Abstract: A method for healing phase-change memory device includes steps as follows: At least one memory cell comprising a phase-change material with a shifted current-resistance characteristic function (shifted I-R function) is firstly provided. A healing stress is then applied to the phase-change material to transform the shifted I-R function into an initial current-resistance characteristic function (initial I-R function), wherein the shifted I-R function is a translation function of the initial I-R function.

Abstract: A method and a system for programming a multi-level cell (MLC) memory are provided. A first count is 1 initially. The method comprises the following steps. A first energy is set. The first energy is applied to alter a resistance of a cell of the MLC memory. The first count is increased by 1 after performing the step of applying the first energy. In the step of setting the first energy, the first energy is a ? ? first ? ? initial ? ? energy a ? ? predetermined ? ? value initially and the first energy is changed by increasing or decreasing the ? ? first ? ? initial ? ? energy the ? ? predetermined ? ? value the ? ? first ? ? count .

Abstract: A first memory cell including a phase change material. The first memory cell is programmable to store one data value of a plurality of data values. The plurality of data values are represented by a plurality of non-overlapping ranges of resistance of the first memory cell. At least one testing pulse is applied to the first memory cell to establish a cell resistance of the first memory cell in an intermediate range of resistance, the intermediate range of resistance in between first and second adjacent ranges in the plurality of non-overlapping ranges of resistance representing the plurality of data values. After applying the at least one testing pulse to the first memory cell, it is determined whether to apply at least one healing pulse to repair the first memory cell, depending on relative values of (i) the cell resistance in the intermediate range of resistance and (ii) a reference resistance in the intermediate range of resistance.

Abstract: A device includes first and second pluralities of memory cells with memory elements and first and second capping materials on the first and second pluralities of memory cells. First and second capping materials can comprise lower and higher density silicon nitrides. The memory elements can include a programmable resistance memory material, and the capping materials can contact the memory elements. The first and second pluralities of memory cells can have a common cell structure. The first memory cells in the can comprise a top and bottom electrodes with a memory material therebetween and the first capping material contacting the memory material. Control circuits can apply different write algorithms to the first and second pluralities of memory cells. The first and second sets of memory cells can have different operational memory characteristics by forming the first and second capping layers using different capping materials but with the same cell structure.

Abstract: An integrated circuit phase change memory can be pre-coded by inducing a first resistance state in some cells and the memory, and a second resistance state and some other cells in the memory to represent a data set. The integrated circuit phase change memory is mounted on a substrate after coding the data set. After mounting the integrated circuit phase change memory, the data set is read by sensing the first and second resistance states, and changing cells in the first resistance state to a third resistance state and changing cells in the second resistance state to a fourth resistance state. The first and second resistance states maintain a sensing margin after solder bonding or other thermal cycling process. The third and fourth resistance states are characterized by the ability to cause a transition using higher speed and lower power, suitable for a mission function of a circuit.

Abstract: A memory device and associated controlling method are provided. The memory device includes a memory cell array, a sensing unit and a controller. The memory cell array has a plurality of memory cells. The sensing unit is electrically connected to the memory cell array and the controller. The sensing unit senses characteristic of a memory cell of the plurality of memory cells. The controller determines whether the characteristic of the one of the memory cells deviates and accordingly controls the memory cell array.

Abstract: A first memory cell including a phase change material. The first memory cell is programmable to store one data value of a plurality of data values. The plurality of data values are represented by a plurality of non-overlapping ranges of resistance of the first memory cell. At least one testing pulse is applied to the first memory cell to establish a cell resistance of the first memory cell in an intermediate range of resistance, the intermediate range of resistance in between first and second adjacent ranges in the plurality of non-overlapping ranges of resistance representing the plurality of data values. After applying the at least one testing pulse to the first memory cell, it is determined whether to apply at least one healing pulse to repair the first memory cell, depending on relative values of (i) the cell resistance in the intermediate range of resistance and (ii) a reference resistance in the intermediate range of resistance.

Abstract: A method and a system for programming a multi-level cell (MLC) memory are provided. A first count is 1 initially. The method comprises the following steps. A first energy is set. The first energy is applied to alter a resistance of a cell of the MLC memory. The first count is increased by 1 after performing the step of applying the first energy. In the step of setting the first energy, the first energy is a ? ? first ? ? initial ? ? energy a ? ? predetermined ? ? value initially and the first energy is changed by increasing or decreasing the ? ? first ? ? initial ? ? energy the ? ? predetermined ? ? value the ? ? first ? ? count .

Abstract: A memory device and associated controlling method are provided. The memory device includes a memory cell array, a sensing unit and a controller. The memory cell has a plurality of memory cells. The sensing unit is electrically connected to the memory cell array and the controller. The sensing unit senses characteristic of a memory cell of the plurality of memory cells. The controller determines whether the characteristic of the one of the memory cells deviates and accordingly controls the memory cell array.

Abstract: A device includes first and second pluralities of memory cells with memory elements and first and second capping materials on the first and second pluralities of memory cells. First and second capping materials can comprise lower and higher density silicon nitrides. The memory elements can include a programmable resistance memory material, and the capping materials can contact the memory elements. The first and second pluralities of memory cells can have a common cell structure. The first memory cells in the can comprise a top and bottom electrodes with a memory material therebetween and the first capping material contacting the memory material. Control circuits can apply different write algorithms to the first and second pluralities of memory cells. The first and second sets of memory cells can have different operational memory characteristics by forming the first and second capping layers using different capping materials but with the same cell structure.

