Abstract: An arrangement for cooling an electronic assembly includes a circuit board, an enclosure member and at least one electromechanical actuator. The circuit board has a first surface, a second surface, and at least a first heat-generating element secured to the first surface. The circuit board further comprises at least one aperture extending between the first surface and the second surface. The enclosure member is secured to the circuit board so as to form a fluid tight barrier of a compartment defined at least in part by the enclosure member. The compartment includes a first subcompartment defined at least in part by the first surface and the enclosure member and a second subcompartment defined at least in part by the second surface and the enclosure member. The at least one electromechanical actuator is secured within the fluid type barrier and is operable to generate a flow movement in the direction of the at least one aperture when liquid is disposed in the fluid tight barrier.

Abstract: The present invention relates to fiber optics. In this regard, embodiments of the invention may be construed as providing interconnection systems for optical media. An embodiment of the present invention includes an optical circuit pack assembly, an optical circuit board, a child board, an optical device having a front end and a back end, an optical connector, and an optical connector mechanism. As such, the optical device is mounted on the child board and the child board is in turn slidably affixed to the optical circuit board. The optical connector is mounted on the optical circuit pack assembly such that as an operator inserts the optical circuit board into the optical circuit pack assembly, the optical connector and optical device are obscured from view. Operation of the optical connector mechanism causes the child board to move along a longitudinal axis of the child board, thereby causing the optical connector and the optical device to become operably engaged.

Abstract: The present invention relates to fiber optics. In this regard, embodiments of the invention may be construed as providing interconnection systems for optical media. An embodiment of the present invention includes an optical circuit pack assembly, an optical circuit board, a child board, an optical device having a front end and a back end, an optical connector, and an optical connector mechanism. As such, the optical device is mounted on the child board and the child board is in turn slidably affixed to the optical circuit board. The optical connector is mounted on the optical circuit pack assembly such that as an operator inserts the optical circuit board into the optical circuit pack assembly, the optical connector and optical device are obscured from view. Operation of the optical connector mechanism causes the child board to move along a longitudinal axis of the child board, thereby causing the optical connector and the optical device to become operably engaged.

Abstract: Finishing the end of a plastic optical fiber by a device having a semi-rigid or rigid base, a solvent liner for absorbing and holding a solvent, and a re-attachable pull-off cover for keeping the solvent from evaporating when not in use. To polish the end of a plastic optical fiber, the cover is peeled off, the end of the optical fiber is contacted with the solvent liner such that solvent is transferred to the end of the optical fiber, the cover may be reapplied (using a pressure sensitive adhesive integral to either the bottom of the peel-off cover or the top of the liner), the excessive solvent, if any, is removed by using an appropriate swab, and the end of the plastic optical fiber is allowed to return to its normal state. The solvent temporarily dissolves the surface layer of the end of the optical fiber. The resulting surface tension automatically polishes the end of the optical fiber.

Abstract: An optical connector assembly includes a connector body having an inner wall defining a bore extending longitudinally through the connector body and shaped to receive an optical fiber. A fiber-retaining mechanism is disposed in the connector body for retention of the optical fiber received in the bore by frictionally engaging an outer circumferential surface of the optical fiber to thereby restrain unintended longitudinal displacement of the optical fiber relative to the bore.

Abstract: An interconnection system is shown that enables an optical circuit board 300, having a number of optical devices 400, 500, to be easily connected to and disconnected from a backplane 100. The optical devices are positioned along a side edge 311 of a printed wiring board 310 and are adapted to interconnect with a like number of optical connectors 200 that are arrayed on the backplane in a row or column. Each optical plug is held in a holder 120, which is retained in backplane 100 by a clip 110. Each of the optical connectors is a plug that includes a ferrule 24, which encloses an optical fiber and projects from one end of the plug. Each of the edge-mounted optical devices includes a jack receptacle 410, 510 at its front end and has a cavity 401, 501 that is shaped to receive the optical plug. All of the jack receptacles are similarly shaped. Each cavity further includes a boss 421, 521 for receiving the ferrule. The plugs and jack receptacles are arranged to engage, but not interlock with, each other.

