Patents by Inventor Chao-Jung Chen

Chao-Jung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210223504
    Abstract: An optical system is provided. The optical system includes an immovable part, a second movable part, a second drive mechanism, and a second circuit mechanism. The second movable part is used for connecting to a second optical element. The second movable part is movable relative to the immovable part. The second drive mechanism is used for driving the second movable part to move relative to the immovable part. The second circuit mechanism is electrically connected to the second drive mechanism.
    Type: Application
    Filed: January 22, 2021
    Publication date: July 22, 2021
    Inventors: Chan-Jung HSU, I-Mei HUANG, Yi-Ho CHEN, Shao-Chung CHANG, Ichitai MOTO, Chen-Chi KUO, Ying-Jen WANG, Ya-Hsiu WU, Wei-Jhe SHEN, Chao-Chang HU, Che-Wei CHANG, Sin-Jhong SONG, Shu-Shan CHEN, Chih-Wei WENG, Chao-Hsi WANG
  • Patent number: 11070796
    Abstract: A video encoder and video decoder are configured to perform an ultimate motion vector expression (UMVE)-based pruning method which is used to prune motion vectors in a motion vector candidate list. The video encoder and video decoder may add one or more motion vector candidates to a candidate list for motion vector prediction for a current block of the video data, determine whether to add a next motion vector candidate to the candidate list based on a UMVE candidate of a respective candidate of the one or more candidates, and encode/decode the current block of the video data using the candidate list.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: July 20, 2021
    Assignee: Qualcomm Incorporated
    Inventors: Chao-Hsiung Hung, Chun-Chi Chen, Wei-Jung Chien, Marta Karczewicz
  • Publication number: 20210208643
    Abstract: An apparatus and method for engaging a mounting panel of a computer device includes a bracket, as well as a lever and slider mechanism connected to the bracket. The lever and slider mechanism includes a base, a wedge slider, a lever, a geared bar, and a biasing element. The base is connected to the bracket. The wedge slider is connected to the bracket and disposed immediately below the base. Rotating the lever from a first position to a second position causes a gear to engage the geared bar, causing the geared bar to move vertically. The rotating allows movement along the contact between an angled end of the geared bar and a wedged end protrusion of the wedge slider such that the biasing element pushes the wedge slider away from the bracket and allows the wedge slider to engage an opening in a mounting panel.
    Type: Application
    Filed: March 25, 2020
    Publication date: July 8, 2021
    Inventors: Chao-Jung CHEN, Chih-Wei LIN
  • Publication number: 20210208165
    Abstract: The present invention provides a biomarker, method and assay kit for identifying and screening nephropathy, particularly diabetic nephropathy, in a subject in need, or predicting diabetic nephropathy or early progressive renal function decline (ERFD) in a diabetic patient.
    Type: Application
    Filed: June 21, 2019
    Publication date: July 8, 2021
    Applicant: CHINA MEDICAL UNIVERSITY
    Inventors: Chao-Jung CHEN, Fuu-Jen TSAI
  • Patent number: 11049793
    Abstract: A heat sink having a flexible heat sink base is disclosed in order to flex the heat sink into contact with concave heat sources. Flexibility is achieved by providing a series of concentric grooves on the heat sink base on a surface opposite the surface contacting the heat source. A central cylinder is provided at the center of the concentric grooves. A biasing device, such as a spring, exerts a force on the central cylinder to flex the heat sink base.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: June 29, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Kuen-Hsien Wu, Shih-I Liang
  • Patent number: 10995771
    Abstract: The present disclosure provides an apparatus for a cooling fan in a computer system. The apparatus comprises a plurality of bars, a plurality of slats, a knob, and at least one pin. Each slat of the plurality of slats pivotably couples to at least one bar in the plurality of bars. The knob is located at an option on each of bar of a plurality of bars. Rotating movements of the knob adjust the apparatus between a plurality of positions. The at least one pin can be received at an opening in the cooling fan.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: May 4, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Hou-Hsien Chang
  • Patent number: 10989221
    Abstract: A cooling system includes a fan and a system component. The fan includes a plurality of fan blades and configured to rotate in a fan direction. The system component is located downstream of the fan, and includes a cutout for passing of airflow from the fan, and a bridge spanning the cutout. The bridge includes a center section and at least one arm section extending from the center section to an edge of the cutout along a curved path offset towards the fan direction.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: April 27, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Tsung-Ta Li
  • Publication number: 20210118860
    Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.
