Patents by Inventor Carl VAN BUGGENHOUT

Carl VAN BUGGENHOUT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10345154
    Abstract: An infrared sensor assembly for sensing infrared radiation comprises infrared sensing elements and the infrared sensing compensation elements that are different so that, for a same flux on the infrared sensing elements and the infrared sensing compensation elements, the radiation responsive element of the infrared sensing elements absorbs more radiation than the radiation responsive element of the infrared sensing compensation elements, as to receive substantially more radiation than the radiation responsive element of the infrared sensing compensation elements. An output of the sensor array is a subtractive function of a sum of the signals of the plurality of infrared sensing elements and a sum of the signals of the plurality of the infrared sensing compensation elements such that at least linear and/or non-linear parasitic thermal fluxes are at least partly compensated for.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: July 9, 2019
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventors: Carl Van Buggenhout, Ben Maes, Karel Vanroye, Stijn Reekmans
  • Patent number: 10337926
    Abstract: A semiconductor device for measuring IR radiation comprising: at least one sensor pixel; at least one reference pixel shielded from said IR radiation comprising a heater; a controller adapted for: measuring a responsivity by applying power to the heater, while not heating the sensor pixel; measuring a first output signal of an unheated pixel and a first reference output signal of the heated pixel, obtaining the responsivity as a function of a measure of the applied power to the heater and of the difference between the first output signal and the first reference output signal; applying a period of cooling down until the temperature of the reference pixel and the sensor pixel are substantially the same; generating the output signal indicative of the IR radiation, based on the difference between the sensor and the reference output signal, by converting this difference using the responsivity.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: July 2, 2019
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventors: Carl Van Buggenhout, Karel Vanroye
  • Publication number: 20190154511
    Abstract: A semiconductor device for measuring IR radiation comprising: at least one sensor pixel; at least one reference pixel shielded from said IR radiation comprising a heater; a controller adapted for: measuring a responsivity by applying power to the heater, while not heating the sensor pixel; measuring a first output signal of an unheated pixel and a first reference output signal of the heated pixel, obtaining the responsivity as a function of a measure of the applied power to the heater and of the difference between the first output signal and the first reference output signal; applying a period of cooling down until the temperature of the reference pixel and the sensor pixel are substantially the same; generating the output signal indicative of the IR radiation, based on the difference between the sensor and the reference output signal, by converting this difference using the responsivity.
    Type: Application
    Filed: November 15, 2018
    Publication date: May 23, 2019
    Inventors: Carl VAN BUGGENHOUT, Karel VANROYE
  • Patent number: 10269667
    Abstract: A packaged semiconductor device comprising a stack including a die comprising a functional circuit, and a cap which is wafer bonded to the die for protecting the functional circuit as well as a mold component for packaging the stack. At least the cap and/or the die comprises at least one groove at least partially in contact with the mold component, for increasing adhesion of the mold component to the stack. A corresponding method for manufacturing such a packaged device also is described.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: April 23, 2019
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventor: Carl Van Buggenhout
  • Patent number: 10217874
    Abstract: Method of encapsulating a semiconductor structure comprising providing a semiconductor structure comprising an opto-electric element located in a cavity formed between a substrate and a cap layer, the cap layer being made of a material transparent to light, and having a flat upper surface; forming at least one protrusion on the cap layer; bringing the at least one protrusion of the cap layer in contact with a tool having a flat surface region, and applying a opaque material to the semiconductor structure where it is not in contact with the tool; and removing the tool thereby providing an encapsulated optical semiconductor device having a transparent window integrally formed with the cap layer.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: February 26, 2019
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventors: Carl Van Buggenhout, Jian Chen
  • Patent number: 10096724
    Abstract: A chip for radiation measurements, the chip comprising a first substrate comprising a first sensor and a second sensor. The chip moreover comprises a second substrate comprising a first cavity and a second cavity both with oblique walls. An internal layer is present on the inside of the second cavity. The second substrate is sealed to the first substrate with the cavities on the inside such that the first cavity is above the first sensor and the second cavity is above the second sensor.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: October 9, 2018
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventors: Carl Van Buggenhout, Appolonius Jacobus Van Der Wiel, Luc Buydens
  • Publication number: 20180283956
    Abstract: An infrared sensor assembly for sensing infrared radiation comprises infrared sensing elements and the infrared sensing compensation elements that are different so that, for a same flux on the infrared sensing elements and the infrared sensing compensation elements, the radiation responsive element of the infrared sensing elements absorbs more radiation than the radiation responsive element of the infrared sensing compensation elements, as to receive substantially more radiation than the radiation responsive element of the infrared sensing compensation elements. An output of the sensor array is a subtractive function of a sum of the signals of the plurality of infrared sensing elements and a sum of the signals of the plurality of the infrared sensing compensation elements such that at least linear and/or non-linear parasitic thermal fluxes are at least partly compensated for.
