Abstract: The disclosure relates to a force measurement device including central portion, fixing portion, first and second sensing portions, and first and second electromechanical elements. The first sensing portion has first natural frequency. The first sensing portion is connected to the central portion. The second sensing portion has a second natural frequency. The second sensing portion is connected to the first sensing portion and the fixing portion. The first electromechanical element is disposed on the first sensing portion to measure a first vibration amplitude. The second electromechanical element is disposed on the second sensing portion to measure a second vibration amplitude. When the central portion is subjected to a first force, the first vibration amplitude is larger than the second vibration amplitude. When the central portion is subjected to a second force, the first vibration amplitude is smaller than the second vibration amplitude.

Abstract: A piezoelectric system comprises a piezoelectric sensor, a voltage stabilizer, a discharger and an operation sensor. The piezoelectric sensor outputs a sensing signal through a sensor output terminal according to a rate of change of pressure. The voltage stabilizer has a positive terminal electrically connecting with the sensor output terminal. The voltage stabilizer receives the sensing signal, stores the energy of the sensing signal, and keeps the voltage of the sensing signal as a constant when the rate of change of pressure is zero. The discharger has a first terminal connecting with the positive terminal, a second terminal coupled to ground, and a control terminal receiving a trigger signal to control the first terminal to conduct with or not conduct with the second terminal. The operation sensor electrically connects to the control terminal for sensing an operation generating the pressure and outputs the trigger signal accordingly.

Abstract: A microelectromechanical infrared sensing apparatus includes a substrate, a sensing plate, a plurality of supporting elements and a plurality of stoppers. The substrate includes an infrared reflecting layer. The sensing plate includes an infrared absorbing layer. The supporting elements are disposed on the substrate, and each of the supporting elements is connected to the sensing plate, such that the sensing plate is suspended above the infrared reflecting layer. The stoppers are disposed between the substrate and the sensing plate. When the sensing plate moves toward the infrared reflecting layer and the stoppers contact both the substrate and the sensing plate, the distance between the sensing plate and the infrared reflecting layer is substantially equal to the height of at least one of the stoppers.

Abstract: A multi-axis force sensor including a central portion, an outer ring portion, and at least one sensing portion disposed along an axial direction of an axis is provided. The sensing portion includes a first and a second elements connected with each other, and at least one first and at least one second strain gauges. A first end surface of the first element is connected to the central portion, and a second end surface of the second element is connected to the outer ring portion. A normal vector of the first end surface is parallel to the axis and the axis passes through a centroid of the first end surface. When the first end surface is subjected to an axial force, a first strain of a first sensing region of the first element in the axial direction is smaller than a second strain of a second sensing region of the second element in the axial direction.

Abstract: A control method of a memory storage device is provided and includes: detecting a first signal stream controlled by a host system; executing a boot code according to the first signal stream and entering a boot code mode; and receiving a command from the host system in the boot code mode and not executing a firmware code stored in a rewritable non-volatile memory module in the memory storage device. According, operational flexibility of the memory storage device may be enhanced.

Abstract: An apparatus with two anchors including a housing, a movable element, and a rotary element is provided. The housing includes a first expansion unit, a second expansion unit, and a linkage. First alignment structures are disposed in the movable element and anti-rotation structures are disposed in the linkage. When the movable element and the rotary element enter the housing from two ends and are coupled along an axis, the movable element and the rotary element can approach each other to expand the first expansion unit and the second expansion unit to form two anchors. The apparatus with two anchors secures a sensor in a variety of environments such as walls or machines. When the apparatus with two anchors fixes a sensor in a hole of a stamping machine, the impact force does not cause stress concentration on the sensor so as to improve the reliability of the sensor.

Abstract: A ball screw with force sensor in radial direction including a screw rod, a screw nut, a plurality of balls, and a force sensor is provided. The screw nut has a cavity. The cavity is extended along a radial direction from an outer surface of the screw nut. The force sensor is disposed in the cavity of the screw nut, and the force sensor includes a stationary base and an elastic component. The stationary base includes a displacement restraint, and the elastic component includes a contact end and a fixed end. The displacement restraint is coupled to the cavity to prevent the stationary base from being displaced in the radial direction for fixing stationary base firmly in the cavity. The fixed end is connected to the stationary base, and the contact end contacts a bottom surface of the cavity in order to sense a force along the radial direction.

Abstract: A linear guideway with an embedded sensor includes a track, a slider, a plurality of rolling members, and a sensing module. The track extends in a first direction and has a first recess. The slider can move in the first direction and include a second recess, a channel, at least one hole, and a deforming region. The channel is formed by coupling the first recess and the second recess, and extends in the first direction. The hole extends from the surface of the slider along the insertion axis and into the slider. The rolling members are disposed in the channel. The sensing module is disposed in the hole, and contacts the deforming region to detect the amount of deformation.

Abstract: A MEMS apparatus with heater includes central part, periphery part, gap and first connecting part. Central part includes center of mass, heater and first joint. Heater is disposed inside central part. First joint is located on boundary of central part. Displacement of first joint is produced when central part is heated by heater. Periphery part surrounds central part. Gap surrounds central part, and is located between central part and periphery part. First connecting part connects central part and periphery part along first reference line and includes first inner connecting portion and first outer connecting portion. First inner connecting portion is connected to first joint. First outer connecting portion is connected to periphery part. First reference line passes through first joint, and first reference line is not parallel to line connecting center of mass and first joint.

Abstract: A temperature control circuit for an electronic device is provided. The temperature control circuit includes a temperature detector, a status detection circuit and a control circuit. The temperature detector is configured to detect a temperature of the electronic device and generate first evaluation information. The status detection circuit is configured to detect a work status of at least one circuit module in the electronic device and generate second evaluation information. The control circuit is configured to adjust at least one electronic parameter of the electronic device according to the first evaluation parameter and the second evaluation parameter to control the temperature of the electronic device.