Abstract: Finishing an end of a plastic optical fiber by ablating the end of the plastic optical fiber by utilizing an Excimer laser so that the end of the optical fiber can be used in a optical connector. A high powered ultraviolet beam of light from the laser is absorbed by the end of the fiber and ablates the first few microns of the end face of the fiber. This process removes residual cracks and fissures to flatten the end of the fiber for use in the optical connector. The optical fiber is then ready to make a low loss interface with a source, a detector, or another optical fiber.

Abstract: An arrangement for cooling an electronic assembly includes a circuit board and an enclosure member. The circuit board has a first surface, a second surface, and at least a first electronic component or other heat-generating element secured to the first surface. The enclosure member is secured to said circuit board so as to form a fluid tight barrier of a compartment defined at least in part by said enclosure member. Such compartment includes a first subcompartment defined at least in part by said first surface and said enclosure member and a second subcompartment defined at least in part by said second surface and said enclosure member. The circuit board further includes at least one aperture extending between the first surface and the second surface such that the first subcompartment is in fluid communication with the second subcompartment.

Abstract: Fabricating graded index plastic optical fiber by diffusing a high molecular weight dopant within a step index plastic optical fiber after the step index plastic optical fiber has been drawn from a preform using a conventional draw tower in a first embodiment. Also, the step index plastic optical fiber may be fabricated by extruding one material circumferentially around another material, e.g., by use of a concentric nozzle. The dopant is diffused after the drawing or extruding of the step index plastic optical fiber by heating the plastic optical fiber to a temperature that causes a high rate of diffusion state while measuring the transmission bandwidth of the plastic optical fiber. When the predetermined specified transmission bandwidth is measured, the plastic optical fiber is immediately returned to an ambient temperature. In addition, the plastic optical fiber may be gradually heated to an equilibrium temperature that is just below the temperature required to produce the high rate of diffusion state.

Abstract: An arrangement for electromagnetically shielding a circuit carrying substrate includes first and second shielding members and a plurality of elastically deformable shielding connectors. The first shielding member has first and second dimensions exceeding first and second dimensions defined by the circuit and is disposed on a first side of the circuit. The second shielding member also has first and second dimensions exceeding first and second dimensions defined by the circuit and is disposed on a second side of the circuit. The first and second shielding members define at least one slot therebetween. Each of the plurality of shielding connectors is both plastically deformable and electrically conductive, and furthermore extends between the first shielding member and the second shielding member. The plurality of shielding connectors are disposed within and throughout said slot and spaced apart by a distance that is less than one-fourth the wavelength of an effective operating frequency of the circuit.

Abstract: An arrangement for enclosing a fluid includes a circuit board and an enclosure member. The circuit board includes an electronic component secured thereto. The enclosure member is secured to the circuit board such that the enclosure member and the circuit board cooperate so as to create a fluid tight barrier of a compartment defined by the circuit board and the enclosure member.

Abstract: An arrangement for cooling an electronic assembly includes a circuit board having a primary circuit board portion and a secondary circuit board portion integrally secured to the primary circuit board portion. The arrangement also includes an enclosure member secured to the circuit board so as to create a fluid tight barrier of a compartment defined at least in part by the enclosure member. The arrangement further includes a first electronic component secured to the primary circuit board portion such that the first electronic component is located within the compartment. The arrangement also includes a second electronic component secured to the secondary circuit board portion such that the second electronic component is located outside of the compartment. The arrangement also includes a liquid disposed within the compartment such that the liquid is in a heat exchange relationship with the first electronic component.

Abstract: An apparatus and method are disclosed for use in detecting and localizing electrostatically susceptible areas of electronic systems. An exemplary apparatus includes: (1) an ESD gun for providing a source of electric current; (2) a wire coil for generating a magnetic field; and (3) a shielded transmission line, such as a coaxial transmission line ("coax"), for receiving current from the gun. The center conductor of the coax is coupled at one end to the gun and at the other end to one end of the wire coil. The other end of the wire coil is coupled to ground. The current flowing through the wire coil creates a magnetic field, which is bi-directional and orthogonal to the plane of the coil. The magnetic field causes errors in the operation of the system under test when the coil is placed in close proximity with ESD susceptible system components. As such, components that are ESD susceptible can be easily detected and localized.

