Patents by Inventor Chao-Tsai Chung

Chao-Tsai Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8671570
    Abstract: The vapor chamber is used in an electronic device. The electronic device includes a metal casing. The vapor chamber includes an upper cover, a working fluid, a waterproof layer, and a wick structure layer. The upper cover is disposed on inner walls of the metal casing to define a containing space. The working fluid is filled into the containing space. The waterproof layer is formed on inner walls of the containing space. The wick structure layer is formed on the waterproof layer.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: March 18, 2014
    Assignee: Pegatron Corporation
    Inventors: Juei-Khai Liu, Chao-Tsai Chung
  • Patent number: 8356656
    Abstract: A heat dissipation device and a heat dissipation method are provided. The device is disposed in a case having a first opening and a fan for generating a first cooling air flow. The device includes a heat dissipation element and an air-guiding plate. The heat dissipation element has a first region and a second region, and the first cooling air flow flows from the first region towards the second region. The air-guiding plate is disposed in the first region of the heat dissipation element and used for reducing a cross-sectional area of the first cooling air flow flowing in the first region along a flow direction of the first cooling air flow, so as to draw air outside the case into the second region via the first opening to generate a second cooling air flow, thereby lowering a temperature of the case located below the heat dissipation element.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: January 22, 2013
    Assignee: Pegatron Corporation
    Inventors: Yu-Wei Chang, Hu-Sung Chang, Chao-Tsai Chung
  • Publication number: 20120211203
    Abstract: A heat dissipating apparatus and a method for improving the same are provided. The heat dissipating apparatus includes a heat pipe including a heat-insulating section, a heat-absorbing part, and a heat-dissipating part. The heat-absorbing part is connected with one end of the heat-insulating section. The heat-absorbing part for contacting a heat source is thinner than the heat-insulating section. The heat-dissipating part is connected with the other end of the heat-insulating section.
    Type: Application
    Filed: February 17, 2012
    Publication date: August 23, 2012
    Applicant: PEGATRON CORPORATION
    Inventors: Yu-Wei Chang, Chao-Tsai Chung
  • Publication number: 20110174474
    Abstract: This invention discloses a vapor chamber and a method for manufacturing the same. The vapor chamber is used in an electronic device. The electronic device includes a metal casing. The vapor chamber includes an upper cover, a working fluid, a waterproof layer, and a wick structure layer. The upper cover is disposed on inner walls of the metal casing to define a containing space. The working fluid is filled into the containing space. The waterproof layer is formed on inner walls of the containing space. The wick structure layer is formed on the waterproof layer.
    Type: Application
    Filed: October 25, 2010
    Publication date: July 21, 2011
    Inventors: Juei-Khai Liu, Chao-Tsai Chung
  • Publication number: 20110108142
    Abstract: This invention discloses a vapor chamber and a manufacturing method thereof. The vapor chamber includes a casing, a working fluid, a waterproof layer, and a wick structure layer. The working fluid is filled into the casing. The waterproof layer is formed on inner walls of the casing. The wick structure layer is formed on the waterproof layer.
    Type: Application
    Filed: October 8, 2010
    Publication date: May 12, 2011
    Inventors: Juei-Khai Liu, Chao-Tsai Chung
  • Patent number: 7903420
    Abstract: A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: March 8, 2011
    Assignee: Asustek Computer Inc.
    Inventors: Chao-Tsai Chung, Kuo-Jung Hsu
  • Publication number: 20100254084
    Abstract: A motherboard integrated with a fan includes a circuit board, a stator, and a blade assembly. The circuit board has at least one hole. The stator is disposed at the circuit board. The blade assembly is rotatably mounted to the stator. When the stator drives the blade assembly to rotate, airflow is formed and passes through the hole.
