Abstract: Disclosed is a process stop loss reduction system, in which in case that pressure in a trapping apparatus and pressure in a process chamber are increased because of space clogging or the like caused by reaction by-products while the trapping apparatus for trapping of a reaction by-product contained in exhaust gas discharged from the process chamber operates over a long period of time during a semiconductor process, only the trapping apparatus, to which a supply of exhaust gas is cut off, may be quickly replaced while inert gas is received in an idle state and continuously supplied to a vacuum pump through a bypass pipe of the trapping apparatus without stopping an operation of (shutting down) a semiconductor manufacturing process chamber facility, and then the trapping apparatus may be supplied with the exhaust gas again.

Abstract: The present disclosure relates to an apparatus for trapping of a reaction by-product capable of expanding the area for collection by inducing a gas flow, in which an internal trapping tower of the apparatus for trapping of a reaction by-product, which traps a reaction by-product contained in gas discharged from a process chamber during a semiconductor manufacturing process, is divided into multiple stages, the introduced gas is guided to a lower side of an inner region of an intermediate trapping unit provided as a space portion and discharged to an outer region while a trapping reaction occurs according to the reaction by-product trapping amount during a former part of a use duration time.

Abstract: The present disclosure relates to an apparatus for trapping of a reaction by-product with an extended available collection area. The configuration of the present disclosure relates to an apparatus for trapping of a reaction by-product, which is configured to accommodate gas, which is discharged after a deposition process during a semiconductor manufacturing process, in a housing (1), heat the gas with a heater (2), trap a reaction by-product contained in the gas by using an internal trapping tower (3), and discharge only the gas.

Abstract: The present disclosure relates to an apparatus for trapping of a reaction by-product with an extended available collection area. The configuration of the present disclosure relates to an apparatus for trapping of a reaction by-product, which is configured to accommodate gas, which is discharged after a deposition process during a semiconductor manufacturing process, in a housing (1), heat the gas with a heater (2), trap a reaction by-product contained in the gas by using an internal trapping tower (3), and discharge only the gas.

Abstract: The present disclosure relates to an apparatus for trapping of a reaction by-product capable of expanding the area for collection by inducing a gas flow, in which an internal trapping tower of the apparatus for trapping of a reaction by-product, which traps a reaction by-product contained in gas discharged from a process chamber during a semiconductor manufacturing process, is divided into multiple stages, the introduced gas is guided to a lower side of an inner region of an intermediate trapping unit provided as a space portion and discharged to an outer region while a trapping reaction occurs according to the reaction by-product trapping amount during a former part of a use duration time.

Abstract: The present disclosure provides an apparatus for trapping of a reaction by-product having a self regenerating function for a used inner collecting tower, and an object of the present disclosure is to provide the reaction by-product trapping apparatus configured such that the trapping apparatus positioned between a process chamber and a vacuum pump or between the vacuum pump and a scrubber stops operating during a semiconductor manufacturing process when a trapping reaction of trapping a reaction by-product reaches a saturated state during a trapping operation, and the trapping apparatus removes the reaction by-product produced in an inner collecting tower through a heating reaction, such that the inner collecting tower is regenerated to enable an additional trapping reaction to be performed.

Abstract: ABSTRACT An apparatus is for collecting a by-product in a semiconductor manufacturing process. The apparatus includes: a housing cooling channel on an inner wall thereof to cool exhaust gas which is temperature-controlled by a heater while being introduced through a gas inlet of an upper plate; an internal collecting tower including multiple vertical plates and multiple horizontal plates that are assembled, and condensing and collecting a by-product from the exhaust gas; a main cooling channel having a serpentine shape and cooling the exhaust gas uniformly by using coolant while passing through the internal collecting tower; and a multi-connection pipe sequentially supplying the coolant to the upper plate cooling channel, the housing cooling channel, and the main cooling channel and discharging the coolant, by using a supply pipe and a discharge pipe that are provided outside the housing.

Abstract: The present disclosure relates to an apparatus for trapping a reaction by-products produced during an organic film deposition process, and an object of the present disclosure is to provide a trapping apparatus having an internal trapping tower in which disc-type trapping units, which each have structure-type trapping plates having a large surface area per unit area in order to trap reaction by-products contained in an unreacted gas introduced into the trapping apparatus after an organic film deposition process, among semiconductor manufacturing processes, is performed in the process chamber, and a trapping disc configured to concentrate a flow of the gas or disperse or discharge the gas, are vertically arranged in multiple layers, such that the trapping apparatus traps the reaction by-products in the form of a thin film in a state in which the residence time of the gas is increased and uniform temperature distribution is maintained.

