Patents by Inventor Celine E.J. HUYSKENS

Celine E.J. HUYSKENS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure sensitive adhesive with broad damping temperature range
    Patent number: 11591497
    Abstract: A damping-enhanced pressure-sensitive adhesive comprising a pressure-sensitive adhesive and a at least one damping additive. The pressure-sensitive adhesive comprises a silicone-based polymer and optionally, at least one catalyst and/or at least one initiator.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: February 28, 2023
    Assignee: Avery Dennison Corporation
    Inventors: Sara De Vrij, Ingrid E. Geuens, Celine E. J. Huyskens
  • ADHESIVE WITH HIGH FILLER CONTENT
    Publication number: 20220025224
    Abstract: Provided herein are adhesive compositions comprising a controlled architecture polymer network acrylic copolymer, a crosslinker, and at least two fillers. These adhesive compositions can exhibit strong adhesion performance at high filler concentrations. Also provided are adhesive tapes and methods using the disclosed adhesive composition.
    Type: Application
    Filed: December 19, 2019
    Publication date: January 27, 2022
    Inventors: Stijn COERTJENS, Celine E.J. HUYSKENS, Ingrid E. GEUENS
  • Pressure Sensitive Adhesive with Broad Damping Temperature Range
    Publication number: 20210179895
    Abstract: A damping-enhanced pressure-sensitive adhesive comprising a pressure-sensitive adhesive and a at least one damping additive. The pressure-sensitive adhesive comprises a silicone-based polymer and optionally, at least one catalyst and/or at least one initiator.
    Type: Application
    Filed: September 20, 2018
    Publication date: June 17, 2021
    Inventors: Sara DE VRIJ, Ingrid E. GEUENS, Celine E.J. HUYSKENS