Patents by Inventor Chan-ki Yang

Chan-ki Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • VEHICLE SEAT REINFORCEMENT DEVICE
    Publication number: 20240083384
    Abstract: A vehicle seat reinforcement device includes a leg portion mounted on a floor panel, a seat cushion frame slidably mounted on the leg portion, and a load reinforcing structure connected between the leg portion and the seat cushion frame, wherein when a seat belt anchorage load is transferred to the seat cushion frame, the seat cushion frame is locked to the leg portion by the load reinforcing structure.
    Type: Application
    Filed: February 3, 2023
    Publication date: March 14, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.
    Inventors: Sang Soo LEE, Chan Ho JUNG, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Deok Soo LIM, Sang Do PARK, In Sun BAEK, Sin Chan YANG, Chan Ki CHO, Myung Soo LEE, Jae Yong JANG, Jun Sik HWANG, Ho Sung KANG, Hae Dong KWAK, Hyun Tak KO
  • Preparing conditioning disk for chemical mechanical polishing and chemical mechanical polishing method including the same
    Patent number: 10525566
    Abstract: A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: January 7, 2020
    Assignees: SAMSUNG ELECTRONICS CO., LTD., EHWA Diamond Industrial Co., Ltd.
    Inventors: Myung-ki Hong, Yung-jun Kim, Sung-oh Park, Hyo-san Lee, Joo-han Lee, Kyu-min Oh, Sun-gyu Park, Seh-kwang Lee, Chan-ki Yang
  • CHEMICAL MECHANICAL POLISHING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MANUFACTURING APPARATUS
    Publication number: 20180104792
    Abstract: A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.
    Type: Application
    Filed: May 23, 2017
    Publication date: April 19, 2018
    Applicant: EHWA Diamond Industrial Co., Ltd.
    Inventors: Myung-ki HONG, Yung-jun KIM, Sung-oh PARK, Hyo-san LEE, Joo-han LEE, Kyu-min Oh, Sun-gyu PARK, Seh-kwang LEE, Chan-ki YANG
  • Methods and systems for controlling semiconductor device manufacturing processes
    Publication number: 20070026545
    Abstract: A first process time period for a manufacturing process is determined, and a thickness of a material on a sample semiconductor substrate using the first process time period is measured. If the thickness is not within a desired thickness range, a second process time period for the manufacturing process for obtaining a thickness in the desired thickness range is determined. If the thickness is within a desired thickness range, a third process time period for a subsequent manufacturing process based on a change in the manufacturing process over time is determined.
    Type: Application
    Filed: July 28, 2006
    Publication date: February 1, 2007
    Inventors: Jin-ho Hwang, Chan-ki Yang, Jae-won Hwang