    Type: Application
    Filed: March 25, 2010
    Publication date: October 7, 2010
    Inventors: Kuan-Ying Chen, Chao-Tsai Chung
  • Publication number: 20100065254
    Abstract: A heat dissipation device and a heat dissipation method are provided. The device is disposed in a case having a first opening and a fan for generating a first cooling air flow. The device includes a heat dissipation element and an air-guiding plate. The heat dissipation element has a first region and a second region, and the first cooling air flow flows from the first region towards the second region. The air-guiding plate is disposed in the first region of the heat dissipation element and used for reducing a cross-sectional area of the first cooling air flow flowing in the first region along a flow direction of the first cooling air flow, so as to draw air outside the case into the second region via the first opening to generate a second cooling air flow, thereby lowering a temperature of the case located below the heat dissipation element.
    Type: Application
    Filed: September 10, 2009
    Publication date: March 18, 2010
    Applicant: PEGATRON CORPORATION
    Inventors: Yu-Wei Chang, Hu-Sung Chang, Chao-Tsai Chung
  • Publication number: 20100065255
    Abstract: A vapor chamber includes a chamber, a working fluid, a lower wick structure, and a plurality of supporting elements. The chamber includes an upper cover and a bottom plate and contains the working fluid. The lower wick structure is located at the bottom plate. The supporting elements are disposed in the chamber and connect the upper cover and the bottom plate to support the upper cover. Each of the supporting elements and the upper cover form a first inclined angle. The working fluid in the vapor phase flows from the upper cover back to the bottom plate through the supporting elements after condensed.
    Type: Application
    Filed: September 15, 2009
    Publication date: March 18, 2010
    Applicant: PEGATRON CORPORATION
    Inventors: Juei-Khai Liu, Yu-Wei Chang, Chao-Tsai Chung
  • Publication number: 20100059207
    Abstract: This invention provides a method for assembling the thermal module. According to the invention, the fin can be combined with a heat pipe and a joint material to form the thermal module. The fin includes a main body having a through hole and an feeding hole communicating with each other. The heat pipe passes through the through hole. The joint material is injected into the feeding hole to fill a clearance between the heat pipe and the inner wall of the through hole. In addition, when the fin is combined with the heat pipe, the feeding hole is above the through hole, the joint material flows downward along the clearance, and the clearance gradually narrows along a flowing direction of the joint material.
    Type: Application
    Filed: September 4, 2009
    Publication date: March 11, 2010
    Applicant: Pegatron Corporation
    Inventors: YU WEI CHANG, CHAO TSAI CHUNG
  • Publication number: 20100061052
    Abstract: The invention discloses an electronic apparatus including a sealed housing, a heat-conducting component, and a fan. The heat-conducting component penetrates the sealed housing, and a fan is disposed in the sealed housing. The fan drives an air-flow, and the air-flow flows in the sealed housing and flows through the heat-conducting component.
    Type: Application
    Filed: September 3, 2009
    Publication date: March 11, 2010
    Applicant: Pegatron Corporation
    Inventor: CHAO TSAI CHUNG
  • Publication number: 20090052136
    Abstract: A heat dissipation device for dissipating heat of a heat source is provided. The heat dissipation device includes a first heat dissipation unit having a heat sink and a tank, a second heat dissipation unit, a pump, and a plurality of tubes. The heat sink has a heat dissipation base, and the tank is adapted to contain a heat exchange medium and has a liquid inlet, a liquid outlet and an opening. The heat sink is disposed at the tank. The heat dissipation base passes through the opening, and it contacts the heat source. The tubes connect the liquid inlet, the liquid outlet, the second heat dissipation unit and the pump to form a closed circulation flow loop. The heat exchange medium is driven to flow in the closed circulation flow loop by the pump, and the second heat dissipation unit is adapted to cool the heat exchange medium.
    Type: Application
    Filed: August 18, 2008
    Publication date: February 26, 2009
    Applicant: ASUSTeK COMPUTER INC.
    Inventor: Chao-Tsai Chung
  • Publication number: 20090009971
    Abstract: A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.
    Type: Application
    Filed: March 27, 2008
    Publication date: January 8, 2009
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chao-Tsai Chung, Kuo-Jung Hsu
  • Publication number: 20070163269
    Abstract: A heat dissipation module suitable for performing heat dissipation on a heat source is provided. The heat dissipation module includes a first base, a first radiator, a thermoelectric cooler and a second radiator. The first base has a first surface and a second surface, wherein the first surface contacts the heat source. Both the first radiator and the thermoelectric cooler contact the second surface, while the second radiator is disposed on the thermoelectric cooler.
