Patents by Inventor Che-Hung Huang

Che-Hung Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6878260
    Abstract: A process for forming an interface (106) between a plated and a non-plated area (102, 104) on the surface of a plastic component (100) is disclosed. First, an anti-plating layer (110) is formed over the surface of the plastic component. Thereafter, a low-power laser beam (10) is used to remove a portion of the anti-plating layer and to form an interface between the plated area and the non-plated area. A seeding layer (120) is formed on the plated area so that the plated area is electrically conductive. Finally, a metallic layer (130) is electrically plated over the seeding layer. The metallic layer connects with the anti-plating layer via the interface. The cost of producing the anti-plating layer is low. Moreover, since the laser etching operation is able to produce a high-quality interface boundary between the plated and the non-plated area, yield of the process is improved.
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: April 12, 2005
    Assignee: High Tech Computer, Corp.
    Inventors: Che-Hung Huang, Steven Hsu
  • Publication number: 20040203267
    Abstract: A self-alignment structure inside a cradle set for accommodating a personal digital assistant (PDA) module is provided. The cradle set has a circuit board (206) and a connector (204) therein. The alignment structure comprises a base plate (208), at least a sectional bolt (210) and an elastic body (220). The base plate has at least a threaded hole (208a). The sectional bolt has a cap piece (216) at the top end and a threaded section (212) at the bottom end. The threaded section of the sectional bolt passes through the circuit board and screwed into the threaded hole in the base plate so that the circuit board and the base plate are locked together. In addition, there is a space between the sectional bolt and the circuit board for accommodating the elastic body.
    Type: Application
    Filed: July 15, 2003
    Publication date: October 14, 2004
    Inventors: Ching-Shih Chen, Che-Hung Huang
  • Publication number: 20040202776
    Abstract: A process for forming an interface (106) between a plated and a non-plated area (102, 104) on the surface of a plastic component (100) is disclosed. First, an anti-plating layer (110) is formed over the surface of the plastic component. Thereafter, a low-power laser beam (10) is used to remove a portion of the anti-plating layer and to form an interface between the plated area and the non-plated area. A seeding layer (120) is formed on the plated area so that the plated area is electrically conductive. Finally, a metallic layer (130) is electrically plated over the seeding layer. The metallic layer connects with the anti-plating layer via the interface. The cost of producing the anti-plating layer is low. Moreover, since the laser etching operation is able to produce a high-quality interface boundary between the plated and the non-plated area, yield of the process is improved.
    Type: Application
    Filed: June 9, 2003
    Publication date: October 14, 2004
    Inventors: Che-Hung Huang, Steven Hsu
  • Patent number: 6749465
    Abstract: A card connector (200) with a reinforcing structure (230) is provided for used in a handheld device. The card connector can mate with an elongated expansion card (10) which when inserted into the card connector has a portion located outside the handheld device. The card connector comprises an insulated main body (210) and a plurality of terminals (220) fixed to the main body. The terminals are used for electrically connecting the elongated expansion card with a printed circuit board (20) on which the card connector is mounted. The reinforcing structure (230) is formed from highly rigid material or high molecular weight polymer. The reinforcing structure strengthens the card connector against any external force resulting from subjecting the elongated expansion card to an external force, whereby the electrical connection between the terminals and printed circuit board will not break due to the external force.
    Type: Grant
    Filed: July 4, 2003
    Date of Patent: June 15, 2004
    Assignee: High Tech Computer, Corp.
    Inventors: Che-Hung Huang, Steven Hsu