    Type: Application
    Filed: May 27, 2020
    Publication date: April 22, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Sheng-Tsai Wu, Yu-Min Lin, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen, Shin-Yi Huang
  • Publication number: 20210111153
    Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.
    Type: Application
    Filed: October 8, 2020
    Publication date: April 15, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Min Lin, Ang-Ying Lin, Sheng-Tsai Wu, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang, Yuan-Yin Lo
  • Publication number: 20210111126
    Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a wiring structure and an interposer via electrically connected to the wiring structure; a plurality of semiconductor chips located on a first surface of the interposer and electrically connected to each other through the interposer; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface, wherein the plurality of semiconductor chips are electrically connected to the redistribution circuit structure through at least the interposer.
    Type: Application
    Filed: October 8, 2020
    Publication date: April 15, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Ang-Ying Lin, Yu-Min Lin, Shin-Yi Huang, Sheng-Tsai Wu, Yuan-Yin Lo, Tzu-Hsuan Ni, Chao-Jung Chen
  • Publication number: 20210111125
    Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a dielectric body, a plurality of semiconductor bodies separated by the dielectric body, a through via penetrating through the dielectric body, and a wiring structure located in each of the plurality of semiconductor bodies; a plurality of semiconductor chips located side by side on a first surface of the interposer and electrically connected to the wiring structure; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface of the interposer and electrically connected to the plurality of semiconductor chips through the through via.
    Type: Application
    Filed: August 27, 2020
    Publication date: April 15, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Chao-Jung Chen, Yu-Min Lin, Sheng-Tsai Wu, Shin-Yi Huang, Ang-Ying Lin, Tzu-Hsuan Ni, Yuan-Yin Lo
  • Patent number: 10973149
    Abstract: A streamlined air baffle for efficiently directing air flow from a fan unit to a heat sink is disclosed. The streamlined air baffle has a top cover plate and a pair of side walls. The side walls are connected to the top cover plate. The top cover plate and one end of the side walls define an inlet. A curved surface of the top cover plate defines the outlet with the opposite ends of the side walls. The cross section area of the outlet is smaller than the cross section area of the inlet.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: April 6, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Herman Tan, Chih-Wei Lin
  • Publication number: 20210092877
    Abstract: An equipment assembly for cooling heat-generating electrical components is disclosed. The assembly includes a housing for containing a heat-generating electrical component. The housing includes an open end having a planar area. A closed-loop liquid cooling system includes a liquid coolant conduit in proximity to the heat-generating electrical component. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating electrical component. A heat exchanger is fluidly coupled to the liquid coolant conduit to extract heat from circulated liquid coolant within the heat exchanger. The heat exchanger includes a shaped front facing the open end of the housing. The surface area of the shaped front is greater than the planar area of the open end. An air flow system propels ambient air through the shaped front of the heat exchanger.
    Type: Application
    Filed: January 24, 2020
    Publication date: March 25, 2021
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Tsung-Ta LI, Kuo-Wei LEE
  • Publication number: 20210092868
    Abstract: A fan arrangement to generate increased airflow in a chassis is disclosed. The chassis includes one area having electronic components. A first row of fan modules is located in the chassis relative to the electronic components to generate airflow in a direction of the length of the chassis through the electronic components. The first row of fan modules includes at least one gap between the fan modules. A second row of fan modules is located a predetermined distance from the first row. The second row of fan modules includes at least one gap between the fan modules. Each of the fan modules in the second row is staggered from one of the fan modules of the first row. A first panel connects one of fan modules in the first row with one of the fan modules of the second row to create a channel.