Abstract: The present disclosure relates to an apparatus for trapping a reaction by-product created by an etching process, the apparatus being configured to trap a reaction by-product contained in an unreacted gas discharged after a process is performed in an etching process chamber during a semiconductor manufacturing process, trap and stack the reaction by-product in the form of powder at a position between a vacuum pump and a scrubber through multiple flow path switching structures, multiple trapping structures, and multiple stacking structures, and discharge only a gaseous unreacted gas to the scrubber.

Abstract: An apparatus is for trapping multiple reaction by-products for a semiconductor process, in which a trapping region is divided by a difference in vertical temperature distribution according to a distance spaced apart from a heater and by structures for switching flow path directions and generating multiple vortices using a trapping structure, and reaction by-product mixtures contained in a gas, which is discharged after a process of depositing multiple different thin film layers is performed in a process chamber during a semiconductor manufacturing process, is trapped by a single trapping apparatus, such that a reaction by-product, which is aggregated in the form of a thin film in a relatively high-temperature region, is trapped by a first trapping part in an upper region, and a reaction by-product, which is aggregated in the form of powder in a relatively low-temperature region, is trapped by a second trapping part in a lower region.

Abstract: The present disclosure relates to an apparatus for trapping multiple reaction by-products for a semiconductor process, in which in order to separate, with the single trapping apparatus, reaction by-product mixtures contained in unreacted gases discharged after a process of depositing multiple different thin film layers is performed in a process chamber during a semiconductor manufacturing process, a trapping region division part is provided, which divides a heat distribution region into trapping regions for respective reaction by-products while controlling a flow in a movement direction of an introduced unreacted gas, thereby trapping a reaction by-product aggregated in the form of a thin film in a relatively high-temperature region by using a first internal trapping tower in a front region, and trapping a reaction by-product aggregated in the form of powder in a relatively low-temperature region by using a second internal trapping tower in a rear region.

Abstract: Disclosed is an apparatus for collecting a by-product in a semiconductor manufacturing process, the apparatus including: a heating jacket provided detachably along an outer circumference of a housing unit to provide a uniform temperature in a space into which exhaust gas containing tungsten hexafluoride (WF6) discharged after being used in a semiconductor manufacturing process flows; an upper internal collecting tower having first collecting plates and second collecting plates alternately arranged at regular intervals in a vertical direction to realize sufficient moving path and time in a narrow space; and a lower internal collection tower having third collecting plates arranged at regular intervals in the vertical direction, the third collecting plates having different regions on each surface thereof such that each of the third collecting plates is misaligned with a next third collecting plate to realize sufficient moving path and time in a narrow space.

Abstract: Disclosed is an apparatus having a cooling line for collecting a by-product in a semiconductor manufacturing process. The apparatus includes: a housing (110) including an inner wall plate (111) on an inner wall thereof to collect a by-product while generating a vortex in exhaust gas which is temperature-controlled by a heater (140) while being introduced through a gas inlet of an upper plate; an internal collecting tower (150) including vertical plates, an upper cover plate, and vortex plates fitted to the vertical plates, and condensing the introduced exhaust gas to collect the by-product; a main cooling channel (160) cooling the exhaust gas by using coolant while passing through the internal collecting tower (150); and a multi-connection pipe (170) sequentially supplying the coolant to an upper plate cooling channel and a main cooling channel and discharging the coolant, by using a supply pipe and a discharge pipe provided outside the housing.

Abstract: The present disclosure relates to an apparatus for trapping a reaction by-products produced during an organic film deposition process, and an object of the present disclosure is to provide a trapping apparatus having an internal trapping tower in which disc-type trapping units, which each have structure-type trapping plates having a large surface area per unit area in order to trap reaction by-products contained in an unreacted gas introduced into the trapping apparatus after an organic film deposition process, among semiconductor manufacturing processes, is performed in the process chamber, and a trapping disc configured to concentrate a flow of the gas or disperse or discharge the gas, are vertically arranged in multiple layers, such that the trapping apparatus traps the reaction by-products in the form of a thin film in a state in which the residence time of the gas is increased and uniform temperature distribution is maintained.

