Patents by Inventor Che-Kai CHANG

Che-Kai CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240387681
    Abstract: Semiconductor devices and methods of manufacture are presented in which spacers are manufactured on sidewalls of gates for semiconductor devices. In embodiments the spacers comprise a first seal, a second seal, and a contact etch stop layer, in which the first seal comprises a first shell along with a first bulk material, the second seal comprises a second shell along with a second bulk material, and the contact etch stop layer comprises a third bulk material and a second dielectric material.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Inventors: Wen-Kai Lin, Che-Hao Chang, Chi On Chui, Yung-Cheng Lu
  • Publication number: 20240371649
    Abstract: A method of forming a semiconductor device includes forming a first epitaxial layer over a substrate to form a wafer, depositing a dielectric layer over the first epitaxial layer, patterning the dielectric layer to form an opening, etching the first epitaxial layer through the opening to form a recess, forming a second epitaxial layer in the recess, etching the dielectric layer to expose a top surface of the first epitaxial layer, and planarizing the exposed top surface of the first epitaxial layer and a top surface of the second epitaxial layer.
    Type: Application
    Filed: July 17, 2024
    Publication date: November 7, 2024
    Inventors: Che-Lun Chang, Pin-Chuan Su, Hsin-Chieh Huang, Ming-Yuan Wu, Tzu kai Lin, Yu-Wen Wang, Che-Yuan Hsu
  • Patent number: 12131911
    Abstract: A method of forming a semiconductor device includes forming a first epitaxial layer over a substrate to form a wafer, depositing a dielectric layer over the first epitaxial layer, patterning the dielectric layer to form an opening, etching the first epitaxial layer through the opening to form a recess, forming a second epitaxial layer in the recess, etching the dielectric layer to expose a top surface of the first epitaxial layer, and planarizing the exposed top surface of the first epitaxial layer and a top surface of the second epitaxial layer.
    Type: Grant
    Filed: June 20, 2022
    Date of Patent: October 29, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Che-Lun Chang, Pin-Chuan Su, Hsin-Chieh Huang, Ming-Yuan Wu, Tzu kai Lin, Yu-Wen Wang, Che-Yuan Hsu
  • Patent number: 12130467
    Abstract: A backlight module comprises a back plate, a light-guiding plate arranged at the back plate and a light source module. The light-guiding plate has an incident surface and an emitting surface connected to each other. The light source module has a base board and at least one light-emitting unit. The base board is disposed at the emitting surface of the light-guiding plate. The light-emitting unit is mounted at the base board and faces the incident surface of the light-guiding plate. The base board comprises an electrically-connecting portion and at least one heat dissipation portion. The electrically-connecting portion is electrically connected to the light-emitting unit. The heat dissipation portion extends from the electrically-connecting portion toward a direction away from the light-guiding plate without being electrically connected to the light-emitting unit. A display device having the backlight module is also provided.
    Type: Grant
    Filed: December 13, 2023
    Date of Patent: October 29, 2024
    Assignee: RADIANT OPTO-ELECTRONICS CORPORATION
    Inventors: Kuan-Feng Chen, Che-Kai Chang, Jyun-Siang Chen, Chih-Chun Wang
  • Patent number: 12100360
    Abstract: The present disclosure provides a backlight module and a display device. The backlight module includes a light source structure and an optical film. The light source structure includes a substrate, plural light-emitting units and a package structure. The light-emitting units are disposed on the substrate. The package structure covers the light-emitting units, and the package structure has plural convex portions. The optical film is disposed on the light source structure, and the optical film is in contact with the convex portions of the package structure.
