Abstract: An automotive electronic device durable in an automotive environment of at least 95° C. includes a bottom cover, a circuit board and a heatsink casing. The circuit board is installed on the bottom cover. The heatsink casing is assembled with the bottom cover, and covers the circuit board between the heatsink casing and the bottom cover. The heatsink casing includes an outer surface, a plurality of long fins and a plurality of side fins. The long fins are arranged on the outer surface along a first direction. Two adjacent ones of the long fins have a distance at least greater than 8 mm. The side fins are arranged on an edge of the outer surface along a second direction, and connected to one of the long fins.

Abstract: The vapor chamber is used in an electronic device. The electronic device includes a metal casing. The vapor chamber includes an upper cover, a working fluid, a waterproof layer, and a wick structure layer. The upper cover is disposed on inner walls of the metal casing to define a containing space. The working fluid is filled into the containing space. The waterproof layer is formed on inner walls of the containing space. The wick structure layer is formed on the waterproof layer.

Abstract: A heat dissipation device and a heat dissipation method are provided. The device is disposed in a case having a first opening and a fan for generating a first cooling air flow. The device includes a heat dissipation element and an air-guiding plate. The heat dissipation element has a first region and a second region, and the first cooling air flow flows from the first region towards the second region. The air-guiding plate is disposed in the first region of the heat dissipation element and used for reducing a cross-sectional area of the first cooling air flow flowing in the first region along a flow direction of the first cooling air flow, so as to draw air outside the case into the second region via the first opening to generate a second cooling air flow, thereby lowering a temperature of the case located below the heat dissipation element.

Abstract: A heat dissipating apparatus and a method for improving the same are provided. The heat dissipating apparatus includes a heat pipe including a heat-insulating section, a heat-absorbing part, and a heat-dissipating part. The heat-absorbing part is connected with one end of the heat-insulating section. The heat-absorbing part for contacting a heat source is thinner than the heat-insulating section. The heat-dissipating part is connected with the other end of the heat-insulating section.

Abstract: This invention discloses a vapor chamber and a method for manufacturing the same. The vapor chamber is used in an electronic device. The electronic device includes a metal casing. The vapor chamber includes an upper cover, a working fluid, a waterproof layer, and a wick structure layer. The upper cover is disposed on inner walls of the metal casing to define a containing space. The working fluid is filled into the containing space. The waterproof layer is formed on inner walls of the containing space. The wick structure layer is formed on the waterproof layer.

Abstract: This invention discloses a vapor chamber and a manufacturing method thereof. The vapor chamber includes a casing, a working fluid, a waterproof layer, and a wick structure layer. The working fluid is filled into the casing. The waterproof layer is formed on inner walls of the casing. The wick structure layer is formed on the waterproof layer.

Abstract: A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.

Abstract: A motherboard integrated with a fan includes a circuit board, a stator, and a blade assembly. The circuit board has at least one hole. The stator is disposed at the circuit board. The blade assembly is rotatably mounted to the stator. When the stator drives the blade assembly to rotate, airflow is formed and passes through the hole.

Abstract: A heat dissipation device and a heat dissipation method are provided. The device is disposed in a case having a first opening and a fan for generating a first cooling air flow. The device includes a heat dissipation element and an air-guiding plate. The heat dissipation element has a first region and a second region, and the first cooling air flow flows from the first region towards the second region. The air-guiding plate is disposed in the first region of the heat dissipation element and used for reducing a cross-sectional area of the first cooling air flow flowing in the first region along a flow direction of the first cooling air flow, so as to draw air outside the case into the second region via the first opening to generate a second cooling air flow, thereby lowering a temperature of the case located below the heat dissipation element.

Abstract: A vapor chamber includes a chamber, a working fluid, a lower wick structure, and a plurality of supporting elements. The chamber includes an upper cover and a bottom plate and contains the working fluid. The lower wick structure is located at the bottom plate. The supporting elements are disposed in the chamber and connect the upper cover and the bottom plate to support the upper cover. Each of the supporting elements and the upper cover form a first inclined angle. The working fluid in the vapor phase flows from the upper cover back to the bottom plate through the supporting elements after condensed.

