Patents by Inventor Chang-Zhi ZHONG

Chang-Zhi ZHONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11355675
    Abstract: A wavelength converting material includes a luminous core and a first protective layer. The first protective layer covers the luminous core, in which the first protective layer includes silicon dioxide, and in silicon atoms of the silicon dioxide, the silicon atom of the zeroth configuration (Q0) does not connect with any siloxy group, and the silicon atom of the first configuration (Q1) connects with one siloxy group, and the silicon atom of the second configuration (Q2) connects with two siloxy groups, and the silicon atom of the third configuration (Q3) connects with three siloxy groups, and the silicon atom of the fourth configuration (Q4) connects with four siloxy groups, in which a total amount of the silicon atoms of the third configuration and the fourth configuration is greater than a total amount of the silicon atoms of the zeroth configuration, the first configuration and the second configuration.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: June 7, 2022
    Assignee: Lextar Electronics Corporation
    Inventors: Chang-Zhi Zhong, Hung-Chun Tong, Yu-Chun Lee, Tzong-Liang Tsai
  • Patent number: 11245056
    Abstract: A wavelength converting material includes a luminous core and a first protective layer. The first protective layer covers the luminous core, and the first protective layer includes aluminum silicate. The aluminum silicate includes a plurality of silicon atoms, each of the silicon atoms is one of a zeroth configuration Q4(0Al), first configuration Q4(1Al), second configuration Q4(2Al), third configuration Q4(3Al), and fourth configuration Q4(4Al). The silicon atoms of the zeroth configuration do not connect with aluminum oxide group, and the silicon atoms of the first, second, third, and fourth configurations respectively connect with one, two, three, and four aluminum oxide group(s). A total number of the silicon atoms of the third configuration and the fourth configuration is larger than a total number of the silicon atoms of the zeroth configuration, the first configuration, and the second configuration.
    Type: Grant
    Filed: November 28, 2019
    Date of Patent: February 8, 2022
    Assignee: Lextar Electronics Corporation
    Inventors: Chang-Zhi Zhong, Hung-Chia Wang, Hung-Chun Tong, Yu-Chun Lee, Tzong-Liang Tsai
  • Publication number: 20210126167
    Abstract: A wavelength converting material includes a luminous core and a first protective layer. The first protective layer covers the luminous core, and the first protective layer includes aluminum silicate. The aluminum silicate includes a plurality of silicon atoms, each of the silicon atoms is one of a zeroth configuration Q4(0Al), first configuration Q4(1Al), second configuration Q4(2Al), third configuration Q4(3Al), and fourth configuration Q4(4Al). The silicon atoms of the zeroth configuration do not connect with aluminum oxide group, and the silicon atoms of the first, second, third, and fourth configurations respectively connect with one, two, three, and four aluminum oxide group(s). A total number of the silicon atoms of the third configuration and the fourth configuration is larger than a total number of the silicon atoms of the zeroth configuration, the first configuration, and the second configuration.
    Type: Application
    Filed: November 28, 2019
    Publication date: April 29, 2021
    Inventors: Chang-Zhi ZHONG, Hung-Chia WANG, Hung-Chun TONG, Yu-Chun LEE, Tzong-Liang TSAI
  • Publication number: 20200373467
    Abstract: A wavelength converting material includes a luminous core and a first protective layer. The first protective layer covers the luminous core, in which the first protective layer includes silicon dioxide, and in silicon atoms of the silicon dioxide, the silicon atom of the zeroth configuration (Q0) does not connect with any siloxy group, and the silicon atom of the first configuration (Q1) connects with one siloxy group, and the silicon atom of the second configuration (Q2) connects with two siloxy groups, and the silicon atom of the third configuration (Q3) connects with three siloxy groups, and the silicon atom of the fourth configuration (Q4) connects with four siloxy groups, in which a total amount of the silicon atoms of the third configuration and the fourth configuration is greater than a total amount of the silicon atoms of the zeroth configuration, the first configuration and the second configuration.
    Type: Application
    Filed: November 18, 2019
    Publication date: November 26, 2020
    Inventors: Chang-Zhi ZHONG, Hung-Chun TONG, Yu-Chun LEE, Tzong-Liang TSAI
  • Patent number: 10720555
    Abstract: A light emitting diode device includes a light emitting diode chip, a wavelength conversion layer including a bottom surface facing a top surface of the light emitting diode chip, and an interlayer having a first portion between the light emitting diode chip and a part of the bottom surface of the wavelength conversion layer, and a second portion extending from the first portion and connected between a remaining part of the bottom surface of the wavelength conversion layer and a side surface of the light emitting diode chip. The second portion has a side surface including a linear surface substantially aligning with a side surface of the wavelength conversion layer, and a curved surface having a first end connected to the linear surface and a second end connected to the side surface of the light emitting diode chip. The linear surface and the curved surface define a chamfer angle.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: July 21, 2020
    Assignee: LEXTAR ELECTRONICS CORPORATION
    Inventors: Hung-Chun Tong, Chang-Zhi Zhong, Fu-Hsin Chen, Yu-Chun Lee
  • Publication number: 20200127171
    Abstract: A light emitting diode device includes a light emitting diode chip, a wavelength conversion layer including a bottom surface facing a top surface of the light emitting diode chip, and an interlayer having a first portion between the light emitting diode chip and a part of the bottom surface of the wavelength conversion layer, and a second portion extending from the first portion and connected between a remaining part of the bottom surface of the wavelength conversion layer and a side surface of the light emitting diode chip. The second portion has a side surface including a linear surface substantially aligning with a side surface of the wavelength conversion layer, and a curved surface having a first end connected to the linear surface and a second end connected to the side surface of the light emitting diode chip. The linear surface and the curved surface define a chamfer angle.
    Type: Application
    Filed: November 28, 2018
    Publication date: April 23, 2020
    Inventors: Hung-Chun TONG, Chang-Zhi ZHONG, Fu-Hsin CHEN, Yu-Chun LEE
  • Publication number: 20200127174
    Abstract: A light emitting diode package includes a light emitting diode chip, a wavelength conversion layer, and a light attenuating layer. The light emitting diode chip emits a first light. The wavelength conversion layer includes a plurality of quantum dots. The light attenuating layer is disposed between the light emitting diode chip and the wavelength conversion layer. The light attenuating layer is configured to attenuate an intensity of the first light beam and then emits a second light beam which will be partially absorbed by the quantum dots. A wavelength of the first light beam is substantially the same wavelength of the second light beam.
    Type: Application
    Filed: November 23, 2018
    Publication date: April 23, 2020
    Inventors: Chang-Zhi ZHONG, Hung-Chun TONG, Yu-Chun LEE, Tzong-Liang TSAI