Patents by Inventor Chantal Combi
Chantal Combi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080179697Abstract: An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.Type: ApplicationFiled: January 4, 2008Publication date: July 31, 2008Applicants: STMicroelectronics S.r.I., STMicroelectronics (Malta) Ltd.Inventors: Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo
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Patent number: 7343805Abstract: A surface acoustic wave pressure sensor includes: a substrate and at least one flexible membrane, suspended over a cavity defined in the thickness of the substrate, the membrane being elastically deformable by a pressure applied by a fluid and being defined between a first surface facing the cavity and a second opposite surface; a SAW device comprising a layer of piezoelectric material arranged on the second surface of the membrane, the SAW device further comprising at least one SAW electro-acoustic transducer formed on one free surface of the piezoelectric layer. The piezoelectric layer is formed by deposition of piezoelectric material on the membrane and the substrate is integrated in a chip of semiconductor material, the membrane being a layer of the chip suspended over the cavity.Type: GrantFiled: September 14, 2006Date of Patent: March 18, 2008Assignee: STMicroelectronics S.r.l.Inventors: Chantal Combi, Simona Petroni, Anna Angela Pomarico, Lorenzo Baldo
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Patent number: 7322236Abstract: A manufacturing process of a semiconductor piezoresistive accelerometer includes the steps of: providing a wafer of semiconductor material; providing a membrane in the wafer over a cavity; rigidly coupling an inertial mass to the membrane; and providing, in the wafer, piezoresistive transduction elements, that are sensitive to strains of the membrane and generate corresponding electrical signals. The step of coupling is carried out by forming the inertial mass on top of a surface of the membrane opposite to the cavity. The accelerometer is advantageously used in a device for monitoring the pressure of a tire of a vehicle.Type: GrantFiled: January 24, 2006Date of Patent: January 29, 2008Assignee: STMicroelectronics S.r.l.Inventors: Chantal Combi, Lorenzo Baldo, Dino Faralli, Flavio Francesco Villa
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Publication number: 20080011090Abstract: Described herein is an assembly of an integrated device and of a cap coupled to the integrated device; the integrated device is provided with at least a first and a second region to be fluidically accessed from outside, and the cap has an outer portion provided with at least a first and a second inlet port in fluid communication with the first and second regions. In particular, the first and second regions are arranged on a first outer face, or on respective adjacent outer faces, of the integrated device, and an interface structure is set between the integrated device and the outer portion of the cap, and is provided with a channel arrangement for routing the first and second regions towards the first and second inlets.Type: ApplicationFiled: June 25, 2007Publication date: January 17, 2008Applicant: STMicroelectronics S.r.l.Inventors: Federico Giovanni Ziglioli, Chantal Combi, Lorenzo Baldo, Caterina Riva, Mark Andrew Shaw
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Publication number: 20070183116Abstract: A micro-electro-mechanical variable capacitor has a first and a second electrode, and a dielectric region arranged on the first electrode. An intermediate electrode is arranged on the dielectric region. The first electrode is fixed and anchored to a substrate, and the second electrode includes a membrane movable with respect to the first electrode according to an external actuation, in particular an electrostatic force due to an actuation voltage applied between an actuation electrode and the first electrode. The second electrode is suspended over the intermediate electrode in a first operating condition, and contacts the intermediate electrode in a second operating condition; in particular, in the second operating condition, a short-circuit is established between the second electrode and the intermediate electrode.Type: ApplicationFiled: January 24, 2006Publication date: August 9, 2007Applicant: STMicroelectronics S.r.l.Inventors: Chantal Combi, Andrea Rusconi Clerici Beltrami, Benedetto Vigna
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Patent number: 7242066Abstract: The method for manufacturing a micromechanical switch includes manufacturing a hanging bar, on a first semiconductor substrate, equipped at an end thereof with a contact electrode, and a frame projecting from the first semiconductor substrate. A second semiconductor substrate with conductive tracks includes a second input/output electrode and a third starting electrode, and first and second spacers electrically connected to the conductive tracks. The frame is abutted with the first spacers so that the fourth contact electrode abuts on the second input/output electrode in response to an electrical signal provided to the hanging bar by the third starting electrode.Type: GrantFiled: January 31, 2006Date of Patent: July 10, 2007Assignee: STMicroelectronics S.r.l.Inventors: Chantal Combi, Benedetto Vigna
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Publication number: 20070113658Abstract: A surface acoustic wave pressure sensor includes: a substrate and at least one flexible membrane, suspended over a cavity defined in the thickness of the substrate, the membrane being elastically deformable by a pressure applied by a fluid and being defined between a first surface facing the cavity and a second opposite surface; a SAW device comprising a layer of piezoelectric material arranged on the second surface of the membrane, the SAW device further comprising at least one SAW electro-acoustic transducer formed on one free surface of the piezoelectric layer. The piezoelectric layer is formed by deposition of piezoelectric material on the membrane and the substrate is integrated in a chip of semiconductor material, the membrane being a layer of the chip suspended over the cavity.Type: ApplicationFiled: September 14, 2006Publication date: May 24, 2007Applicant: STMICROELECTRONICS S.R.L.Inventors: Chantal Combi, Simona Petroni, Anna Pomarico, Lorenzo Baldo
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Publication number: 20070068779Abstract: In an input device, a control element is operated by a user; a pressure sensor is mechanically coupled to the control element and is provided with a monolithic body of semiconductor material housing a first sensitive element, which detects an actuation of the control element; a supporting element is connected to the pressure sensor; and connection elements electrically connect the monolithic body to the supporting element without interposition of a package. In particular, the monolithic body has electrical-contact areas carried by one main surface thereof, and the printed circuit board has conductive regions carried by a main face thereof; the connection elements are conductive bumps and electrically connect the electrical-contact areas to the conductive regions.Type: ApplicationFiled: September 8, 2006Publication date: March 29, 2007Applicant: STMICROELECTRONICS S.R.L.Inventors: Lorenzo Baldo, Chantal Combi, Dino Faralli
