Abstract: A method of fabricating magnetoresistive random access memory, including providing a substrate, forming a bottom electrode layer, a magnetic tunnel junction stack, a top electrode layer and a hard mask layer sequentially on the substrate, wherein a material of the top electrode layer is titanium nitride, a material of the hard mask layer is tantalum or tantalum nitride, and a percentage of nitrogen in the titanium nitride gradually decreases from a top surface of top electrode layer to a bottom surface of top electrode layer, and patterning the bottom electrode layer, the magnetic tunnel junction stack, the top electrode layer and the hard mask layer into multiple magnetoresistive random access memory cells.

Abstract: A chip transferring method includes steps of: providing a plurality of chips on a first load-bearing structure; measuring photoelectric characteristic values of the plurality of chips; categorizing the plurality of chips into a first portion of the plurality of chips and a second portion of the plurality of chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion of the plurality of chips comprise parts of the plurality of chips which photoelectric characteristic value falls within an unqualified range; removing the second portion of the plurality of chips from the first load-bearing structure; dividing the first portion of the plurality of chips into a plurality of blocks, wherein each of the plurality of blocks comprising multiple chips of the first portion of the plurality of chips; and transferring the first portion of the plurality of chips in one of the plurality of blocks to a second load-bearing structure in single-batch.

Abstract: A harmonic deceleration module, a dynamic power device, an automatic mobile vehicle, a transfer apparatus, a dynamic power supply system, and an electric bicycle are provided. The harmonic deceleration module includes a connecting member, a flexible bearing, a first frame, a first circular spline, a second frame, and a second circular spline. When the connecting member is driven, the connecting member rotates around a central axis. The connecting member has a cam part, and the cam part and the flexible bearing jointly form a wave generator. The wave generator is configured to be driven by the connecting member to drive a flexspline to continually and flexibly deform, and the flexspline drives the second circular spline and the second frame connected to the second circular spline to rotate. The second frame has a hollow channel penetrating through the second frame along the central axis.

Abstract: A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring photoelectric characteristic values of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion chips comprise parts of the plurality of chips which photoelectric characteristic value falls within an unqualified range; removing the second portion chips from the first load-bearing structure; dividing the first portion chips into a plurality of blocks according to the photoelectric characteristic values, and each of the plurality of blocks comprising multiple chips of the first portion chips; and transferring the multiple chips of one of the plurality of blocks to a second load-bearing structure.

Abstract: A method of processing light-emitting elements includes: placing a plurality of LED dies from original wafers or trays on each trays of a next-stage carrier, based on a predetermined pattern. The predetermined pattern arranges two adjacent LED groups in a first direction on the original wafer or trays to be placed on two non-adjacent positions in the first direction on the tray of the next-stage carrier. The LED dies on the original wafer or trays have a first horizontal pitch and a first vertical pitch. The LED dies on each tray of the next-stage carrier have a second horizontal pitch and a second vertical pitch. The second horizontal pitch is greater than the first horizontal pitch, or the second vertical pitch is greater than the first vertical pitch. Besides, a light-emitting element device using the aforementioned method is also provided.

Abstract: A method of processing light-emitting elements includes: transferring a plurality of light-emitting elements from original wafers or next-stage carriers, based on a predetermined pattern. The predetermined pattern arranges two adjacent LED groups in a first direction on the original wafer or carriers to be placed on two non-adjacent positions in the first direction on the next-stage carriers. The light-emitting elements on the original wafer have a horizontal wafer pitch and a vertical wafer pitch. The light-emitting elements on each of the next-stage carriers have a first horizontal pitch and a first vertical pitch. The first horizontal pitch is greater than the horizontal wafer pitch, or the first vertical pitch is greater than the vertical wafer pitch. Besides, a light-emitting element device using the aforementioned method is also provided.

Abstract: A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring photoelectric characteristic values of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion chips comprise parts of the plurality of chips which photoelectric characteristic value falls within an unqualified range; removing the second portion chips from the first load-bearing structure; dividing the first portion chips into a plurality of blocks according to the photoelectric characteristic values, and each of the plurality of blocks comprising multiple chips of the first portion chips; and transferring the multiple chips of one of the plurality of blocks to a second load-bearing structure.

