Abstract: SRAM designs based on GAA transistors are disclosed that provide flexibility for increasing channel widths of transistors at scaled IC technology nodes and relax limits on SRAM performance optimization imposed by FinFET-based SRAMs. GAA-based SRAM cells described have active region layouts with active regions shared by pull-down GAA transistors and pass-gate GAA transistors. A width of shared active regions that correspond with the pull-down GAA transistors are enlarged with respect to widths of the shared active regions that correspond with the pass-gate GAA transistors. A ratio of the widths is tuned to obtain ratios of pull-down transistor effective channel width to pass-gate effective channel width greater than 1, increase an on-current of pull-down GAA transistors relative to an on-current of pass-gate GAA transistors, decrease a threshold voltage of pull-down GAA transistors relative to a threshold voltage of pass-gate GAA transistors, and/or increases a ? ratio of an SRAM cell.

Abstract: The present disclosure relates to a rack unit for circulating coolant to equipment racks. The rack unit has a cold coolant manifold for supplying coolant to an electronic component such as a server. The rack unit has a pump fluidly coupled to the cold coolant manifold for circulating the coolant. The rack unit has a hot coolant manifold for collecting hot coolant from the electronic component. The rack unit has a liquid-to-liquid heat exchanger fluidly coupled to the cold coolant manifold and the hot coolant manifold to form a first coolant loop. The first coolant loop transfers heat to a second coolant loop formed in part by the liquid-to-liquid heat exchanger.

Abstract: A liquid cooling rack assembly for a computing system includes a first cabinet rack configured to receive within a plurality of computing devices with heat-generating electronic components; and a second cabinet rack configured to receive coolant components. The second cabinet rack has a plurality of movable trays, each tray of the plurality of movable trays being movable generally horizontally and independently of other trays of the plurality of movable trays. The liquid cooling rack assembly further includes a plurality of cooling pumps. Each pump of the plurality of cooling pumps is placed on a respective one of the plurality of movable trays, and each pump is independently serviceable from other pumps of the plurality of cooling pumps based on independent movement of a respective tray.

Abstract: A hybrid cooling system is configured to receive heat-generating components of an information technology (IT) device. The system includes a chassis having a peripheral wall that extends between a chassis base and an open top surface, the peripheral wall forming an enclosure between an upstream side and a downstream side. An immersion conduit delivers an immersion coolant and fills the enclosure to fully immerse the heat-generating components. An outlet duct drain overflow of the immersion coolant accumulated in the enclosure. A cold plate within the enclosure is configured for direct contact with at least one heat-generating component. A supply conduit delivers a direct coolant in cooled form within the cold plate, and is in flow communication with a cold plate inlet connector. A return conduit removes the direct coolant in heated form from the cold plate, and is in flow communication with a cold plate outlet connector.

Abstract: An information technology (IT) system is directed to immersion cooling and includes a chassis forming an enclosure between an upstream side and a downstream side. The chassis has a rear opening formed along the downstream side and is configured to receive heat-generating components of the IT system adjacent to the upstream side within the enclosure. The system further includes a supply conduit for delivering an immersion coolant to the upstream side within the enclosure, and a flap mechanism attached to the downstream side near the rear opening. The flap mechanism is movable between an open position and a closed position, which allows accumulated coolant to drain from the chassis in the open position and prevents the accumulated coolant from draining from the chassis in the closed position.

Abstract: A fan module and computing device with the fan module are disclosed. The fan module includes a handle configured to actuate between an operation state and a release state. The handle in the release state allows a user to vertically remove the fan module from its respective fan module slot and away from the bottom panel.

Abstract: A bracket assembly for securing a removable device within a computing system, and a bay with a bracket assembly are disclosed. The bracket assembly includes a bracket and a retainer. The bracket attaches to an exterior surface of a tray of the computing system, where the tray is configured to hold the removable device. The bracket includes a first flexible retention mechanism and a second flexible retention mechanism. The retainer is rotatably connected to the bracket. The retainer is configured to restrict withdrawal of the removable device from the tray when the retainer is retained in a locked position by the first flexible retention mechanism. The retainer further is configured to not restrict withdrawal of the removable device from the tray when the retainer is retained in an open position by the second flexible retention mechanism. The retainer is configured to rotate from the locked position to the open position.

Abstract: A computing system includes a chassis, a water circulation network coupled to the chassis, a power distribution network coupled to the chassis, and one or more sleds removably coupled to the chassis. The water circulation network includes a cold water distribution network and a hot water collection network. Each sled of the one or more sleds includes a corresponding cold plate. Each sled is configured to slide along the chassis in two slide directions including a slide-close direction to reach a closed position and a slide-open direction to vacate the closed position. When in the closed position, each sled is configured to (a) bridge the hot water collection network and the cold water distribution network via the corresponding cold plate and (b) couple to the power distribution network.

Abstract: A pump module for a coolant distribution unit for cooling a heat-generating component is disclosed. A manifold unit has a supply connector to supply coolant to the heat-generating component and a collection connector to collect coolant from a heat exchanger. A first replaceable pump circulates coolant and includes an inlet connector having a valve powered by a first motor. An outlet connector has a valve powered by a second motor. The first pump has an input to activate the motors to move the valves between an open position allowing coolant flow and a closed position. A second pump has an inlet and an outlet coupled to the manifold. The second pump circulates coolant from the inlet to the outlet. The first pump may be disconnected from the manifold unit by activating the motors to close the valves, while the second pump continues to circulate coolant through the manifold unit.

