Patents by Inventor Chee Yang Ng

Chee Yang Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9117807
    Abstract: An integrated passives package includes an encapsulation compound and a plurality of electrically conductive pads embedded in the encapsulation compound. Each of the pads has opposing first and second sides. The first side of the pads is uncovered by the encapsulation compound and forms array of external electrical connections at a first side of the package. The integrated passives package further includes a plurality of passive components embedded in the encapsulation compound. Each of the passive components has a first terminal attached to one of the pads and a second terminal attached to a different one the pads at the second side of the pads. Corresponding semiconductor modules and methods of manufacturing are also provided.
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: August 25, 2015
    Assignee: INFINEON TECHNOLOGIES AG
    Inventor: Chee Yang Ng
  • Publication number: 20150145107
    Abstract: A semiconductor device includes a semiconductor chip having a first main surface, a second main surface opposite to the first main surface, and a side wall surface. An electrical contact area is exposed at the side wall surface of the semiconductor chip. An electrically conducting layer covers at least partially the second main surface and the electrical contact area.
    Type: Application
    Filed: November 26, 2013
    Publication date: May 28, 2015
    Inventor: Chee Yang Ng
  • Publication number: 20150145078
    Abstract: A semiconductor package includes a semiconductor die having a first main side and a second main side opposite the first main side, the first main side having an inner region surrounded by a periphery region. The semiconductor package further includes a film covering the semiconductor die and adhered to the periphery region of the first main side of the semiconductor die. The film has a curved surface so that the inner region of the first main side of the semiconductor die is spaced apart from the film by an air gap. Electrical conductors are attached at a first end to pads at the periphery region of the first main side of the semiconductor die. A corresponding method of manufacture is also provided.
    Type: Application
    Filed: November 26, 2013
    Publication date: May 28, 2015
    Inventor: Chee Yang Ng
  • Publication number: 20150146894
    Abstract: A semiconductor device includes a microphone module implemented on a first semiconductor die and a signal processing module implemented on a second semiconductor die. The microphone module includes a movable microphone element arranged at a main side of the first semiconductor die and the second semiconductor die is mounted to the main side of the first semiconductor die.
    Type: Application
    Filed: November 25, 2013
    Publication date: May 28, 2015
    Applicant: Infineon Technologies AG
    Inventor: Chee Yang Ng
  • Publication number: 20150028463
    Abstract: An integrated passives package includes an encapsulation compound and a plurality of electrically conductive pads embedded in the encapsulation compound. Each of the pads has opposing first and second sides. The first side of the pads is uncovered by the encapsulation compound and forms array of external electrical connections at a first side of the package. The integrated passives package further includes a plurality of passive components embedded in the encapsulation compound. Each of the passive components has a first terminal attached to one of the pads and a second terminal attached to a different one the pads at the second side of the pads. Corresponding semiconductor modules and methods of manufacturing are also provided.
    Type: Application
    Filed: July 26, 2013
    Publication date: January 29, 2015
    Inventor: Chee Yang Ng