Abstract: Infrared absorbing compositions useful as high solid coatings comprising 5-50% of a volatile solvent portion and 50-95% of a non-volatile portion which comprises a film-forming binder having dispersed within the binder opacifying polymeric beads and an infrared radiation absorbing pigment selected from the group consisting of copper phosphate, basic copper phosphate, copper pyrophosphate, tungsten trioxide and mixtures thereof.

Abstract: Sunglasses with vision directing sections comprise a frame with temples to hold the frame on the wearer's face and lenses in the frame. Each lens is tinted on its front and rear surfaces and one of those surfaces is further coated with a reflecting layer except in the area of the vision directing section. The sunglasses provide highlighted vision through the vision directing sections so that the wearer's vision is directed to that portion of their field of vision. The sunglasses are useful in a variety of activities where it is beneficial to direct attention to a select portion of a person's field of vision or where it is desirable to have a less shaded view through the sunglasses.

Abstract: A pawl latch that provides an integral gripping feature to facilitate opening panels and a visual indication of latch closure. The front portion of the latch has two pieces. In the open position, the two pieces are positioned with respect to each other so that the top piece reveals a colored face of the bottom piece. The colored face of the bottom piece can be observed at great distances from the latch. In the closed position, the top piece totally covers the bottom piece so that no color is visible on the latch. Further, in the open position, the front piece is at right angles to the bottom piece, and the front piece is positioned away from the panel so that it can be easily grasped with two fingers to allow the opening of an attached panel. Also, the latch is designed to be attached to a surface of the panel that is not horizontal to a frame to which the panel is to be secured to by the latch.

Abstract: A process for shading paint to match the color of a standard paint which process involves the use of the determination of the theoretical dry color values of the paint being manufactured and the addition of the appropriate amounts of the components of the paint which must be added to provide a final dry color which falls within the prescribed color tolerance.

Abstract: Interconnection apparatus for electrically connecting the contact areas (22) of a printed wiring board (20) and the contact springs (e.g., 33, 34) of a backplane (10) for increasing the board terminations without increasing the width of the board leading edge (21). A coordinate array of contact areas (22) is provided at least on one side of the leading portion of the board (20) which corresponds to an array of contacting surfaces of the springs (e.g., 33, 34) extending from a backplane (10). A mask (e.g., 23) having an array of apertures (24) corresponding to the contact area array overlies the leading portion (21) of the board (20). The mask apertures (e.g., 24) are individually dimensioned and formed within the array rows to accept therethrough only correspondingly formed individual contact springs (e.g., 33, 34) of the spring rows.

Abstract: A printed wiring board (20) and housing (12) apparatus in which a coordinate array of terminal contact areas (22) on the board (20) make only simultaneous and exclusive electrical contact with a corresponding array of housing contact springs (42). Premature and unwanted electrical contacts are prevented as the board (20) is moved into association with housing (12) by cam means (40) protruding from each end of a lattice structure (33). Crossmembers (36, 37, 38) of the lattice structure (33) support spring ends (45) to maintain the contact surfaces of the springs (42) out of engagement with the board (20) contact areas (22) as the cams (40) ride along the surface of the board (20) until full insertion movement of the board is completed. At this point, the cams (40) are seated in corresponding recesses (46) provided therefor in the board (20) to permit the mating of the contact areas and housing springs.

Abstract: A printed wiring board (20) and connector (12) apparatus in which a coordinate array of terminal contact areas (22) on the board (20) make only simultaneous and exclusive electrical contact with a corresponding array of connector contact springs (24). Premature and unwanted electrical contacts are prevented as the board (20) is moved into association with the connector (12) by cams (23) protruding from the board (20) which maintain a separation between the board contact areas (22) and the connector springs (24) until full movement of the board is completed. At this point, the cams (23) are seated in corresponding recesses (26) provided therefor in the connector (12) surface to permit the mating of contact areas and springs.