Abstract: The flow path switching type collecting apparatus of by-products for a semiconductor manufacturing process of the present disclosure includes: a cylindrical housing that has a top plate having a gas inlet and a bottom plate having a gas outlet and fastening portions extending and protruding inside the housing, and receives and then discharges an exhaust gas flowing inside; and a flow path switching type disc collection tower that is installed vertically in the housing and includes an open edge-mesh center type collection disc, a mesh edge-open center type collection disc, a solid edge-open center type collection disc, and an open edge-solid center type collection disc that have different external shape to collect by-products of an exhaust gas flowing insides.

Abstract: The apparatus for collecting by-products of the present disclosure includes: a cylindrical housing that has a top plate having a gas inlet and a bottom plate having a gas outlet extending and protruding inside the housing, and receives and then discharges an exhaust gas flowing inside; and a flow path change-type vertical internal collection tower that is installed in a hanging state inside the housing and includes a disc type collector, a diffusion plate, a cylindrical collector, and a cylindrical filter collector for collecting by-products in an exhaust gas flowing inside.

Abstract: Disclosed is an apparatus for collecting a by-product in a semiconductor process, the apparatus including: a housing; a heater plate; a heater power supply unit; first and second upper horizontal brackets collecting a part of a by-product in a powder form; a by-product collecting tower allowing the exhaust gas to pass vertically and collecting a part of the by-product in a powder form; a lower horizontal bracket guiding the exhaust gas toward a window and collecting a part of the by-product in a powder form; the window blocking the powder form by-product from introducing toward a gas collecting and discharging port and guiding the exhaust gas thereto; and the gas collecting and discharging port. Accordingly, the apparatus can increase capacity of collecting by-products with a simple structure, thereby extending a replacement period of the apparatus and collect a large amount of by-products efficiently over a long period of time.

Abstract: Disclosed is an apparatus having a cooling line for collecting a by-product in a semiconductor manufacturing process. The apparatus includes: a housing cooling channel (111) on an inner wall thereof to cooling exhaust gas which is temperature-controlled by a heater (140) while being introduced through a gas inlet of an upper plate; an internal collecting tower (150) including multiple vertical plates and multiple horizontal plates that are assembled, and condensing and collecting a by-product from the exhaust gas; a main cooling channel (160) having a serpentine shape and cooling the exhaust gas uniformly by using coolant while passing through the internal collecting tower (150); and a multi-connection pipe (170) sequentially supplying the coolant to the upper plate cooling channel, the housing cooling channel, and the main cooling channel and discharging the coolant, by using a supply pipe and a discharge pipe that are provided outside the housing.

Abstract: Disclosed is an apparatus having a cooling line for collecting a by-product in a semiconductor manufacturing process. The apparatus includes: a housing (110) including an inner wall plate (111) on an inner wall thereof to collect a by-product while generating a vortex in exhaust gas which is temperature-controlled by a heater (140) while being introduced through a gas inlet of an upper plate; an internal collecting tower (150) including vertical plates, an upper cover plate, and vortex plates fitted to the vertical plates, and condensing the introduced exhaust gas to collect the by-product; a main cooling channel (160) cooling the exhaust gas by using coolant while passing through the internal collecting tower (150); and a multi-connection pipe (170) sequentially supplying the coolant to an upper plate cooling channel and a main cooling channel and discharging the coolant, by using a supply pipe and a discharge pipe provided outside the housing.

Abstract: Disclosed is an apparatus for collecting a by-product in a semiconductor manufacturing process. An objective of the present invention is to provide an apparatus for collecting a by-product such that exhaust gas having great amount of light gas is coagulated while having sufficient residence time in a long flow path, whereby the exhaust gas is collected as a high-density by-product. For this purpose, the apparatus includes: a housing receiving and discharging introduced exhaust gas and configured with a horizontal vortex plate; an upper plate covering an upper portion of the housing; an internal collecting tower provided with a collecting tower cover and a seed eliminating fin to extend a flow path and residence time of the exhaust gas; a heater having a heat conduction plate; and an extended discharging pipe configured to extend the flow path and residence time of the exhaust gas and discharge the exhaust gas.