Patents by Inventor Chao-Kuei Hsu

Chao-Kuei Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11716565
    Abstract: A sound emitting device includes a speaker box, a loudspeaker, a temperature sensor, a central processing unit and a signal amplifier. The speaker box includes a sound hole. The temperature sensor detects a temperature of the sound emitting device and generates a detection signal. The central processing unit pre-stores a default audio signal. When the central processing unit determines that the loudspeaker is in a standby state and the temperature of the sound emitting device exceeds a threshold value, the central processing unit issues the default audio signal. The signal amplifier is connected to and disposed between the central processing unit and the loudspeaker for amplifying the default audio signal and transmitting the amplified default audio signal to the loudspeaker. A vibration diaphragm of the loudspeaker undergoes a vibration action according to the amplified default audio signal.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: August 1, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chao-Kuei Hsu, Tzu-Yu Kao
  • Publication number: 20230086258
    Abstract: A sound emitting device includes a speaker box, a loudspeaker, a temperature sensor, a central processing unit and a signal amplifier. The speaker box includes a sound hole. The temperature sensor detects a temperature of the sound emitting device and generates a detection signal. The central processing unit pre-stores a default audio signal. When the central processing unit determines that the loudspeaker is in a standby state and the temperature of the sound emitting device exceeds a threshold value, the central processing unit issues the default audio signal. The signal amplifier is connected to and disposed between the central processing unit and the loudspeaker for amplifying the default audio signal and transmitting the amplified default audio signal to the loudspeaker. A vibration diaphragm of the loudspeaker undergoes a vibration action according to the amplified default audio signal.
    Type: Application
    Filed: November 4, 2021
    Publication date: March 23, 2023
    Inventors: Chao-Kuei Hsu, Tzu-Yu Kao
  • Patent number: 10932074
    Abstract: A detachable smart speaker system and a control method thereof are disclosed. The detachable smart speaker system includes a core device and a pairing device. The core device includes a microphone array, a CPU, a wireless communication module, a core bridge element and a database. The microphone array, the core bridge element and the database are connected to the CPU. The database includes plural audio parameter sets. The pairing device includes a speaker, a microcontroller unit, a pairing bridge element, and an identification code. The speaker and the pairing bridge element are connected to the microcontroller unit, respectively. The pairing device is detachably connected to the core device through the pairing bridge element, and a corresponding audio parameter set is to be selected from the audio parameter sets of the database according to the identification code. The core device controls the pairing device according to the corresponding audio parameter set.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: February 23, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chao-Kuei Hsu, Yueh-Hsiang Chen
  • Publication number: 20200413209
    Abstract: A detachable smart speaker system and a control method thereof are disclosed. The detachable smart speaker system includes a core device and a pairing device. The core device includes a microphone array, a CPU, a wireless communication module, a core bridge element and a database. The microphone array, the core bridge element and the database are connected to the CPU. The database includes plural audio parameter sets. The pairing device includes a speaker, a microcontroller unit, a pairing bridge element, and an identification code. The speaker and the pairing bridge element are connected to the microcontroller unit, respectively. The pairing device is detachably connected to the core device through the pairing bridge element, and a corresponding audio parameter set is to be selected from the audio parameter sets of the database according to the identification code. The core device controls the pairing device according to the corresponding audio parameter set.
    Type: Application
    Filed: July 29, 2019
    Publication date: December 31, 2020
    Inventors: Chao-Kuei Hsu, Yueh-Hsiang Chen