Abstract: A ball screw with tilt detector includes a screw rod, two screw nuts, a channel, a plurality of balls, and a tilt detector. The screw rod is extended along a direction of an axis. The two screw nuts are installed on the screw rod and capable of moving along the axis. The tilt detector is disposed between the two screw nuts to detect a tilt angle and a preload of the two screw nuts. The tilt detector includes a force receiving element, at least one first strain sensor, and at least one second strain sensor. The force receiving element includes a point symmetric ring-type structure, and the ring-type structure has two planes which are parallel to each other and respectively contact the two screw nuts.

Abstract: A MEMS device includes a substrate, at least one anchor disposed on the substrate, a movable stage, a sensing chip disposed on the movable stage, and at least one elastic member connected with the movable stage and the anchor. The movable stage includes at least one electrode and at least one conductive connecting layer. The sensing chip includes at least one electrical interconnection connected with the conductive connecting layer. The elastic member includes at least one first electrical channel, a second electrical channel and an electrical insulation layer disposed between the first electrical channel and the second electrical channel. The first electrical channel is electrically connected with the electrical interconnection, and the second electrical channel is electrically connected with the electrode.

Abstract: A MEMS apparatus with adjustable spring includes a central portion, a peripheral portion and at least one spring. The peripheral portion surrounds the central portion and is spaced apart from the central portion. The spring includes a peripheral section, an outward extension section and a central section. The peripheral section is connected to the outward extension section. An amount of thermal expansion per unit temperature change of the outward extension section is greater than that of the peripheral section or greater than that of the central section.

Abstract: A MEMS apparatus with heater includes central part, periphery part, gap and first connecting part. Central part includes center of mass, heater and first joint. Heater is disposed inside central part. First joint is located on boundary of central part. Displacement of first joint is produced when central part is heated by heater. Periphery part surrounds central part. Gap surrounds central part, and is located between central part and periphery part. First connecting part connects central part and periphery part along first reference line and includes first inner connecting portion and first outer connecting portion. First inner connecting portion is connected to first joint. First outer connecting portion is connected to periphery part. First reference line passes through first joint, and first reference line is not parallel to line connecting center of mass and first joint.

Abstract: A MEMS device includes a substrate, at least one anchor disposed on the substrate, a movable stage, a sensing chip disposed on the movable stage, and at least one elastic member connected with the movable stage and the anchor. The movable stage includes at least one electrode and at least one conductive connecting layer. The sensing chip includes at least one electrical interconnection connected with the conductive connecting layer. The elastic member includes at least one first electrical channel, a second electrical channel and an electrical insulation layer disposed between the first electrical channel and the second electrical channel. The first electrical channel is electrically connected with the electrical interconnection, and the second electrical channel is electrically connected with the electrode.

Abstract: A vibration sensor with monitoring function is provided, which includes a substrate, a microelectromechanical vibration sensor chip and an application-specific integrated circuit chip. The microelectromechanical vibration sensor chip is disposed on the substrate and detects a vibration applied to an object to generate a plurality of vibration signals. The application-specific integrated circuit chip is disposed on the substrate and electrically connected to the microelectromechanical vibration sensor chip, which includes a sampling module, a transform module and an analysis module. The sampling module receives and converts the vibration signals into a plurality of digital signals, and filters the digital signals to generate a plurality of time-domain data. The transform module transforms the time-domain data into a frequency-domain data according to a predetermined number.

Abstract: A multi-axis force sensor including a central portion, an outer ring portion, and at least one sensing portion disposed along an axial direction of an axis is provided. The sensing portion includes a first and a second elements connected with each other, and at least one first and at least one second strain gauges. A first end surface of the first element is connected to the central portion, and a second end surface of the second element is connected to the outer ring portion. A normal vector of the first end surface is parallel to the axis and the axis passes through a centroid of the first end surface. When the first end surface is subjected to an axial force, a first strain of a first sensing region of the first element in the axial direction is smaller than a second strain of a second sensing region of the second element in the axial direction.

Abstract: A micro-electromechanical temperature control system including a micro-electromechanical apparatus is provided. The micro-electromechanical apparatus includes a heater and a thermal reservoir. A specific heat capacity of the thermal reservoir is greater than a specific heat capacity of the heater, so that a heating time and a heating frequency of the heater are reduced to save electrical power consumption. The micro-electromechanical temperature control system is adapted for a micro-electromechanical sensor that is required to be controlled at an operating temperature, such as a gas sensor.

Abstract: An adjustable sensing capacitance microelectromechanical system (MEMS) apparatus includes an ASIC and a sensing component. The ASIC includes a top surface, a readout circuit and a plurality of electrical switches. The sensing component, configured to sensing physical quantity, includes a fixed electrode and a movable electrode. The fixed electrode includes a plurality of electrode units. The movable electrode is able to be moved relative to the fixed electrode. The electrical switches are respectively and electrically coupled to the electrode units so as to control a working status of each of the electrode units, thereby changing a sensing capacitance of the MEMS sensor.

Abstract: A ball screw with force sensor in radial direction including a screw rod, a screw nut, a plurality of balls, and a force sensor is provided. The screw nut has a cavity. The cavity is extended along a radial direction from an outer surface of the screw nut. The force sensor is disposed in the cavity of the screw nut, and the force sensor includes a stationary base and an elastic component. The stationary base includes a displacement restraint, and the elastic component includes a contact end and a fixed end. The displacement restraint is coupled to the cavity to prevent the stationary base from being displaced in the radial direction for fixing stationary base firmly in the cavity. The fixed end is connected to the stationary base, and the contact end contacts a bottom surface of the cavity in order to sense a force along the radial direction.