Abstract: A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.

Abstract: A rotatable joint for use in a liquid cooling system comprises a main body and at least one housing portion. The main body has a main body passageway defined therethrough. The at least one housing portion is rotatably coupled to the main body and has a housing portion passageway defined therethrough that is fluidly coupled to the main body passageway. The main body is rotatable between a first position and a second position relative to the at least one housing portion. The main body passageway is fluidly coupled to the housing portion passageway when the main body is in either of the first position and the second position.

Abstract: An air duct is disclosed. The air duct includes a housing for directing air over a plurality of slots within a computer system. The housing includes side housing walls and a top housing wall. The side housing walls are respectively connected to opposing ends of the top housing wall. The side housing walls extend in the same direction from the top housing wall. The air duct further includes a plurality of fins extending from the top housing wall in the same direction as the side housing walls. Each fin of the plurality of fins is arranged on the top housing wall so as to be positioned between adjacent slots of the plurality of slots when the housing is located within the computer system.

Abstract: A fan system and a computing system with the fan system are disclosed. The fan system includes a fan module. The fan module includes a housing configured to retain a fan and a motor to rotate the fan. The housing includes an air inlet aperture on an air inlet side of the housing and an air outlet aperture on an air outlet side of the housing. The fan system further includes an outlet fan guard coupled to the fan module on the air outlet side of the housing. The outlet fan guard includes at least one flap rotatable between a closed position, covering the air outlet aperture of the housing, and an open position, uncovering the air outlet aperture of the housing. The outlet fan guard further includes at least one spring urging the at least one flap into the closed position.

Abstract: An air-shielding mechanism for a computing system is disclosed. A computing system includes a server chassis with a slot configured to receive a computing node. An air-shielding mechanism is positioned within the slot and includes a connecting rod movably coupled within the slot and a movable flap coupled to the connecting rod. The connecting rod rotates in a first direction in response to pressure generated by contact between the computing node inserted within the slot and the connecting rod. The movable flap is in a closed position when the computing node is absent from the slot, and the movable flap is in an open position when the computing node is fully inserted within the respective slot. The movable flap rotates in a second direction while the connecting rod is rotating in the first direction, the second direction being opposite the first direction.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.

Abstract: A multi-node computing system is disclosed. The multi-node computing system includes a chassis and a detachable cable cage removably mounted within the chassis. The detachable cable cage includes a base frame assembly having a bottom plate connecting a first plate and a second plate. The first and second plate face each other and extend across a width of the base frame assembly between a first side and a second side of the base frame assembly. The detachable cable cage further includes a first panel assembly movingly coupled to the first side of the base frame assembly and a second panel assembly movingly coupled to the second side of the base frame assembly. The first panel assembly and/or the second panel assembly is movable between a closed position and an open position, and an internal space of the detachable cable cage is accessible in the open position.

Abstract: A cooling assembly for liquid cooling of a heat-generating component such as a dual in-line memory module (DIMM) in a computer device is disclosed. The cooling assembly includes a bracket holding a micro-pipe assembly. The micro-pipe assembly has a cold manifold, a hot manifold and a series of micro-pipes. The micro-pipes are fluidly coupled between the cold manifold and hot manifold to allow coolant flow between the cold manifold and the hot manifold. The bracket positions the micro-pipe assembly such that micro-pipes are positioned proximate to opposite sides of the heat-generating component. A coolant inlet supplies coolant to the cold manifold and a coolant outlet collecting coolant from the hot manifold.

Abstract: A package carrier, including a first redistribution structure layer, multiple conductive connecting members, a connection structure layer, at least one stiffener, and a molding compound, is provided. The conductive connecting members are disposed on a first surface of the first redistribution structure layer and are electrically connected to the first redistribution structure layer. The connection structure layer is disposed on a second surface of the first redistribution structure layer and includes a substrate and multiple pads. A top surface and a bottom surface of each pad are respectively exposed to an upper surface and a lower surface of the substrate. The pads are electrically connected to the first redistribution structure layer. The stiffener is disposed on the first surface and is located at least between the conductive connecting members. The molding compound is disposed on the first surface and covers the conductive connecting members and the stiffener.

Abstract: A mounting system for an electronic device is disclosed. The mounting system includes a mounting plate; a plurality of fasteners for coupling the mounting plate with the electronic device; a single main gear mounted on the mounting plate; a plurality of secondary gears coupled, respectively, to the plurality of fasteners; and a plurality of intermediate gears mounted on the mounting plate and rotationally coupled between the single main gear and the plurality of secondary gears. Rotation of each of the plurality of secondary gears causes a fastening movement of a respective one of the plurality of fasteners. Simultaneous rotation of the plurality of intermediate gears causes the plurality of secondary gears to rotate simultaneously in response to a single rotational force being received by the main gear. The simultaneous rotation of the plurality of intermediate gears causes a simultaneous fastening movement of the plurality of secondary gears.

Abstract: A cooling distribution system cools an electronic computing device and includes a plurality of hot-swappable pump modules mounted within a distribution unit chassis and configured to circulate a coolant along a main cooling path. A coolant inlet manifold is mounted within the chassis and is fluidly coupled to the pump modules to allow entry of the coolant into the main cooling path. A coolant collection pan collects leaked coolant from the coolant circulating along the main cooling path. A recycle pump is fluidly coupled to form a recycle cooling path between the collection pan and the inlet manifold, and is configured to pump the leaked coolant from the collection pan back to the inlet manifold for recirculating the leaked coolant into the main cooling path.