    Type: Grant
    Filed: July 13, 2023
    Date of Patent: September 24, 2024
    Assignee: Radiant Opto-Electronics Corporation
    Inventors: Jui-Lin Chen, Pin-Hsun Lee, Yuan-Jhang Chen, Che-Kai Chang, Chun-Hung Ho, Hung-Yi Chen
  • Publication number: 20240306514
    Abstract: A magnetic random access memory structure includes a first dielectric layer; a bottom electrode layer disposed on the first dielectric layer; a spin orbit coupling layer disposed on the bottom electrode layer; a magnetic tunneling junction (MTJ) element disposed on the spin orbit coupling layer; a top electrode layer disposed on the MTJ element; a protective layer surrounding the MTJ element and the top electrode layer, and the protective layer masking the spin orbit coupling layer; and a spacer layer surrounding the protective layer.
    Type: Application
    Filed: March 27, 2023
    Publication date: September 12, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Che-Wei Chang, Ching-Hua Hsu, Chen-Yi Weng, Po-Kai Hsu
  • Publication number: 20240297237
    Abstract: A method of forming a semiconductor device includes: forming a dummy gate structure over a nanostructure, where the nanostructure overlies a fin that protrudes above a substrate, where the nanostructure comprises alternating layers of a first semiconductor material and a second semiconductor material; forming openings in the nanostructure on opposing sides of the dummy gate structure, the openings exposing end portions of the first semiconductor material and end portions of the second semiconductor material; recessing the exposed end portions of the first semiconductor material to form first sidewall recesses; filling the first sidewall recesses with a multi-layer spacer film; removing at least one sublayer of the multi-layer spacer film to form second sidewall recesses; and forming source/drain regions in the openings after removing at least one sublayer, where the source/drain regions seal the second sidewall recesses to form sealed air gaps.
    Type: Application
    Filed: May 10, 2024
    Publication date: September 5, 2024
    Inventors: Wen-Kai Lin, Yung-Cheng Lu, Che-Hao Chang, Chi On Chui
  • Publication number: 20240298547
    Abstract: A magnetic random access memory structure includes a first dielectric layer, a bottom electrode layer disposed on the first dielectric layer; a spin orbit coupling layer disposed on the bottom electrode layer; a magnetic tunneling junction (MTJ) element disposed on the spin orbit coupling layer; a top electrode layer disposed on the MTJ element; a protective layer surrounding the MTJ element and the top electrode layer, and the protective layer masking the spin orbit coupling layer; a mask layer surrounding the protective layer, and a spacer layer surrounding the mask layer and the protective layer.
    Type: Application
    Filed: March 16, 2023
    Publication date: September 5, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Che-Wei Chang, Ching-Hua Hsu, Chen-Yi Weng, Po-Kai Hsu
  • Publication number: 20240272349
    Abstract: A backlight module comprises a back plate, a light-guiding plate arranged at the back plate and a light source module. The light-guiding plate has an incident surface and an emitting surface connected to each other. The light source module has a base board and at least one light-emitting unit. The base board is disposed at the emitting surface of the light-guiding plate. The light-emitting unit is mounted at the base board and faces the incident surface of the light-guiding plate. The base board comprises an electrically-connecting portion and at least one heat dissipation portion. The electrically-connecting portion is electrically connected to the light-emitting unit. The heat dissipation portion extends from the electrically-connecting portion toward a direction away from the light-guiding plate without being electrically connected to the light-emitting unit. A display device having the backlight module is also provided.
    Type: Application
    Filed: December 13, 2023
    Publication date: August 15, 2024
    Inventors: Kuan-Feng CHEN, Che-Kai CHANG, Jyun-Siang CHEN, Chih-Chun WANG
  • Patent number: 12043219
    Abstract: This disclosure provides a sealed type windshield wiper structure (1). The carrying seat (20) is combined on the hooking seat (10). The carrying seat (20) includes a carrying board (21) and a carrying frame (22). The carrying board (21) includes a through slot (210), and the carrying frame (22) includes an accommodating slot (220). The elastic piece (30) is inserted in the through slot (210). The waterproof cover (40) includes a shell (41), an inner space (32) and an outer space (43) The carrying seat (20) is inserted in the inner space (42). The rubber wiper (50) includes a piercing strip (51) and a scraping strip (52). The piercing strip (51) is inserted in the outer space (43), and the scraping strip (52) is exposed from the waterproof cover (40) to configure the sealed type windshield wiper structure (1).