Abstract: A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring a photoelectric characteristic value of each of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic value of each of the plurality of chips; providing a second load-bearing structure; weakening a first adhesion between the first portion chips and the first load-bearing structure or between the second portion chips and the first load-bearing structure; and transferring the first portion chips or the second portion chips to the second load-bearing structure.

Abstract: A harmonic speed reducer is provided. The harmonic speed reducer includes a wave generator, a flexible gear, a first rigid gear, and a second rigid gear. The wave generator can be driven to rotate relative to a central axis. The flexible gear has a plurality of first outer gear structures, a division groove, and a plurality of second outer gear structures. The first rigid gear has a plurality of first inner gear structures configured to be engaged with the first outer gear structures. The second rigid gear has a plurality of second inner gear structures configured to be engaged with the second outer gear structures. A first intersection line is defined between each of the first inner gear structures and a sectional surface. An angle between the first intersection line and a first horizontal line is within a range from 0.1 degrees to 5 degrees.

Abstract: A harmonic speed reducer is provided. The harmonic speed reducer includes a wave generator, a flexible gear, a first rigid gear, and a second rigid gear. The wave generator can be driven to rotate relative to a central axis. The flexible gear has a plurality of first outer gear structures, a division groove, and a plurality of second outer gear structures. The first rigid gear has a plurality of first inner gear structures configured to be engaged with the first outer gear structures. The second rigid gear has a plurality of second inner gear structures configured to be engaged with the second outer gear structures. A first intersection line is defined between each of the first inner gear structures and a sectional surface. An angle between the first intersection line and a first horizontal line is within a range from 0.1 degrees to 5 degrees.

Abstract: A harmonic deceleration module, a dynamic power device, an automatic mobile vehicle, a transfer apparatus, a dynamic power supply system, and an electric bicycle are provided. The harmonic deceleration module includes a connecting member, a flexible bearing, a first frame, a first circular spline, a second frame, and a second circular spline. When the connecting member is driven, the connecting member rotates around a central axis. The connecting member has a cam part, and the cam part and the flexible bearing jointly form a wave generator. The wave generator is configured to be driven by the connecting member to drive a flexspline to continually and flexibly deform, and the flexspline drives the second circular spline and the second frame connected to the second circular spline to rotate. The second frame has a hollow channel penetrating through the second frame along the central axis.

Abstract: A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring a photoelectric characteristic value of each of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic value of each of the plurality of chips; providing a second load-bearing structure; weakening a first adhesion between the first portion chips and the first load-bearing structure or between the second portion chips and the first load-bearing structure; and transferring the first portion chips or the second portion chips to the second load-bearing structure.

Abstract: A transferring chips method, including providing a plurality of chips on a first load-bearing structure; dividing the first load-bearing structure into a plurality of blocks, and each of the plurality of blocks including multiple chips of the plurality of chips; measuring a characteristic value of each of the plurality of chips; respectively calculating an average characteristic value of each of the plurality of blocks based on the characteristic values of the multiple chips of each of the plurality of blocks; and transferring the multiple chips of at least two blocks of the plurality of blocks with the average characteristic values within the same range to a second load-bearing structure.

Abstract: A method of processing light-emitting elements includes: transferring a plurality of light-emitting elements from original wafers or next-stage carriers, based on a predetermined pattern. The predetermined pattern arranges two adjacent LED groups in a first direction on the original wafer or carriers to be placed on two non-adjacent positions in the first direction on the next-stage carriers. The light-emitting elements on the original wafer have a horizontal wafer pitch and a vertical wafer pitch. The light-emitting elements on each of the next-stage carriers have a first horizontal pitch and a first vertical pitch. The first horizontal pitch is greater than the horizontal wafer pitch, or the first vertical pitch is greater than the vertical wafer pitch. Besides, a light-emitting element device using the aforementioned method is also provided.

Abstract: A transferring chips method, including providing a plurality of chips on a first load-bearing structure; dividing the first load-bearing structure into a plurality of blocks, and each of the plurality of blocks including multiple chips of the plurality of chips; measuring a characteristic value of each of the plurality of chips; respectively calculating an average characteristic value of each of the plurality of blocks based on the characteristic values of the multiple chips of each of the plurality of blocks; and transferring the multiple chips of at least two blocks of the plurality of blocks with the average characteristic values within the same range to a second load-bearing structure.