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Publication number: 20060262088Abstract: In a data-input device an actuator element that can be manually actuated, and a sensor mechanically coupled to the actuator element. The sensor is formed in a body of semiconductor material housing a first sensitive element, which detects the actuation of the actuator element and generates electrical control signals. The first sensitive element is a microelectromechanical pressure sensor, formed by: a cavity made within the body; a diaphragm made in a surface portion of the body and suspended above the cavity; and piezoresistive transducer elements integrated in peripheral surface portions of the diaphragm in order to detect its deformations upon actuation of the actuator element.Type: ApplicationFiled: March 30, 2006Publication date: November 23, 2006Applicant: STMicroelectronics S.r.l.Inventors: Lorenzo Baldo, Chantal Combi, Simone Sassolini, Marco Del Sarto
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Publication number: 20060185428Abstract: A manufacturing process of a semiconductor piezoresistive accelerometer includes the steps of: providing a wafer of semiconductor material; providing a membrane in the wafer over a cavity; rigidly coupling an inertial mass to the membrane; and providing, in the wafer, piezoresistive transduction elements, that are sensitive to strains of the membrane and generate corresponding electrical signals. The step of coupling is carried out by forming the inertial mass on top of a surface of the membrane opposite to the cavity. The accelerometer is advantageously used in a device for monitoring the pressure of a tire of a vehicle.Type: ApplicationFiled: January 24, 2006Publication date: August 24, 2006Applicant: STMicroelectronics S.r.l.Inventors: Chantal Combi, Lorenzo Baldo, Dino Faralli, Flavio Villa
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Publication number: 20060134821Abstract: The method for manufacturing a micromechanical switch includes manufacturing a hanging bar, on a first semiconductor substrate, equipped at an end thereof with a contact electrode, and a frame projecting from the first semiconductor substrate. A second semiconductor substrate with conductive tracks includes a second input/output electrode and a third starting electrode, and first and second spacers electrically connected to the conductive tracks. The frame is abutted with the first spacers so that the fourth contact electrode abuts on the second input/output electrode in response to an electrical signal provided to the hanging bar by the third starting electrode.Type: ApplicationFiled: January 31, 2006Publication date: June 22, 2006Applicant: STMicroelectronics S.r.I., State of Incorporation: ItalyInventors: Chantal Combi, Benedetto Vigna
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Patent number: 7022542Abstract: The method for manufacturing a micromechanical switch includes manufacturing a hanging bar, on a first semiconductor substrate, equipped at an end thereof with a contact electrode, and a frame projecting from the first semiconductor substrate. A second semiconductor substrate with conductive tracks includes a second input/output electrode and a third starting electrode, and first and second spacers electrically connected to the conductive tracks. The frame is abutted with the first spacers so that the fourth contact electrode abuts on the second input/output electrode in response to an electrical signal provided to the hanging bar by the third starting electrode.Type: GrantFiled: December 24, 2003Date of Patent: April 4, 2006Assignee: STMicroelectronics S.r.l.Inventors: Chantal Combi, Benedetto Vigna
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Patent number: 6869856Abstract: A process for manufacturing a semiconductor wafer integrating electronic devices and a structure for electromagnetic decoupling are disclosed. The method includes providing a wafer of semiconductor material having a substrate; forming a plurality of first mutually adjacent trenches, open on a first face of the wafer, which have a depth and a width and define walls); by thermal oxidation, completely oxidizing the walls and filling at least partially the first trenches, so as to form an insulating structure of dielectric material; and removing one portion of the substrate comprised between the insulating structure and a second face of the wafer, opposite to the first face of the wafer.Type: GrantFiled: October 29, 2002Date of Patent: March 22, 2005Assignee: STMicroelectronics S.r.l.Inventors: Chantal Combi, Matteo Fiorito, Marta Mottura, Giuseppe Visalli, Benedetto Vigna
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Publication number: 20040157364Abstract: The method for manufacturing a micromechanical switch includes manufacturing a hanging bar, on a first semiconductor substrate, equipped at an end thereof with a contact electrode, and a frame projecting from the first semiconductor substrate. A second semiconductor substrate with conductive tracks includes a second input/output electrode and a third starting electrode, and first and second spacers electrically connected to the conductive tracks. The frame is abutted with the first spacers so that the fourth contact electrode abuts on the second input/output electrode in response to an electrical signal provided to the hanging bar by the third starting electrode.Type: ApplicationFiled: December 24, 2003Publication date: August 12, 2004Applicant: STMicroelectronics S.r.l.Inventors: Chantal Combi, Benedetto Vigna
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Publication number: 20030113981Abstract: A process for manufacturing a semiconductor wafer integrating electronic devices and a structure for electromagnetic decoupling are disclosed. The method includes providing a wafer of semiconductor material having a substrate; forming a plurality of first mutually adjacent trenches, open on a first face of the wafer, which have a depth and a width and define walls); by thermal oxidation, completely oxidizing the walls and filling at least partially the first trenches, so as to form an insulating structure of dielectric material; and removing one portion of the substrate comprised between the insulating structure and a second face of the wafer, opposite to the first face of the wafer.Type: ApplicationFiled: October 29, 2002Publication date: June 19, 2003Applicant: STMicroelectronics S.r.I.Inventors: Chantal Combi, Matteo Fiorito, Marta Mottura, Giuseppe Visalli, Benedetto Vigna