Abstract: A curable composition exhibiting excellent moldability without mold staining or delamination is provided, including an epoxy resin, a curing agent for the epoxy resin, and a polyphenylene oxide compound having a glass transition temperature between about 165° C. and about 190° C. The polyphenylene oxide compound may be provided as a melt blended mixture of two polyphenylene oxide compounds having distinct glass transition temperatures. The curable compositions may further include a bulk filler, and are therefore particularly useful as molding compounds encapsulation of electrical and/or electronic parts in transfer molding operations.

Abstract: A flame-retardant composition is provided that includes at least one melamine compound, at least one metal borate, at least one alkaline metal hydroxide, and optionally hydrated alumina. The flame-retardant composition can be used in coating powder compositions that also include a resin. The flame retardant coating powder composition can be applied to a substrate, such as an electrical or electronic device, and heated to a temperature sufficient to effect crosslinking of the resin and the curing agent to provide a flame resistant coating composition.

Abstract: A flame-retardant molding composition that includes an epoxy resin, melamine cyanurate, and one or more hydrated metal salts capable of liberating water when heated. The hydrated metal salt may include one or more compounds selected from metal borate salts, Group IIB oxides, and polyhydroxides of one or more elements selected from Group IIA elements and Group IIIB elements. The molding composition may be used to coat an electrical or electronic device by heating the molding composition to a temperature sufficient to cure the molding composition and form a polymer on the surface of the device. Electrical and electronic devices formed by the method are also disclosed.

Abstract: A flame-retardant molding composition that includes an epoxy resin, melamine cyanurate, and one or more hydrate metal salts capable of liberating water when heated. The hydrated metal salt may include one or more compounds selected from metal borate salts, Group IIB oxides, and polyhydroxides of one more elements selected from Group IIA elements and Group IIIB elements. The molding composition may be used to coast an electrical or electronic device by heating the molding composition to a temperature sufficient to cure the molding composition and form a polymer on the surface of the device. Electrical and electronic devices formed by the method are also disclosed.

Abstract: Molding compositions particularly useful in coating electronic devices such as integrated circuits are disclosed. The molding compositions include an epoxy resin; a hardener for the epoxy resin, a flame retardant compound such as melamine cyanurate, and a quaternary organophosphonium salt for catalyzing a reaction between the epoxy resin and the hardener, such as ethyl triphenyl phosphonium acid acetate. The molding compositions exhibit improved flame retardancy. Also, when multifunctional epoxy resins and multifunctional phenolic hardeners such as those derived from phenol with a degree of branching of at least three are used, the molding compounds including the quaternary organophosphonium salt as a catalyst exhibit long flow and low shrinkage and warpage.