Abstract: A method for providing classification data of an electrocardiogram signal includes loading, by an electronic apparatus, an electrocardiogram signal, analyzing, by the electronic apparatus, the electrocardiogram signal and generating labels related to the electrocardiogram signal in association with the electrocardiogram signal, determining, by the electronic apparatus, category values of signal segments of the electrocardiogram signal based on labels related to the electrocardiogram signal according to standard classification criteria, displaying, by the electronic apparatus, labels related to the electrocardiogram signal and category values of segments of the electrocardiogram signal on an output unit, in response to a selection input for a first category value from among the category values, generating, by the electronic apparatus, information regarding an electrocardiogram signal related to the first category value, and displaying information regarding the electrocardiogram signal related to the first cate

Abstract: Disclosed is a bio-signal monitoring device including an electrocardiogram detector, one or more sensor units, a controller configured to process the electrocardiogram signal or a sensing signal received from the sensor units, a connector configured to be connected to the sensor units and to transmit, to the controller, a sensing signal from the sensor units, and a communicator configured to communicate with an external electronic device. The sensing units include a breathing rate sensor, an acceleration sensor, a temperature sensor, or a combination thereof.

Abstract: A display panel includes an amorphous silicon gate driver in which a lower voltage than the gate-off voltage output from the gate driver is applied to an adjacent stage as a low voltage transmission signal.

Abstract: A connector includes a connector housing including: a plurality of insertion holes; a plurality of connection terminals inserted into some of the plurality of insertion holes and configured to be electrically connected to a first set of a plurality of tab terminals of a sensor unit; and a joint terminal accommodated inside the connector housing. The joint terminal includes at least one grounding terminal part electrically connected to at least one of a second set of the plurality of tab terminals and a joint connection part electrically connected to a ground connection terminal, which is one of the plurality of connection terminals.

Abstract: A connector assembly includes an inner housing, a substrate inserted into the inner housing, and a terminal position assurance (TPA) member supporting the substrate for the substrate not to be separated from the inner housing. The TPA member having a hot staking protrusion penetrating through the substrate and the inner housing.

Abstract: Provided is an apparatus for measuring biosignals. The apparatus includes: a multiplexer configured to receive a first biosignal and a second biosignal, and to output either the first biosignal or the second biosignal; an analog-to-digital converter configured to convert an analog signal that is an output of the multiplexer into a digital signal; and a processor configured to perform signal processing on an output of the analog-to-digital converter.

Abstract: Disclosed is an electronic device. According to an embodiment, the electronic device includes a housing that covers at least a portion of a back surface of the electronic device, a plurality of slits being formed in parallel from one end to an opposite end and the at least a portion of the housing being formed of a conductive material, a feeder that is electrically connected with at least one point of the housing, and a ground part that is electrically connected with at least one point of the housing. A part of the plurality of slits includes a section greater in width than another part of the plurality of slits. Moreover, various embodiment found through the disclosure are possible.

Abstract: A display panel includes an amorphous silicon gate driver in which a lower voltage than the gate-off voltage output from the gate driver is applied to an adjacent stage as a low voltage transmission signal.

Abstract: A touch sensor includes touch electrodes in a first area and a second area, a first force sensor electrode on a same layer as the touch electrodes and spaced from a first touch electrode in the first area, a first force sensor line on a same layer as the touch electrodes and electrically connected to the first force sensor electrode, the first force sensor line being at a second side of the first touch electrode, and touch lines on a same layer as, and connected to, the touch electrodes, the touch lines including a first touch line connected to the first touch electrode and at a first side of the first touch electrode.

Abstract: A cancer-specific trans-splicing ribozyme and a use thereof are disclosed. The trans-splicing ribozyme does not act on normal tissue, but is specifically expressed in cancer tissue. Therefore, it is very safe and has excellent expression efficiency at the post-transcription level, and thus can be effectively used in treatment of cancer.

Abstract: A touch sensing unit, includes a plurality of first sensing electrodes and a plurality of second sensing electrodes intersecting with and insulated from the plurality of first sensing electrodes. The plurality of first sensing electrodes includes a plurality of first sensor portions and a plurality of first connection portions connecting each of the plurality of first sensor portions with one another. The plurality of second sensing electrodes includes a plurality of second sensor portions a plurality of stem sensors extended from the plurality of second sensor portions, and a plurality of second connection portions connecting each of the plurality of sensor portions with one another. Each of the plurality of first sensor portions includes a plurality of depressions indented inwardly. Each of the plurality of stem sensors is disposed such that it is at least partially surrounded by a respective depression of the plurality of depressions.

