Patents by Inventor Chao-Hsien Huang

Chao-Hsien Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190067441
    Abstract: In a method of manufacturing a semiconductor device, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. A source/drain region of the fin structure, which is not covered by the sacrificial gate structure, is etched, thereby forming a source/drain space. The first semiconductor layers are laterally etched through the source/drain space. A first insulating layer is formed, in the source/drain space, at least on etched first semiconductor layers. A source/drain epitaxial layer is formed in the source/drain space, thereby forming air gaps between the source/drain epitaxial layer and the first semiconductor layers.
    Type: Application
    Filed: October 5, 2017
    Publication date: February 28, 2019
    Inventors: Yu-Lin YANG, Tung Ying LEE, Shao-Ming YU, Chao-Ching CHENG, Tzu-Chiang CHEN, Chao-Hsien HUANG
  • Patent number: 10157751
    Abstract: A method for manufacturing a semiconductor device, including forming a first hard mask strip, a second hard mask strip, and a dummy structure over a substrate, in which the dummy structure is formed between and in contact with the first hard mask strip and the second hard mask strip; forming a hard mask layer over the first hard mask strip, the dummy structure, and the second hard mask strip; patterning the hard mask layer to form an opening exposing the first hard mask strip and the dummy structure, and partially exposing the second hard mask strip; and performing an etching process to remove the first hard mask strip and form a recess in the second hard mask strip, in which the performing the etching process includes forming a polymer in the recess.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: December 18, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jung-Hao Chang, Chao-Hsien Huang, Wen-Ting Lan, Shi-Ning Ju, Li-Te Lin, Kuo-Cheng Ching
  • Publication number: 20180003441
    Abstract: A method for manufacturing a nickel-titanium alloy includes steps of: placing a titanium material on a first bracket, and placing a nickel material on a second bracket; vacuumizing the vacuum confined space of the melting chamber to below a pressure of 10?5 Torr, and lifting up the titanium material placed on the first bracket to a working area of an induction coil; introducing inert gases; starting the induction coil, to make the titanium material in a levitation state and electromagnetically stirred and heated; dropping the first bracket; measuring whether the temperature of the working area of the induction coil reaches a predetermined temperature range; when the first active metal is in the half molten state, dropping the nickel material placed on the second bracket to be added to the titanium material, and obtaining a homogenizing nickel-titanium alloy by means of electromagnetic stirring and heating; and recycling the homogenizing nickel-titanium alloy.
    Type: Application
    Filed: November 22, 2016
    Publication date: January 4, 2018
    Inventors: Chao-Hsien HUANG, Weng-Sing HWANG, Guan-Ping QI, Chien-Tzu CHENG, Yu-Ting HUNG
  • Publication number: 20180002782
    Abstract: An device for manufacturing an active alloy includes: a melting chamber including: a working pipe surrounded by an induction coil and forming a working area; a chamber base disposed below the working pipe and communicated with the working pipe, and including: a gas inlet hole; a vacuum pump connection port; and a vacuum sensor, for measuring a vacuum degree in the working pipe; a chamber door communicated with the chamber base; a first bracket passing through the chamber base, and moving towards a direction away from or near the working area; a second bracket extending into the working pipe, and moving towards a direction away from or near the working area; and a material recycling seat which can extend into the chamber base in a push and pull way.
    Type: Application
    Filed: November 22, 2016
    Publication date: January 4, 2018
    Inventors: Chao-Hsien HUANG, Weng-Sing HWANG, Guan-Ping QI, Chien-Tzu CHENG, Yu-Ting HUNG
  • Patent number: 7198479
    Abstract: An ejector with multi-ejection pins is used in the post-processes of the semiconductor industry and is used by a selection device to choose a predetermined quantity of ejection pins. When a propelling device lifts the selection device, a pin-base vertical driver controls the vertical motion of a pin base, and a pin-base motion device controls the planar motion of the pin base; the chosen ejection pins can be lifted to elevate the respective dies for separation from adhesive film.
    Type: Grant
    Filed: November 4, 2004
    Date of Patent: April 3, 2007
    Assignee: Industrial Technology Research Institute
    Inventors: Weng-Jung Lu, Chao-Hsien Huang, Kuo-Chung Huang, Hung-I Lin, Ying-Fang Chang
  • Publication number: 20060093698
    Abstract: An ejector with multi-ejection pins is used in the post-processes of the semiconductor industry and is used by a selection device to choose a predetermined quantity of ejection pins. When a propelling device lifts the selection device, a pin-base vertical driver controls the vertical motion of a pin base, and a pin-base motion device controls the planar motion of the pin base; the chosen ejection pins can be lifted to elevate the respective dies for separation from adhesive film.