    Type: Application
    Filed: June 5, 2018
    Publication date: October 4, 2018
    Inventors: Carl VAN BUGGENHOUT, Ben MAES, Karel VANROYE, Stijn REEKMANS
  • Patent number: 9989405
    Abstract: An infrared sensor assembly for sensing infrared radiation from an object is disclosed. The infrared sensor assembly comprises a sensor array comprising a plurality of sensing elements, provided on or embedded in a substrate extending in a substrate plane. The sensor array comprises at least two infrared sensing elements, each infrared sensing element having a radiation responsive element providing a proportionate electrical signal in response to infrared radiation incident thereto and at least two blind sensing elements, at least one blind sensing element being interspersed among the at least two sensing elements, each blind sensing element being shielded from incident infrared radiation from the object and providing a proportionate electrical signal in response to parasitic thermal fluxes. The output of the sensor array is a function of the infrared sensing elements and of the blind sensing elements such that parasitic thermal fluxes are at least partly compensated for.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: June 5, 2018
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventors: Carl Van Buggenhout, Ben Maes, Karel Vanroye, Stijn Reekmans
  • Patent number: 9909924
    Abstract: An infrared thermal sensor for sensing infrared radiation is disclosed. The infrared thermal sensor comprises a substrate and a cap structure together forming a sealed cavity, a membrane arranged in said cavity for receiving infrared radiation (IR) through a window or aperture and a plurality of beams for suspending the membrane. At least one beam has a thermocouple arranged therein or thereon for measuring a temperature difference (?T) between the membrane and the substrate, the plurality of beams. Furthermore at least one beam is mechanically supporting the membrane without a thermocouple being present therein or thereon.
    Type: Grant
    Filed: December 13, 2014
    Date of Patent: March 6, 2018
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventors: Ben Maes, Carl Van Buggenhout, Appolonius Jacobus Van Der Wiel
  • Patent number: 9851253
    Abstract: An infrared thermal sensor for detecting infrared radiation, comprising a substrate and a cap structure together forming a sealed cavity, the cavity comprising a gas at a predefined pressure; a membrane arranged in said cavity for receiving infrared radiation; a plurality of beams for suspending the membrane; a plurality of thermocouples for measuring a temperature difference between the membrane and the substrate; wherein the ratio of the thermal resistance between the membrane and the substrate through the thermocouples, and the thermal resistance between the membrane and the substrate through the beams and through the gas is a value in the range of 0.8 to 1.2. A method of designing such a sensor, and a method of producing such a sensor is also disclosed.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: December 26, 2017
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventors: Ben Maes, Carl Van Buggenhout, Appolonius Jacobus Van Der Wiel
  • Patent number: 9791319
    Abstract: An infrared thermal sensor for detecting infrared radiation is described. It comprises a substrate and a cap structure together forming a sealed cavity. A membrane is suspended therein by a plurality of beams, each beam comprising at least one thermocouple arranged therein or thereon for measuring a temperature difference between the membrane and the substrate. At least two beams have a different length and each of the thermocouples have a substantially same constant width to length ratio such that the thermal resistance measured between the membrane and the substrate is substantially constant for each beam, and such that the electrical resistance measured between the membrane and the substrate is substantially constant for each beam. The beams may be linear, and be oriented in a non-radial direction.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: October 17, 2017
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventors: Ben Maes, Carl Van Buggenhout, Appolonius Jacobus Van Der Wiel
  • Publication number: 20170194512
    Abstract: Method of encapsulating a semiconductor structure comprising providing a semiconductor structure comprising an opto-electric element located in a cavity formed between a substrate and a cap layer, the cap layer being made of a material transparent to light, and having a flat upper surface; forming at least one protrusion on the cap layer; bringing the at least one protrusion of the cap layer in contact with a tool having a flat surface region, and applying a opaque material to the semiconductor structure where it is not in contact with the tool; and removing the tool thereby providing an encapsulated optical semiconductor device having a transparent window integrally formed with the cap layer.
    Type: Application
    Filed: March 20, 2017
    Publication date: July 6, 2017
    Inventors: Carl VAN BUGGENHOUT, Jian CHEN
  • Patent number: 9620656
    Abstract: Method of encapsulating a semiconductor structure comprising providing a semiconductor structure comprising an opto-electric element located in a cavity formed between a substrate and a cap layer, the cap layer being made of a material transparent to light, and having a flat upper surface; forming at least one protrusion on the cap layer; bringing the at least one protrusion of the cap layer in contact with a tool having a flat surface region, and applying a opaque material to the semiconductor structure where it is not in contact with the tool; and removing the tool thereby providing an encapsulated optical semiconductor device having a transparent window integrally formed with the cap layer.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: April 11, 2017
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventors: Carl Van Buggenhout, Jian Chen
  • Publication number: 20170016762
    Abstract: An infrared sensor assembly for sensing infrared radiation from an object is disclosed. The infrared sensor assembly comprises a sensor array comprising a plurality of sensing elements, provided on or embedded in a substrate extending in a substrate plane. The sensor array comprises at least two infrared sensing elements, each infrared sensing element having a radiation responsive element providing a proportionate electrical signal in response to infrared radiation incident thereto and at least two blind sensing elements, at least one blind sensing element being interspersed among the at least two sensing elements, each blind sensing element being shielded from incident infrared radiation from the object and providing a proportionate electrical signal in response to parasitic thermal fluxes. The output of the sensor array is a function of the infrared sensing elements and of the blind sensing elements such that parasitic thermal fluxes are at least partly compensated for.
