Abstract: In general, in one aspect, the disclosure describes accessing multiple memory access commands from a one of multiple memory access command queues associated with, respective, banks of a Random Access Memory (RAM) and selecting one of the commands based, at least in part, on the memory access operations identified by the commands and the memory access operation of a previously selected memory access command

Abstract: A semiconductor package including a flexible multichip module having multiple chips on flexible appendages with the flexible appendages folded so that the semiconductor chips are arranged in aligned and stacked positions.

Abstract: Systems and methods are disclosed for aligning data in memory access and other applications. In one embodiment, a group of data is obtained for storage in a memory unit. The memory unit has two banks. If the data is aligned, a first portion of the data is written to the first memory bank and a second portion is written to the second memory bank. If the data is not aligned, the first portion is written to the second memory bank and the second portion is written to the first memory bank. In one embodiment, the data is written to the first and second memory banks in a substantially simultaneous manner.

Abstract: In general, in one aspect, the disclosure describes techniques that can provide a processor with access to memory controllers via logic to receive memory access commands from the processor, allocate buffer(s) for the commands, and send a memory access command to the appropriate memory controller that includes identifier(s) associated with the allocated buffers. After the logic receives a reply from the memory controller, the logic sends the processor data stored in the buffer(s).

Abstract: A system and method of arbitrating data return between simultaneous replies while maintaining priority over later replies is provided. The method includes receiving data in a plurality of priority buffers, detecting when two or more of the buffers are ready to read, storing unique identifications of the read-ready buffers in an order queue according to a priority of the buffer in which they are stored, and reading the unique identifications in the order queue in a first-in-first-out order.

Abstract: This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

Abstract: This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

Abstract: A socket wrench is provided With a lighting device. The socket wrench has a handle, and a grip body which is provided at one end with a fitting hole and at another end with a plugging hole. The grip body is further provided in the underside of one end thereof with a base and a rotary body which is pivoted with the base and provided with two rotary shafts, with each being fastened to a dial button. The rotary body is provided with two through holes in which two light-emitting elements are disposed such that the two light-emitting elements are connected with two battery sets by two elastic bonding wires. The base is provided in the bottom with a transparent cover to shield the light-emitting elements.

Abstract: A lighting structure of a socket wrench including a rotary seat which is fastened a housing seat of a handle body of the socket wrench. The rotary seat has a rotary shaft which is pivotally disposed in two pivoting slots of the housing seat and is fastened at both ends to a rotary knob. The rotary seat is fastened to a light-emitting element and a light focusing shield and is provided with two elastic bonding wires connecting the light-emitting element and a battery set disposed in a plug hole of the handle body of the socket wrench. The light-emitting element is adjusted by the rotary knob to emit light at a desired angle. The housing seat is provided with a transparent protective plate to shield the light-emitting element.

Abstract: A ratchet screwdriver comprises a handle, a ratchet seat body, a rotary shaft rod, a stop plate, an anti-reverse plate, a dial knob seat, a recovery spring, a housing, a lock member, and a screw tip. The ratchet seat body is provided with a slide slot which is in turn provided with two slide edges capable of sliding back and forth along with the anti-reverse plate to support two gears mounted on the rotary shaft rod, thereby making the assembly of the ratchet screwdriver relatively simple.

Abstract: A new method is provided for high-density thin film interconnect processing. A thin layer of epoxy is deposited over a substrate surface, a via pattern is created in the epoxy layer, the surface of the epoxy is subjected to a process of swell and etch. A metal plating base is formed on the surface of the dielectric using electroless seeding for the metal deposition. A layer of photoresist is deposited over the plating base and is patterned and etched to create the pattern of the interconnect lines. Semi-additive plating of the interconnect pattern is performed to the plating base. The photoresist is removed. The plating base is removed from between the pattern of the interconnect lines using micro etching thereby creating the interconnect lines. A layer of dielectric is deposited over the surface of the created layer of interconnect lines. A via pattern is created in the dielectric layer. The process may be repeated more than once. Electrical contacts are made to the top metal pads through the top vias.

Abstract: A socket wrench including a handle, a socket, and a handle body which is provided at a front end thereof with a clamping cell having a pivoting slot. The pivoting slot is provided with a guide slot and a rotary member having a shaft rod and a light bulb opening in which an illuminating element is disposed such that two pins of the illuminating element extend toward the rotary member, and that two pins are connected with two conductive annular members which are fitted over the rotary member. The conductive piece of the plug body is extended into the clamping cell by an extension guide body which is forced by a resilient element to become attached to the conductive annular member of the rotary member, thereby enabling the rotary member to adjust an angle at which the illuminating element illuminates.

Abstract: A socket wrench having an angular adjustment of a light-emitting device of the socket wrench. The angular adjustment includes a conductive tension element, a conductive ring member, a conductive cylindrical member, a press control element, and a rotation frame. The illumination of the light-emitting device can be adjusted in angular position in accordance with the position of the socket of the socket wrench.

Abstract: A socket wrench including a socket, a handle, and a handle body in which an illuminating element is disposed. The handle is provided with a threaded hole and a threaded rod which is engaged with the threaded hole. The illuminating element has an extension guide body with is put through a swiveling tube capable of being actuated by the threaded rod to adjust the illuminating angle of the illuminating element in relation to the position level of the socket of the socket wrench.

Abstract: A multicolored handle including a main body which is provided with a plurality of receiving slots in which a plurality of colored blocks and retaining rings are held securely in place such that the colored blocks and the retaining rings are level with the outer surface of the main body. The main body is different in color from the colored block and the retaining ring. The colored block is different in color from the retaining ring.

Abstract: A screwdriver includes a handle, a shank, and a locating seat which is provided with a plurality of receiving holes for receiving a tip. The shank is provided at the free end thereof with an opening for fastening the tip. The handle is provided with a through hole which is in communication with one of the receiving holes of the locating seat and is extended to reach the bottom end of the handle. The handle is further provided with a longitudinally-oriented slot in communication with the through hole. An expandable magnetic rod is received in one of the receiving holes, the through hole and the slot such that the expandable magnetic rod is fastened by a screw, and that a magnetic tip of the expandable magnetic rod is exposed from the seat. The handle is further provided with a cover.

Abstract: A screwdriver including a handle, a tip holder, a bushing, two first guide wires, two second guide wires, two luminous elements, a coiled spring, a battery, a control switch, and an end cap. A circuit loop structure is formed of the first guide wires, the second guide wires, the coiled spring, the luminous elements, the battery, and the control switch. The circuit loop structure can be easily installed without being confined to one portion of the handle.

Abstract: A microelectronic packaging and interconnection apparatus and method in which dual ball bonds, metal bumps, or TAB bonds are formed by pulsed laser irradiation, but not conventional heating, compression or acoustic (e.g., ultrasonic) methods. A miniature loop forming tool is used to form a metallic wire loop, one end of which is welded to an IC bond pad while the other end of which is welded to an IC package bonding finger, thus forming ball bonds at both ends of the interconnection.