Patents by Inventor Calvin Cheung

Calvin Cheung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170317973
    Abstract: A method for providing a verification process for verifying eligibility of a domain name registrant via a verification web interface for a domain name either registered or in the process of registration with a registrar over a communications network.
    Type: Application
    Filed: April 28, 2016
    Publication date: November 2, 2017
    Inventors: Jimmy Lam, Cedarampattu Mohan, John Kane, Christy Gnanapragasam, Calvin Cheung, Hui Zhou
  • Patent number: 8399776
    Abstract: A substrate having single patterned metal layer includes a patterned base having at least a plurality of apertures, the patterned metal layer disposed on the patterned base, and a first surface finish layer. Parts of the lower surface of the patterned metal layer are exposed by the apertures of the patterned base to form a plurality of first contact pads for downward electrical connection externally, and parts of the upper surface of the patterned metal layer function as a plurality of second contact pads for upward electrical connection externally. The first surface finish layer is disposed at least on one or more surfaces of the second contact pads, and the first surface finish layer is wider than the second contact pad beneath. A package applied with the substrate disclosed herein further comprises at least a die conductively connected to the second contact pads of the substrate.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: March 19, 2013
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Bernd Karl Appelt, William T Chen, Calvin Cheung, Shih-Fu Huang, Yuan-Chang Su, Chia-Cheng Chen, Ta-Chun Lee
  • Publication number: 20100288541
    Abstract: A substrate having single patterned metal layer includes a patterned base having at least a plurality of apertures, the patterned metal layer disposed on the patterned base, and a first surface finish layer. Parts of the lower surface of the patterned metal layer are exposed by the apertures of the patterned base to form a plurality of first contact pads for downward electrical connection externally, and parts of the upper surface of the patterned metal layer function as a plurality of second contact pads for upward electrical connection externally. The first surface finish layer is disposed at least on one or more surfaces of the second contact pads, and the first surface finish layer is wider than the second contact pad beneath. A package applied with the substrate disclosed herein further comprises at least a die conductively connected to the second contact pads of the substrate.
    Type: Application
    Filed: September 18, 2009
    Publication date: November 18, 2010
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Bernd Karl APPELT, William T. CHEN, Calvin CHEUNG, Shih-Fu HUANG, Yuan-Chang SU, Chia-Cheng CHEN, Ta-Chun LEE