Abstract: A method for verifying eligibility of a domain name registrant via a verification web interface for a domain name either registered or in the process of registration with a registrar over a communications network. The method comprising: provide a network link to the registrar or to a registry operator of the domain name; receive an event request for the domain name via the verification web interface including a claim ID associated with the domain name for a domain event; receive a verification request using the network link via the verification web interface including a registrant claim ID and registrant identification information, the registrant claim ID previously provided to the registrant; confirm matching of the registrant claim ID with the claim ID; obtain registrant verification information; access external verification information and compare against the registrant verification information a confirm domain event message or a deny domain event message.

Abstract: A method for verifying eligibility of a domain name registrant via a verification web interface for a domain name either registered or in the process of registration with a registrar over a communications network. The method comprising: provide a network link to the registrar or to a registry operator of the domain name; receive an event request for the domain name via the verification web interface including a claim ID associated with the domain name for a domain event; receive a verification request using the network link via the verification web interface including a registrant claim ID and registrant identification information, the registrant claim ID previously provided to the registrant; confirm matching of the registrant claim ID with the claim ID; obtain registrant verification information; access external verification information and compare against the registrant verification information a confirm domain event message or a deny domain event message.

Abstract: A method for verifying eligibility of a domain name registrant via a verification web interface for a domain name either registered or in the process of registration with a registrar over a communications network. The method comprising: provide a network link to the registrar or to a registry operator of the domain name; receive an event request for the domain name via the verification web interface including a claim ID associated with the domain name for a domain event; receive a verification request using the network link via the verification web interface including a registrant claim ID and registrant identification information, the registrant claim ID previously provided to the registrant; confirm matching of the registrant claim ID with the claim ID; obtain registrant verification information; access external verification information and compare against the registrant verification information; and send a confirm domain event message or a deny domain event message.

Abstract: A method for providing a verification process for verifying eligibility of a domain name registrant via a verification web interface for a domain name either registered or in the process of registration with a registrar over a communications network.

Abstract: A substrate having single patterned metal layer includes a patterned base having at least a plurality of apertures, the patterned metal layer disposed on the patterned base, and a first surface finish layer. Parts of the lower surface of the patterned metal layer are exposed by the apertures of the patterned base to form a plurality of first contact pads for downward electrical connection externally, and parts of the upper surface of the patterned metal layer function as a plurality of second contact pads for upward electrical connection externally. The first surface finish layer is disposed at least on one or more surfaces of the second contact pads, and the first surface finish layer is wider than the second contact pad beneath. A package applied with the substrate disclosed herein further comprises at least a die conductively connected to the second contact pads of the substrate.

Abstract: A substrate having single patterned metal layer includes a patterned base having at least a plurality of apertures, the patterned metal layer disposed on the patterned base, and a first surface finish layer. Parts of the lower surface of the patterned metal layer are exposed by the apertures of the patterned base to form a plurality of first contact pads for downward electrical connection externally, and parts of the upper surface of the patterned metal layer function as a plurality of second contact pads for upward electrical connection externally. The first surface finish layer is disposed at least on one or more surfaces of the second contact pads, and the first surface finish layer is wider than the second contact pad beneath. A package applied with the substrate disclosed herein further comprises at least a die conductively connected to the second contact pads of the substrate.