    Type: Application
    Filed: November 30, 2006
    Publication date: July 19, 2007
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chao-Tsai Chung, Kuo-Hua Chang
  • Publication number: 20060225282
    Abstract: A manufacturing method of heat pipe is provided. First, a metal pipe is provided. Next, the metal pipe is shaped. Then, a metal inner layer having a capillary structure is formed at the internal wall of the metal pipe.
    Type: Application
    Filed: March 16, 2006
    Publication date: October 12, 2006
    Inventor: Chao-Tsai Chung
  • Patent number: 7002804
    Abstract: A heat dissipating apparatus for an electronic device having an integrated heat spreader is disclosed. The integrated heat spreader is disposed on the electronic device. The electronic device is inserted into a socket. The heat dissipating apparatus includes a base and at least one fin. The base is connected to the integrated heat spreader and has a concave area. When the base is connected to the integrated heat spreader, a contact area is thereby formed. The shape and position of the contact area correspond to those of the integrated heat spreader. The concave area is formed on the base and extended from the edge of the base to the contact area. The fin is formed on the base.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: February 21, 2006
    Assignee: ASUSTek Computer Inc.
    Inventors: Chao-Tsai Chung, Wan-Chin Hsiao
  • Publication number: 20040240181
    Abstract: A heat dissipating apparatus for an electronic device having an integrated heat spreader is disclosed. The integrated heat spreader is disposed on the electronic device. The electronic device is inserted into a socket. The heat dissipating apparatus includes a base and at least one fin. The base is connected to the integrated heat spreader and has a concave area. When the base is connected to the integrated heat spreader, a contact area is thereby formed. The shape and position of the contact area correspond to those of the integrated heat spreader. The concave area is formed on the base and extended from the edge of the base to the contact area. The fin is formed on the base.
    Type: Application
    Filed: November 4, 2003
    Publication date: December 2, 2004
    Inventors: Chao-Tsai Chung, Wan-Chin Hsiao
  • Patent number: 6819564
    Abstract: A heat dissipation module. The heat dissipation module comprises a cover, a fan, a base and a plurality of fin assemblies. The fan is disposed on the cover. The base is disposed underneath the fan and has a protruding portion. The protruding portion has two slant surfaces and a top end. The protruding portion gradually tapers toward the fan. The plurality of fin assemblies are disposed on the slant surfaces of the protruding portion of the base.
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: November 16, 2004
    Assignee: Asustek Computer Inc.
    Inventors: Chao-Tsai Chung, Cheng-Chen Cheng, Po-Yao Lin
  • Patent number: 6711016
    Abstract: A side-exhaust heat dissipation module for cooling an electronic device. The side-exhaust heat dissipation module comprises a base, a fan, a fin assembly and an airflow guiding cover. The fan is disposed on one side of the base. The fin assembly is disposed on the base and composed of a plurality of parallel fins. The fin assembly has a concave end spaced from the fan by a predetermined distance. The airflow guiding cover is disposed on the fin assembly. The airflow guiding cover is gradually expanded and extended from the fan to cover the fin assembly.
    Type: Grant
    Filed: December 5, 2002
    Date of Patent: March 23, 2004
    Assignee: ASUSTek Computer Inc.
    Inventors: Chao-Tsai Chung, Po-Yao Lin
  • Publication number: 20030210525
    Abstract: A side-exhaust heat dissipation module for cooling an electronic device. The side-exhaust heat dissipation module comprises a base, a fan, a fin assembly and an airflow guiding cover. The fan is disposed on one side of the base. The fin assembly is disposed on the base and composed of a plurality of parallel fins. The fin assembly has a concave end spaced from the fan by a predetermined distance. The airflow guiding cover is disposed on the fin assembly. The airflow guiding cover is gradually expanded and extended from the fan to cover the fin assembly.
    Type: Application
    Filed: December 5, 2002
    Publication date: November 13, 2003
    Inventors: Chao-Tsai Chung, Po-Yao Lin