    Type: Grant
    Filed: June 27, 2023
    Date of Patent: July 23, 2024
    Assignee: DANYANG UPC AUTO PARTS CO., LTD.
    Inventors: Che-Wei Chang, Cheng-Kai Yang, Chuan-Chih Chang
  • Publication number: 20240241155
    Abstract: A probe card includes a structure stiffener unit including a base with a lower surface where central and peripheral supporting elements protrude out and a main circuit board is fixed, a space transformer and a probe head disposed thereunder, which are disposed to the supporting elements by bolts and defined with central and peripheral regions located correspondingly to the central and peripheral supporting elements respectively, and a metal supporting member fixed on the space transformer in a direct contact manner and located correspondingly to the central region. The supporting member has a lower surface coplanar with the lower end surface of the peripheral supporting element, which is abutted on the space transformer, and an upper surface against which the central supporting element is abutted. The space transformer has great structural strength, flatness and heat dissipation effect for satisfying the large-area requirement and great electrical property testing stability.
    Type: Application
    Filed: January 10, 2024
    Publication date: July 18, 2024
    Applicant: MPI CORPORATION
    Inventors: CHIN-YI LIN, CHE-WEI LIN, HSUEH-CHIH WU, TSUNG-YI CHEN, SHANG-JUNG HSIEH, SHENG-YU LIN, CHIEN-KAI HUNG, SHENG-WEI LIN, SHU-JUI CHANG
  • Publication number: 20240069452
    Abstract: Embodiments of the present disclosure relate to projection stabilization systems and maskless lithography systems having projection stabilization systems. The projection stabilization system compensates for propagating vibrations that move image projection systems (IRS's). The IRS's are in a processing positon prior to operation of the maskless lithography process. One or more stiffeners are coupled to the IPS. The one or more stiffeners apply pressure to flexures coupled to each stiffener. The flexures are coupled to the IPS to provide stabilization to the IPS during the operations of the maskless lithography process. For example, the one or more of stiffeners protect the IPS from vibrations that propagate through the system during operation.
    Type: Application
    Filed: February 1, 2022
    Publication date: February 29, 2024
    Inventors: Assaf KIDRON, Jiawei SHI, Liang-Yuh CHEN, Che-Kai CHANG, Tsu-Hui YANG, Nimrod SMITH, Grant WANG, Preston FUNG, Vasuman Ghanapaati SRIRANGARAJAN, Davidi KALIR, Rudolf C. BRUNNER
  • Publication number: 20230360611
    Abstract: The present disclosure provides a backlight module and a display device. The backlight module includes a light source structure and an optical film. The light source structure includes a substrate, plural light-emitting units and a package structure. The light-emitting units are disposed on the substrate. The package structure covers the light-emitting units, and the package structure has plural convex portions. The optical film is disposed on the light source structure, and the optical film is in contact with the convex portions of the package structure.
    Type: Application
    Filed: July 13, 2023
    Publication date: November 9, 2023
    Inventors: Jui-Lin CHEN, Pin-Hsun LEE, Yuan-Jhang CHEN, Che-Kai CHANG, Chun-Hung HO, Hung-Yi CHEN
  • Patent number: D1044675
    Type: Grant
    Filed: August 7, 2023
    Date of Patent: October 1, 2024
    Assignee: DANYANG UPC AUTO PARTS CO., LTD.
    Inventors: Che-Wei Chang, Cheng-Kai Yang, Chuan-Chih Chang
  • Patent number: D1044676
    Type: Grant
    Filed: August 8, 2023
    Date of Patent: October 1, 2024
    Assignee: DANYANG UPC AUTO PARTS CO., LTD.
    Inventors: Che-Wei Chang, Cheng-Kai Yang, Chuan-Chih Chang