Abstract: A device for measuring at least one periodic vital signal from an individual, intended to be attached to a safety apparatus of a vehicle so as to be arranged between the individual and the apparatus, the device comprising: a vibration sensor comprising: a stack of layers and including an active layer made of piezoelectric material and two contact electrodes arranged on at least one face of the active layer, a flexible support layer including a printed circuit comprising two electrical terminals, the support layer being intended to be arranged on the individual, an electrical connection layer, arranged between the stack of layers and the support layer, for connecting each contact electrode to an electrical terminal, an acoustic attenuation member intended to be arranged between the safety apparatus and the vibration sensor, the member being integral with the support layer and arranged above and spaced apart from the stack of layers.

Abstract: A device for measuring at least one periodic vital signal from an individual, intended to be attached to a safety apparatus of a vehicle so as to be arranged between the individual and the apparatus, the device comprising: a vibration sensor comprising: a stack of layers and including an active layer made of piezoelectric material and two contact electrodes arranged on at least one face of the active layer, a flexible support layer including a printed circuit comprising two electrical terminals, the support layer being intended to be arranged on the individual, an electrical connection layer, arranged between the stack of layers and the support layer, for connecting each contact electrode to an electrical terminal, an acoustic attenuation member intended to be arranged between the safety apparatus and the vibration sensor, the member being integral with the support layer and arranged above and spaced apart from the stack of layers.

Abstract: A heat dissipation device includes a substrate with a network of thermally-conductive vias and thermally-conductive layers. The substrate has a first surface and a second surface opposite to the first surface. A heat dissipation interface layer including a stack of a first layer made of a first thermally-conductive material and a second layer made of a second thermally-conductive material. The first material is different from the second material. A surface of the first layer is coplanar with the first surface of the substrate. At least one of the thermally-conductive vias of said network supports and is in contact with the first layer. At least one opening thoroughly crosses the stack of the first and second layers. Material of the substrate fills the opening in the first layer.