication number: 20200087142Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.Type: ApplicationFiled: September 17, 2019Publication date: March 19, 2020Applicant: InvenSense, Inc.Inventors: Pei-Wen Yen, Ting-Yuan Liu, Jye Ren, Chung-Hsien Lin, Joseph Seeger, Calin Miclaus
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Patent number: 10593176Abstract: A security system for a building comprises a pressure sensor and a computer system communicatively coupled with the pressure system. The pressure sensor coupled to a movable portion of a window in the building. The computer system is configured to: receive a first pressure measurement from the pressure sensor; compare the first pressure measurement to a reference pressure measurement; and based on the comparison, detect that the movable portion of the window has moved.Type: GrantFiled: November 14, 2018Date of Patent: March 17, 2020Assignee: InvenSense, Inc.Inventors: Vamshi Gangumalla, Sankalp Dayal, Calin Miclaus, Karthik Katingari, Rob Dick, Paul Schreier
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Publication number: 20200033217Abstract: A device includes a sensor die, an electrical coupling, a substrate, a liquid detection unit, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The liquid detection unit electrically is coupled to the sensor die. The housing unit and the substrate are configured to house the sensor die, the liquid detection unit, and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The liquid detection unit detects presence of liquid within an interior environment of the housing unit. In some embodiments, the device further includes a gel filled within the interior environment of the housing unit covering the sensor die and the substrate. The gel, e.g., silicone, fluoro silicone, etc., is configured to protect the sensor die, the electrical coupling, and the substrate from exposure to the liquid.Type: ApplicationFiled: July 22, 2019Publication date: January 30, 2020Inventors: Calin MICLAUS, Chung-Hsien LIN, Jye REN, Tim PIESSENS, Pei-Wen YEN, Manish SHARMA-KULAMARVA
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Publication number: 20200031661Abstract: A device includes a sensor die, an electrical coupling, a substrate, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The housing unit and the substrate are configured to house the sensor die and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The housing unit may include a drainage configured to drain liquid, e.g., water, oil, etc., out from an interior environment of the housing unit to the environment external to the housing unit. In some embodiments the housing unit comprises a membrane barrier exposing the sensor die to an environment external to the housing unit while preventing liquid from the environment external to enter an interior environment of the housing unit. It is appreciated that in some embodiments, the membrane barrier may be porous and may be ePTFE.Type: ApplicationFiled: July 23, 2019Publication date: January 30, 2020Inventors: Calin MICLAUS, Matthias SCHMIDT, Vijay WAKHARKAR, Milena VUJOSEVIC, Manish SHARMA-KULAMARVA
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Publication number: 20190345024Abstract: A sensor includes a substrate, an electrode, a deformable membrane, and a compensating structure. The substrate includes a first side and a second side. The first side is opposite to the second side. The substrate comprises a cavity on the first side. The electrode is positioned at a bottom of the cavity on the first side of the substrate. The deformable membrane is positioned on the first side of the substrate. The deformable membrane encloses the cavity and deforms responsive to external stimuli. The compensation structure is connected to outer periphery of the deformable membrane. The compensation structure creates a bending force that is opposite to a bending force of the deformable membrane responsive to temperature changes and thermal coefficient mismatch.Type: ApplicationFiled: August 22, 2018Publication date: November 14, 2019Inventors: Chung-Hsien LIN, Joseph SEEGER, Calin MICLAUS, Tsung Lin TANG, Pei-Wen YEN
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Publication number: 20190311961Abstract: A device includes a die comprising a sensor. The device also includes a substrate that is coupled to the die via the electrical coupling. The device further includes a packaging container. The packaging container and the substrate form a housing for the die. The packaging container comprises an opening that exposes at least a portion of the die to an environment external to the housing. The exposed surfaces of the die, interior of the housing, the electrical coupling, and the substrate to the environment external to the housing through the opening are coated with a conformal film. The conformal film prevents liquid, e.g., water, gas, etc., contact to the exposed surfaces of the die, the electrical coupling and the substrate.Type: ApplicationFiled: April 8, 2019Publication date: October 10, 2019Inventor: Calin MICLAUS
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Publication number: 20190150316Abstract: A circuit board cooling system comprises a cooling unit comprising fans, pressures sensors that measure air pressure at their locations, and a sensor processing unit coupled with the pressure sensors. The cooling unit operates according to an operating configuration and generates air flow to cool a portion of a circuit board. The pressure sensors comprise a first pressure sensor located between the portion of the circuit board and the cooling unit; and a second pressure sensor located such that the portion of the circuit board is between the second pressure sensor and the cooling unit. A sensor processing unit is configured to: obtain the air pressure data measured by the plurality of pressure sensors; and adjust the operating configuration of the cooling unit based on a cooling specification and a comparison of the obtained air pressure data measured by the first pressure sensor and the second pressure sensor.Type: ApplicationFiled: January 11, 2019Publication date: May 16, 2019Applicant: InvenSense, Inc.Inventors: Sankalp DAYAL, Vamshi GANGUMALLA, Zaryab HAMAVAND, Calin MICLAUS
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Publication number: 20190124795Abstract: A circuit board cooling system comprises a circuit board, a processor disposed on the circuit board, a cooling unit operating according to an operating configuration to generate air flow to cool a portion of the circuit board, a plurality of pressure sensors configured to measure air pressure data at their respective locations, and a sensor processing unit coupled with the plurality of pressure sensors. The plurality of pressure sensors comprises a first pressure sensor located between the processor and the cooling unit and a second pressure sensor located such that the processor is between the second pressure sensor and the cooling unit. The sensor processing unit: obtains the air pressure data measured by the plurality of pressure sensors; compares the obtained air pressure data to reference air pressure data for the operating configuration; and based on the comparison, determines that a disturbance to the air flow exists.Type: ApplicationFiled: August 17, 2018Publication date: April 25, 2019Applicant: InvenSense, Inc.Inventors: Sankalp DAYAL, Vamshi GANGUMALLA, Zaryab HAMAVAND, Calin MICLAUS
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Publication number: 20190088098Abstract: A security system for a building comprises a pressure sensor and a computer system communicatively coupled with the pressure system. The pressure sensor coupled to a movable portion of a window in the building. The computer system is configured to: receive a first pressure measurement from the pressure sensor; compare the first pressure measurement to a reference pressure measurement; and based on the comparison, detect that the movable portion of the window has moved.Type: ApplicationFiled: November 14, 2018Publication date: March 21, 2019Applicant: InvenSense, Inc.Inventors: Vamshi GANGUMALLA, Sankalp DAYAL, Calin MICLAUS, Karthik KATINGARI, Rob DICK, Paul SCHREIER