    Type: Application
    Filed: November 4, 2004
    Publication date: May 4, 2006
    Inventors: Weng-Jung Lu, Chao-Hsien Huang, Kuo-Chung Huang, Hung-I Lin, Ying-Fang Chang
  • Patent number: 6626280
    Abstract: A tray-positioning device comprises a driving unit and a positioning unit, wherein the positioning unit provides a plurality of sidewalls that correspond to a plurality of upper sidewalls of a tray. By allowing the driving unit to move the positioning unit toward the tray or vice versa that said individual upper sidewalls are in close contact with the corresponding sidewalls, the tray-positioning device is capable of providing precise positioning for the tray.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: September 30, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Weng-Jung Lu, Chin-Yuan Liu, Shyan-Haur Jane, Chun-Kuei Lai, Chao-Hsien Huang, Chih-Min Lin
  • Patent number: 6592325
    Abstract: An air-suspended die sorter is disclosed, in particular an air-suspended die sorter capable of performing die sorting, die attaching and die pick-up in the semiconductor industry. The present invention provides an air-suspended die sorter capable of eliminating spring preload, and lowering mechanical friction so as to lift die sorting precision and elevate the success rate, and has a cylinder unit, a piston unit and a pressure unit. The piston type design and a precise control of pressure on top and on bottom of the piston, respectively, enables the present invention to offer an air-suspended state that has done away with stress problems associated with the use of springs. The present invention further provides a novel buffer design for reducing friction and die impact often encountered in prior art applications.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: July 15, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Weng-Jung Lu, Chin-Yuan Liu, Shyan-Haur Jane, Chun-Kuei Lai, Chao-Hsien Huang, Chih-Min Lin
  • Publication number: 20030015459
    Abstract: An air-suspended die sorter is disclosed, in particular an air-suspended die sorter capable of performing die sorting, die attaching and die pick-up in the semiconductor industry. The present invention provides an air-suspended die sorter capable of eliminating spring preload, and lowering mechanical friction so as to lift die sorting precision and elevate the success rate, and has a cylinder unit, a piston unit and a pressure unit. The piston type design and a precise control of pressure on top and on bottom of the piston, respectively, enables the present invention to offer an air-suspended state that has done away with stress problems associated with the use of springs. The present invention further provides a novel buffer design for reducing friction and die impact often encountered in prior art applications.
    Type: Application
    Filed: June 25, 2001
    Publication date: January 23, 2003
    Applicant: Industrial Technology Research Institute
    Inventors: Weng-Jung Lu, Chin-Yuan Liu, Shyan-Haur Jane, Chun-Kuei Lai, Chao-Hsien Huang, Chih-Min Lin
  • Patent number: 6505528
    Abstract: The invention is a device for fast taking out and putting in, especially the device can fast take out a chip from a wafer to put in another chip receptacle, wherein, the invention includes a gear set, which consists of a first big gear, a second big gear and a small gear; at least two driving device, which consists a first driving device and a second driving device; a link mechanism, which cooperates with the gear set to proceed that the link mechanism moves forth toward a non-horizontal direction and back toward the reverse direction, and moves down toward a non-vertical direction and up toward the reverse direction as well; a lift mechanism, which is driven by the first driving device, and a mold plate with gear set and link mechanism is then driven either to complete the actions of moving down toward a non-vertical direction and up toward the reverse direction as mentioned above.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: January 14, 2003
    Assignee: Industrial Technology Research Corp.
    Inventors: Weng-Jung Lu, Chin-Yuan Liu, Yuan-Tsu Wan, Chun-Kuei Lai, Chao-Hsien Huang, Chih-Min Lin, Chun-Hsien Liu
  • Publication number: 20020189380
    Abstract: The invention is a device for fast taking out and putting in, especially the device can fast take out a chip from a wafer to put in another chip receptacle, wherein, the invention includes a gear set, which consists of a first big gear, a second big gear and a small gear; at least two driving device, which consists a first driving device and a second driving device; a link mechanism, which cooperates with the gear set to proceed that the link mechanism moves forth toward a non-horizontal direction and back toward the reverse direction, and moves down toward a non-vertical direction and up toward the reverse direction as well; a lift mechanism, which is driven by the first driving device, and a mold plate with gear set and link mechanism is then driven either to complete the actions of moving down toward a non-vertical direction and up toward the reverse direction as mentioned above.
    Type: Application
    Filed: June 15, 2001
    Publication date: December 19, 2002
    Applicant: Industrial Technology Research Institute
    Inventors: Weng-Jung Lu, Chin-Yuan Liu, Yuan-Tsu Wan, Chun-Kuei Lai, Chao-Hsien Huang, Chih-Min Lin, Chun-Hsien Liu
  • Publication number: 20020179408
    Abstract: A tray-positioning device comprises a driving unit and a positioning unit, wherein the positioning unit provides a plurality of sidewalls that correspond to a plurality of upper sidewalls of a tray. By allowing the driving unit to move the positioning unit toward the tray or vice versa that said individual upper sidewalls are in close contact with the corresponding sidewalls, the tray-positioning device is capable of providing precise positioning for the tray.
    Type: Application
    Filed: May 31, 2001
    Publication date: December 5, 2002
    Applicant: Industrial Technology Research Institute
    Inventors: Weng-Jung Lu, Chin-Yuan Liu, Shyan-Haur Jane, Chun-Kuei Lai, Chao-Hsien Huang, Chih-Min Lin