Abstract: This invention provides a method for assembling the thermal module. According to the invention, the fin can be combined with a heat pipe and a joint material to form the thermal module. The fin includes a main body having a through hole and an feeding hole communicating with each other. The heat pipe passes through the through hole. The joint material is injected into the feeding hole to fill a clearance between the heat pipe and the inner wall of the through hole. In addition, when the fin is combined with the heat pipe, the feeding hole is above the through hole, the joint material flows downward along the clearance, and the clearance gradually narrows along a flowing direction of the joint material.

Abstract: The invention discloses an electronic apparatus including a sealed housing, a heat-conducting component, and a fan. The heat-conducting component penetrates the sealed housing, and a fan is disposed in the sealed housing. The fan drives an air-flow, and the air-flow flows in the sealed housing and flows through the heat-conducting component.

Abstract: A heat dissipation device for dissipating heat of a heat source is provided. The heat dissipation device includes a first heat dissipation unit having a heat sink and a tank, a second heat dissipation unit, a pump, and a plurality of tubes. The heat sink has a heat dissipation base, and the tank is adapted to contain a heat exchange medium and has a liquid inlet, a liquid outlet and an opening. The heat sink is disposed at the tank. The heat dissipation base passes through the opening, and it contacts the heat source. The tubes connect the liquid inlet, the liquid outlet, the second heat dissipation unit and the pump to form a closed circulation flow loop. The heat exchange medium is driven to flow in the closed circulation flow loop by the pump, and the second heat dissipation unit is adapted to cool the heat exchange medium.

Abstract: A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.

Abstract: A heat dissipation module suitable for performing heat dissipation on a heat source is provided. The heat dissipation module includes a first base, a first radiator, a thermoelectric cooler and a second radiator. The first base has a first surface and a second surface, wherein the first surface contacts the heat source. Both the first radiator and the thermoelectric cooler contact the second surface, while the second radiator is disposed on the thermoelectric cooler.

Abstract: A manufacturing method of heat pipe is provided. First, a metal pipe is provided. Next, the metal pipe is shaped. Then, a metal inner layer having a capillary structure is formed at the internal wall of the metal pipe.

Abstract: A heat dissipating apparatus for an electronic device having an integrated heat spreader is disclosed. The integrated heat spreader is disposed on the electronic device. The electronic device is inserted into a socket. The heat dissipating apparatus includes a base and at least one fin. The base is connected to the integrated heat spreader and has a concave area. When the base is connected to the integrated heat spreader, a contact area is thereby formed. The shape and position of the contact area correspond to those of the integrated heat spreader. The concave area is formed on the base and extended from the edge of the base to the contact area. The fin is formed on the base.

Abstract: A heat dissipating apparatus for an electronic device having an integrated heat spreader is disclosed. The integrated heat spreader is disposed on the electronic device. The electronic device is inserted into a socket. The heat dissipating apparatus includes a base and at least one fin. The base is connected to the integrated heat spreader and has a concave area. When the base is connected to the integrated heat spreader, a contact area is thereby formed. The shape and position of the contact area correspond to those of the integrated heat spreader. The concave area is formed on the base and extended from the edge of the base to the contact area. The fin is formed on the base.

Abstract: A heat dissipation module. The heat dissipation module comprises a cover, a fan, a base and a plurality of fin assemblies. The fan is disposed on the cover. The base is disposed underneath the fan and has a protruding portion. The protruding portion has two slant surfaces and a top end. The protruding portion gradually tapers toward the fan. The plurality of fin assemblies are disposed on the slant surfaces of the protruding portion of the base.

Abstract: A side-exhaust heat dissipation module for cooling an electronic device. The side-exhaust heat dissipation module comprises a base, a fan, a fin assembly and an airflow guiding cover. The fan is disposed on one side of the base. The fin assembly is disposed on the base and composed of a plurality of parallel fins. The fin assembly has a concave end spaced from the fan by a predetermined distance. The airflow guiding cover is disposed on the fin assembly. The airflow guiding cover is gradually expanded and extended from the fan to cover the fin assembly.