Abstract: The present invention relates generally to a new apparatus and method for molding metallic materials, such as, for example, solder. More particularly, the invention encompasses an apparatus that is used to form metallic interconnections, such as, for example, solder connections, such as, BGA (Ball Grid Array) or CGA (Column Grid Array) in a mold for later use to electrically or mechanically connect two devices, such as, for example, semiconductor devices. A method for forming the metallic connections that are used to electrically or mechanically connect two devices, such as, for example, semiconductor devices is also disclosed. However, these metallic interconnections in a mold could also be used to form other structures, such as, for example, heat sinks with fins, etc.

Abstract: The present invention relates generally to a new mold transfer apparatus and method. More particularly, the invention encompasses an apparatus that is used to form metallic interconnections, such as, for example, solder connections, such as, solder balls or solder columns, using a mold that is already filled with transferable metallic material. However, these metallic interconnections in a mold could also be used to form other structures, such as, for example, heat sinks with fins, etc.