    Type: Application
    Filed: January 15, 2020
    Publication date: March 25, 2021
    Inventors: Chao-Jung CHEN, Yu-Nien Huang, Tsung-Ta LI, Kuo-Wei LEE
  • Publication number: 20210092879
    Abstract: A cold plate assembly for cooling heat-generating electrical component on a circuit board is disclosed. The cold plate assembly includes a cold plate with a bottom contact surface to thermally contact the heat-generating electrical component. The cold plate has an inlet coupler on an opposite top surface to receive coolant; an internal conduit to circulate the received coolant; and an outlet coupler on the opposite top surface to return the coolant. A flexible metal inlet tube is fluidly connected to the inlet coupler to supply coolant. A flexible metal outlet tube is fluidly connected to the outlet coupler to return coolant.
    Type: Application
    Filed: January 24, 2020
    Publication date: March 25, 2021
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Tsung-Ta LI, Kuo-Wei LEE
  • Patent number: 10959352
    Abstract: A cooling unit having two single piece cold plate pipe components is disclosed. The cooling unit has a first pipe operable to transport coolant. A first cold plate has a top surface with a lateral groove to accept a section of the first pipe. The groove includes a first inlet coupled to a first hole in the section of the first pipe. The groove has a first outlet coupled to a second hole in the section of the first pipe. Coolant is circulated from the first inlet through the cold plate to the first outlet. The section of the first pipe is connected to the first cold plate. A second pipe is operable to transport coolant. A second cold plate is located next to the first cold plate. The second cold plate has a groove to accept a section of the second pipe. The groove includes an inlet coupled to a first hole in the section of the second pipe. The groove includes an outlet coupled to a second hole in the section of the second pipe.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: March 23, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Tsung-Ta Li, Chien-Hu Chen
  • Patent number: 10952354
    Abstract: A cold plate assembly for cooling heat-generating electrical component on a circuit board is disclosed. The cold plate assembly includes a cold plate with a bottom contact surface to thermally contact the heat-generating electrical component. The cold plate has an inlet coupler on an opposite top surface to receive coolant; an internal conduit to circulate the received coolant; and an outlet coupler on the opposite top surface to return the coolant. A flexible metal inlet tube is fluidly connected to the inlet coupler to supply coolant. A flexible metal outlet tube is fluidly connected to the outlet coupler to return coolant.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: March 16, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Tsung-Ta Li, Kuo-Wei Lee
  • Patent number: 10939581
    Abstract: An immersion liquid cooling tank rack for heat-generating components includes immersion liquid cooling tanks for containing a coolant liquid. Horizontal extendable slide rails are mounted on opposing side faces of each tank and on opposing side walls of the rack. The horizontal extendable slide rails are movable between a closed position and an extended open position to allow the tanks to slide horizontally in and out of the rack. Support structures are mounted to the base of each of the immersion liquid cooling tanks. Each support structure includes a wheel assembly disposed at the base of the support structure. The support structures extend from the base of the tank to a floor surface supporting the rack. The horizontal extendable slide rails and the support structures substantially support an operational immersion liquid cooling tank during a horizontal translation of the tank between the closed position and the extended open position.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: March 2, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Yung-Hsiang Lu
  • Patent number: 10921070
    Abstract: The present disclosure describes a connector assembly for a liquid manifold within a server rack. The connector assembly includes a pipe configured to connect to the liquid manifold. The pipe has a flexible portion configured to accommodate at least one of lateral or vertical manipulation of the pipe while the pipe remains connected to the liquid manifold. The connector assembly further includes a first connector and a second connector configured to form a liquid-tight connection when coupled together. One of the first connector and the second connector is connected to a distal end of the pipe. The other of the first connector and the second connector is configured to connect to a component within the server rack, for supplying coolant from the liquid manifold to the component.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: February 16, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Chih-Hsiang Lee, Chih-Ming Chen, Yen-Yu Liu
  • Publication number: 20210037670
    Abstract: A protective cover is provided in which connectors on a distal end of a motherboard are protected with the protective cover in a closed configuration. Sliding the motherboard into position within a chassis with the protective cover in the closed configuration automatically causes the protective cover to assume an open configuration, thereby exposing the connectors. Withdrawing the motherboard from the chassis results in automatically closing the protective cover through the operation of biasing elements (e.g., springs) that bias the protective cover into a normally closed configuration.
    Type: Application
    Filed: January 14, 2020
    Publication date: February 4, 2021
    Inventors: Chao-Jung CHEN, Hou-Hsien CHANG