Abstract: A connector includes a connector housing including: a plurality of insertion holes; a plurality of connection terminals inserted into some of the plurality of insertion holes and configured to be electrically connected to a first set of a plurality of tab terminals of a sensor unit; and a joint terminal accommodated inside the connector housing. The joint terminal includes at least one grounding terminal part electrically connected to at least one of a second set of the plurality of tab terminals and a joint connection part electrically connected to a ground connection terminal, which is one of the plurality of connection terminals.

Abstract: A polyoxymethylene resin composition including a polyoxymethylene homopolymer, a polyhydric alcohol, and a calcium phosphate compound, which has excellent thermal stability and a low weight-reduction rate and thus can be favorably used in various industrial fields and used as an engineering plastic in fields of machine parts and the like.

Abstract: A server according to an embodiment of the disclosure may include at least one processor and storage, wherein the at least one processor may be configured to receive beacon information including information on at least one website from the electronic device, collect data from a first website of the at least one website based on the beacon information, generate content having a structured document format based on at least a part of the collected data, and transmit the generated content to the electronic device.

Abstract: A tool spindle for machine tool includes a tool spindle having a front end in which a tool is mounted and installed to be rotatable, and a vibration damping device mounted in a rear end of the tool spindle to damp cutting vibration generated at the front end of the tool spindle, and including a rigid member coupled to the rear end of the tool spindle and a tuned mass member elastically supported by the rigid member.

Abstract: An apparatus for testing a semiconductor device is described. The apparatus includes a test chamber in which a test process for a plurality of semiconductor devices is performed, a first storage disposed in the test chamber with a first semiconductor device located therein, a second storage spaced apart in a first direction from the first storage with a second semiconductor device located therein, a first nozzle extending in the first direction on a first sides of the first and second storages and including a plurality of first air outlets configured to discharge air, a second nozzle extending in the first direction on and including a plurality of second air outlets configured to discharge air, and a controller controlling temperatures of the first and second semiconductor devices within a predefined temperature range by controlling the air discharged by the first and second nozzles.

Abstract: Disclosed is an electronic device. According to an embodiment, the electronic device includes a housing that covers at least a portion of a back surface of the electronic device, a plurality of slits being formed in parallel from one end to an opposite end and the at least a portion of the housing being formed of a conductive material, a feeder that is electrically connected with at least one point of the housing, and a ground part that is electrically connected with at least one point of the housing. A part of the plurality of slits includes a section greater in width than another part of the plurality of slits. Moreover, various embodiment found through the disclosure are possible.

Abstract: A package that includes a substrate having a first surface; a solder resist layer coupled to the first surface of the substrate; a device located over the solder resist layer such that a portion of the device touches the solder resist layer; and an encapsulation layer located over the solder resist layer such that the encapsulation layer encapsulates the device. The solder resist layer is configured as a seating plane for the device. The device is located over the solder resist layer such that a surface of the device facing the substrate is approximately parallel to the first surface of the substrate. The solder resist layer includes at least one notch. The device is located over the solder resist layer such that at least one corner of the device touches the at least one notch.

Abstract: A touch sensing unit, includes a plurality of first sensing electrodes and a plurality of second sensing electrodes intersecting with and insulated from the plurality of first sensing electrodes. The plurality of first sensing electrodes includes a plurality of first sensor portions and a plurality of first connection portions connecting each of the plurality of first sensor portions with one another. The plurality of second sensing electrodes includes a plurality of second sensor portions, a plurality of stem sensors extended from the plurality of second sensor portions, and a plurality of second connection portions connecting each of the plurality of sensor portions with one another. Each of the plurality of first sensor portions includes a plurality of depressions indented inwardly. Each of the plurality of stem sensors is disposed such that it is at least partially surrounded by a respective depression of the plurality of depressions.

Abstract: A test system for a memory device includes: a chamber including at least one test socket column having a plurality of test sockets arranged in a first direction, wherein memory devices to be tested are in respective ones of the plurality of test sockets, a temperature adjusting apparatus configured to supply air into the chamber according to a temperature control signal to control a temperature of the chamber, a test device electrically connected to the test sockets and configured to test the memory devices, and a temperature controller configured to receive temperature information of the memory devices from temperature sensors of the memory devices and to output to the temperature adjusting apparatus the temperature control signal to compensate for a temperature difference between a detected temperature of the memory devices and a target temperature.