Patents by Inventor Chao-Chia Chang

Chao-Chia Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190363436
    Abstract: A communication apparatus is provided. A retaining wall structure electrically connected with a ground plane is disposed between a main circuit board and an antenna. A retaining wall part of the retaining wall structure has a thickness. A distance between the retaining wall part and the main circuit board is a first distance, and a distance between the retaining wall part and the antenna and is a second distance. A distance between the retaining wall and a shielding metal plate is a third distance. The projection of the antenna projected toward the retaining wall in the orthogonal projection direction falls on the retaining wall part.
    Type: Application
    Filed: March 25, 2019
    Publication date: November 28, 2019
    Inventors: Chien-Yi Wu, Huan-Chia Chang, Chao-Hsu Wu, Shih-Keng Huang, Chia-Chou Tsai, Yu-Yi Chu
  • Patent number: 10444912
    Abstract: A stretchable sensing device includes at least one first unit structure, at least one second unit structure and a stretchable material layer. The first unit structure includes a first substrate and a first sensing element layer, wherein the first substrate includes multiple first slits and multiple first distribution regions defined by the first slits. The first sensing element layer includes multiple first sensing electrodes being electrically isolated to each other and located on the first substrate. The second unit structure is located on the first unit structure and includes a second substrate and a second sensing element layer located on the second substrate. The stretchable material layer is located between the first unit structure and the second unit structure, and provides a changeable spacing between at least two of the first sensing electrodes located on adjacent first distribution regions. A sensing method of the stretchable sensing device is also provided.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: October 15, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Sheng-Po Wang, Chih-Chia Chang, Chao-Jen Wang
  • Patent number: 10426026
    Abstract: According to an embodiment of the present disclosure, a structure constructed by a sheet includes a sheet body. The sheet body has a plurality of enclosed paths. A plurality of slits and connection portions are arranged along each enclosed path. Each connection portion is located between two adjacent slits. The sheet body is flexible. In an extended state, the slits form extended openings. At least one extended opening is a symmetric opening, so that the sheet body is extended to form a structure constructed by sheet. The structure constructed by sheet forms a stereoscopic curved surface, and the plurality of connection portions is located on a plurality of contours of the stereoscopic curved surface.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: September 24, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Chao-Jen Wang, Chih-Chia Chang, Chiung-Hsun Hsieh
  • Publication number: 20020182773
    Abstract: A method for bonding inner leads of lead frame to substrate includes the steps of: (a) providing a substrate, the substrate having a plurality of connection pads formed on the electrical bonding surface of the substrate; (b) providing a lead frame with a dam tape adhered on of the inner leads of the lead frame; (c) thermally compressing the inner leads of lead frame onto the substrate, wherein a solder material is formed between the inner end and the corresponding connection pad of the substrate and the solder material is limited by the dam tape during inner lead bonding, so that there is stable electrical and mechanical connection between inner leads and the substrate.
    Type: Application
    Filed: June 4, 2001
    Publication date: December 5, 2002
    Applicant: Walsin Advanced Electronics LTD
    Inventors: Chun-Jen Su, Chien-Hung Lai, Chien-Tsun Lin, Chao-Chia Chang
  • Patent number: 6437429
    Abstract: A semiconductor package is disclosed, such as QFN, SON. The semiconductor package includes a die, a package body for protection of a die, and a plurality of leads. A metal pad formed by some partial downside surface of each lead is located on a downside surface of the package body with coplanarity. Each lead has a cutting surface exposed on a corresponding lateral surface of the package body. The cutting surface has an interval with the plane of forming the metal pads by means of selectively self-etching the leads or stamping to bend the leads in order to avoid forming a cutting sharp edge in the brim of the metal pad after cutting.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: August 20, 2002
    Assignee: Walsin Advanced Electronics Ltd
    Inventors: Chun-Jen Su, Chien-Hung Lai, Chien-Tsun Lin, Chao-Chia Chang, Yu-Hsien Su, Ming-Hui Tseng