    Type: Application
    Filed: July 15, 2016
    Publication date: January 19, 2017
    Inventors: Carl VAN BUGGENHOUT, Ben MAES, Karel VANROYE, Stijn REEKMANS
  • Publication number: 20170003172
    Abstract: An infrared thermal sensor for sensing infrared radiation is disclosed. The infrared thermal sensor comprises a substrate and a cap structure together forming a sealed cavity, a membrane arranged in said cavity for receiving infrared radiation (IR) through a window or aperture and a plurality of beams for suspending the membrane. At least one beam has a thermocouple arranged therein or thereon for measuring a temperature difference (?T) between the membrane and the substrate, the plurality of beams. Furthermore at least one beam is mechanically supporting the membrane without a thermocouple being present therein or thereon.
    Type: Application
    Filed: December 13, 2014
    Publication date: January 5, 2017
    Inventors: Ben MAES, Carl VAN BUGGENHOUT, Appolonius Jacobus VAN DER WIEL
  • Publication number: 20160149105
    Abstract: A chip for radiation measurements, the chip comprising a first substrate comprising a first sensor and a second sensor. The chip moreover comprises a second substrate comprising a first cavity and a second cavity both with oblique walls. An internal layer is present on the inside of the second cavity. The second substrate is sealed to the first substrate with the cavities on the inside such that the first cavity is above the first sensor and the second cavity is above the second sensor.
    Type: Application
    Filed: November 25, 2015
    Publication date: May 26, 2016
    Inventors: Carl VAN BUGGENHOUT, Appolonius Jacobus VAN DER WIEL, Luc BUYDENS
  • Publication number: 20160093544
    Abstract: A packaged semiconductor device comprising a stack including a die comprising a functional circuit, and a cap which is wafer bonded to the die for protecting the functional circuit as well as a mold component for packaging the stack. At least the cap and/or the die comprises at least one groove at least partially in contact with the mold component, for increasing adhesion of the mold component to the stack. A corresponding method for manufacturing such a packaged device also is described.
    Type: Application
    Filed: May 23, 2014
    Publication date: March 31, 2016
    Applicant: MELEXIS TECHNOLOGIES NV
    Inventor: Carl VAN BUGGENHOUT
  • Patent number: 9184330
    Abstract: The invention relates to an infrared thermal sensor comprising a substrate having a cavity, a cavity bottom wall formed by a continuous substrate surface. The sensor comprises a membrane adapted for receiving heat from incident infrared radiation, a beam suspending the membrane, and a thermocouple. This membrane comprises openings extending through the membrane for facilitating the passage of an anisotropic etchant for etching the cavity during manufacture. Each opening has a cross-section with a length to width ratio of at least 4. The width direction of respectively a first and a second set of openings is oriented according to respectively a first crystallographic orientation and a second crystallographic orientation, these orientations corresponding to different directions lying in loosely packed crystal lattice faces of the semiconductor substrate.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: November 10, 2015
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventors: Ben Maes, Carl Van Buggenhout, Appolonius Jacobus Van Der Wiel
  • Publication number: 20150255634
    Abstract: Method of encapsulating a semiconductor structure comprising providing a semiconductor structure comprising an opto-electric element located in a cavity formed between a substrate and a cap layer, the cap layer being made of a material transparent to light, and having a flat upper surface; forming at least one protrusion on the cap layer; bringing the at least one protrusion of the cap layer in contact with a tool having a flat surface region, and applying a opaque material to the semiconductor structure where it is not in contact with the tool; and removing the tool thereby providing an encapsulated optical semiconductor device having a transparent window integrally formed with the cap layer.
    Type: Application
    Filed: March 5, 2015
    Publication date: September 10, 2015
    Inventors: Carl VAN BUGGENHOUT, Jian CHEN
  • Publication number: 20150253194
    Abstract: A sensor assembly for sensing infrared radiation and its manufacture are described. The sensor comprises at least one sensing element provided on or embedded in a substrate extending substantially in a substrate plane, a cap for covering the at least one sensing element, the cap comprising an upper wall for receiving radiation incident on the sensor assembly and a plurality of cavity walls arranged to define a cavity between the cap and the substrate for hosting the sensing element. At least one of said cavity walls subtends an angle with respect to the receiving upper wall so as to induce total internal reflection on said cavity walls for radiation incident thereon.
    Type: Application
    Filed: March 5, 2015
    Publication date: September 10, 2015
    Inventor: Carl VAN BUGGENHOUT