Abstract: A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.

Abstract: A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.

Abstract: A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.

Abstract: A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.

Abstract: An adhesive for a circuit material, comprises a blend of a cure system; and a solid epoxy resin and a nitrile rubber functionalized with epoxy-reactive groups, wherein the solid epoxy resin and the nitrile rubber are reacted to form an adduct prior to blending with the cure system. The adhesive has low dendritic growth and improved solder resistance.

Abstract: A composition for the manufacture of a circuit material comprises a solvent composition having a boiling point below 160° C.; an epoxy compound having an average epoxy functionality of greater than one, an epoxy equivalent weight of less than about 6,000 Daltons, a softening point of less than about 160° C., and solubility in the solvent composition; an aromatic polymer co-curable with the epoxy compound, and soluble in the solvent composition; and, optionally, a catalyst for the polymerization of epoxy groups. The composition for the manufacture of a circuit material can further comprise a filler additive and/or a flame retardant additive.

Abstract: A dielectric material for use in a circuit material comprises a liquid crystalline polymer and a polyhedral oligomeric silsesquioxane (POSS) filler. Such dielectric materials may provide a variety of advantageous properties, especially in high frequency circuits.

Abstract: A dielectric material for use in a circuit material comprises a liquid crystalline polymer and a polyhedral oligomeric silsesquioxane (POSS) filler. Such dielectric materials may provide a variety of advantageous properties, especially in high frequency circuits.

Abstract: A curable covercoat composition comprises an esterified styrene maleic anhydride oligomer, wherein the ester groups comprise an acrylate group, a methacrylate group, or both, a photoinitiator composition, and a curing agent. The curable covercoat composition may comprise a two-part composition, in which the two parts are mixed prior to use. The two parts may be stored separately to ensure that the product has a long shelf life. Furthermore, the two parts may be mixed in different ratios to obtain a cured covercoat that can be used in printed circuit boards in a wide variety of commercial applications, where reduced shrinkage, increased flexibility, and long life are desired.

Abstract: Polymeric organic coating for electroluminescent lamp components, particularly for phosphor particles and electrodes and a method of making same, wherein the polymer is formed using an initiator, preferably by ring-opening metathesis polymerization. A dense hydrophobic organic coating is formed which is capable of protecting the electroluminescent device components from exogenous agents such as moisture and eventual degradation. The polymer layer may be attached to an outer surface of the component by one or more tethering layers.

Abstract: Polymeric organic coating for electroluminescent lamp components, particularly for phosphor particles and electrodes and a method of making same, wherein the polymer is formed using an initiator, preferably by ring-opening metathesis polymerization. A dense hydrophobic organic coating is formed which is capable of protecting the electroluminescent device components from exogenous agents such as moisture and eventual degradation. The polymer layer may be attached to an outer surface of the component by one or more tethering layers.

Abstract: In accordance with the present invention, it has been discovered that bias sputtering a metal layer (e.g., copper or aluminum) in an atmosphere of a mixture of ammonia and a noble gas leads to dramatically improved adhesion between deposited metal and a fluoropolymer substrate. Preferably, the bias sputtering takes place in an ammonia/argon gas mixture and most preferably in ammonia/argon gas mixture of 5 to 50 volume % ammonia and 50 to 95 volume % argon (most preferably 90/10 argon/ammonia). The use of an ammonia/noble gas atmosphere for bias sputtering is especially well suited for bias sputtering of copper seed layers onto fluoropolymer substrates. In general, the process for depositing a metal layer onto a surface of a fluoropolymer substrate in accordance with the present invention includes the steps of securing the fluoropolymer substrate to an electrically isolated conductive member (e.g.

Abstract: In accordance with the present invention, an MCM substrate product is manufactured in an additive process using multiple layers of a fluoropolymer composite material and copper. The copper layers are plated, and the fluoropolymer composite layers are laminated. A seeding process promotes reliable bonding between the fluoropolymer composite material and the plated copper. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. The MCM substrate device of the present invention may have multiple metal layers and multiple dielectric layers; four or five, or more, of each in a single structure would be easily achieved and is typical. The structure would include lead lines in separate mutually orthogonal planes (sometimes referred to as "x" and "y" lead lines) sandwiched between ground and power voltage planes of copper.

Abstract: A method of ablating fluoropolymer composite materials is presented wherein it has been found that small holes (less than 100 .mu.m) can be formed in fluoropolymer composite laminate materials using UV lasers. The resulting holes can be used to produce vias and plated through-holes having smooth side walls with little or no debris or residue remaining in the holes and minimal damage to the polymer. Thus, the vias and plated through-holes can be plated without further cleaning processes. In addition, the holes are formed at a relatively fast rate.

Abstract: A multilayer through-hole contacted flexible circuit and method of manufacture thereof is presented having a laminar construction which is strictly symmetrical in the bending area; and which has no exposed adhesive. The flexible circuit is made by providing through-holes to a standard single sided laminate. Next, conductive material is vacuum deposited (e.g. sputtered or evaporated) into the through-holes and at the same time a conductive seed-layer is deposited on the polymer side of the standard laminate. Plating resist is applied to both sides of the material and the seed-layer side of the material is patterned such that circuit traces, pads, and through-holes can be electroplated with additional copper. The plating resist is stripped and the very thin layer of copper in the non-conductive areas is flash etched to produce semi-additive circuit features on the seed-layer side.

Abstract: An epoxy foam product is presented which is produced by frothing in an intensive mixer an epoxy functional reactant stream and a curing agent stream in the presence of a surfactant and gaseous frothing agent. The epoxy foam product is characterized as a strong, rigid low-density foam having a fine, uniform cell size.