Abstract: A phase change memory (PCM), a writing method thereof and a reading method thereof are provided. The PCM has a plurality of memory cells. The writing method comprises the following steps. At least one stress pulse is applied for aging at least one of the memory cells. A starting pulse is applied to all of the memory cells of the PCM for decreasing a resistance of each memory cell. A detection pulse is applied to all of the memory cells of the PCM for detecting the resistance of each memory cell. A set pulse is applied to the aged memory cells. A reset pulse is applied to the non-aged memory cells.

Abstract: A cell sensing circuit for a phase changing memory and methods thereof are provided. A specific one of the proposed methods includes: providing a sensing circuit having a sense amplifier, and two identical stable currents respectively received by a reference cell and a target cell; establishing a cell voltage on a cell side and a reference voltage on a reference side respectively via the two identical stable currents; and using the sense amplifier to determine a logic state of the target cell based on a voltage difference between the reference voltage and the cell voltage.

Abstract: Phase change based memory devices and methods for operating such devices described herein overcome the set or reset failure mode and result in improved endurance, reliability and data storage performance. A high current repair operation is carried out in response to a set or reset failure of a phase change memory cell. The higher current repair operation can provide a sufficient amount of energy to reverse compositional changes in the phase change material which can occur after repeated set and reset operations. By reversing these compositional changes, the techniques described herein can recover a memory cell which experienced a set or reset failure, thereby extending the endurance of the memory cell. In doing so, phase change based memory devices and methods for operating such devices are provided which have high cycle endurance.

Abstract: A cell sensing circuit for a phase changing memory and methods thereof are provided. A specific one of the proposed methods includes: providing a sensing circuit having a sense amplifier, and two identical stable currents respectively received by a reference cell and a target cell; establishing a cell voltage on a cell side and a reference voltage on a reference side respectively via the two identical stable currents; and using the sense amplifier to determine a logic state of the target cell based on a voltage difference between the reference voltage and the cell voltage.

Abstract: An integrated circuit phase change memory can be pre-coded by inducing a first resistance state in some cells and the memory, and a second resistance state and some other cells in the memory to represent a data set. The integrated circuit phase change memory is mounted on a substrate after coding the data set. After mounting the integrated circuit phase change memory, the data set is read by sensing the first and second resistance states, and changing cells in the first resistance state to a third resistance state and changing cells in the second resistance state to a fourth resistance state. The first and second resistance states maintain a sensing margin after solder bonding or other thermal cycling process. The third and fourth resistance states are characterized by the ability to cause a transition using higher speed and lower power, suitable for a mission function of a circuit.

Abstract: A method of operating a non-volatile memory having a substrate, a gate, a charge-trapping layer, a source region and a drain region is provided. The charge-trapping layer close to the source region is an auxiliary charge region and the charge-trapping layer close to the drain region is a data storage region. Before prosecuting the operation, electrons have been injected into the auxiliary charge region. When prosecuting the programming operation, a first voltage is applied to the gate, a second voltage is applied to the source region, a third voltage is applied to the drain region and a fourth voltage is applied to the substrate. The first voltage is greater than the fourth voltage, the third voltage is greater than the second voltage, and the second voltage is greater than the fourth voltage to initiate a channel initiated secondary hot electron injection to inject electrons into the data storage region.

Abstract: An integrated circuit phase change memory can be pre-coded by inducing a first resistance state in some cells and the memory, and a second resistance state and some other cells in the memory to represent a data set. The integrated circuit phase change memory is mounted on a substrate after coding the data set. After mounting the integrated circuit phase change memory, the data set is read by sensing the first and second resistance states, and changing cells in the first resistance state to a third resistance state and changing cells in the second resistance state to a fourth resistance state. The first and second resistance states maintain a sensing margin after solder bonding or other thermal cycling process. The third and fourth resistance states are characterized by the ability to cause a transition using higher speed and lower power, suitable for a mission function of a circuit.

Abstract: A non-volatile memory cell may include a semiconductor substrate; a source region in a portion of the substrate; a drain region within a portion of the substrate; a well region within a portion of the substrate. The memory cell may further include a first carrier tunneling layer over the substrate; a charge storage layer over the first carrier tunneling layer; a second carrier tunneling layer over the charge storage layer; and a conductive control gate over the second carrier tunneling layer. Specifically, the drain region is spaced apart from the source region, and the well region may surround at least a portion of the source and drain regions. In one example, the second carrier tunneling layer provides hole tunneling during an erasing operation and may include at least one dielectric layer.

Abstract: The control circuit performs a reset operation and a set operation that change the resistance states of phase change memory cells of the array. The control circuit changes at least one parameter, of at least one of the reset operation and the set operation for future operations. This change is responsive to an indicator of degraded memory state retention of the array.

Abstract: A non-volatile VG memory array employing memory semiconductor cells capable of storing two bits of information having a non-conducting charge trapping dielectric, such as silicon nitride, layered in associating with at least one electrical insulating layer, such as an oxide, is disclosed. Bit lines of the memory array are capable of transmitting positive voltage to reach the source/drain regions of the memory cells of the array. A method that includes the hole injection erasure of the memory cells of the array that lowers the voltage threshold of the memory cells to a value lower than the initial voltage threshold of the cells is disclosed. The hole injection induced lower voltage threshold reduces the second bit effect such that the window of operation between the programmed and un-programmed voltage thresholds of the bits is widened. The programming and read steps reduce leakage current of the memory cells in the array.