Abstract: A method of forming a semiconductor device includes: forming a fin protruding above a substrate, where a top portion of the fin comprises a layer stack that includes alternating layers of a first semiconductor material and a second semiconductor material; forming a dummy gate structure over the fin; forming openings in the fin on opposing sides of the dummy gate structure; forming source/drain regions in the openings; removing the dummy gate structure to expose the first semiconductor material and the second semiconductor material under the dummy gate structure; performing a first etching process to selectively remove the exposed first semiconductor material, where after the first etching process, the exposed second semiconductor material form nanostructures, where each of the nanostructures has a first shape; and after the first etching process, performing a second etching process to reshape each of the nanostructures into a second shape different from the first shape.

Abstract: An antenna structure capable of transmitting a WiGig band for a head-mounted wireless transmission display device including a display screen and an overhead device is disclosed. The antenna structure includes at least two body portions, each of the body portions having at least a signal transceiving end, the body portions are respectively arranged at left and right sides of the display screen, and signal transceiving ends of the body portions are extended outward from the left and right sides of the display screen respectively.

Abstract: Systems, devices and methods of manufacturing a system on silicon wafer (SoSW) device and package are described herein. A plurality of functional dies is formed in a silicon wafer. Different sets of masks are used to form different types of the functional dies in the silicon wafer. A first redistribution structure is formed over the silicon wafer and provides local interconnects between adjacent dies of the same type and/or of different types. A second redistribution structure may be formed over the first redistribution layer and provides semi-global and/or global interconnects between non-adjacent dies of the same type and/or of different types. An optional backside redistribution structure may be formed over a second side of the silicon wafer opposite the first redistribution layer. The optional backside redistribution structure may provide backside interconnects between functional dies of different types.

Abstract: The present disclosure provides a multi-state one-time programmable (MSOTP) memory circuit including a memory cell and a programming voltage driving circuit. The memory cell includes a MOS storage transistor, a first MOS access transistor and a second MOS access transistor electrically connected to store two bits of data. When the memory cell is in a writing state, the programming voltage driving circuit outputs a writing control potential to the gate of the MOS storage transistor, and when the memory cell is in a reading state, the programming voltage driving circuit outputs a reading control potential to the gate of the MOS storage transistor.

Abstract: A resin composition and a metal clad substrate are provided. The resin composition includes: 5 phr to 15 phr of a maleimide resin, 5 phr to 30 phr of a benzoxazine resin, 40 phr to 70 phr of an epoxy resin, and 40 phr to 60 phr of fillers. An amount of fluorine atoms contained in the maleimide resin ranges from 10 wt % to 50 wt %.

Abstract: A resin composition, a prepreg, and a printed circuit board are provided. The resin composition is used to form a dielectric substrate layer. The resin composition includes a polymeric based material and fillers. Based on a total volume of the resin composition being 100 vol %, the resin composition includes 10 vol % to 60 vol % of the polymeric based material and 1 vol % to 80 vol % of the fillers. The fillers include hollow fillers, and the hollow fillers include a first hollow filler. A material of the first hollow filler is silicon dioxide.

Abstract: A resin composition, a prepreg, and a printed circuit board are provided. The resin composition is used to form a dielectric substrate layer. The resin composition includes a polymeric based material and fillers. Based on a total volume of the resin composition being 100 vol %, the resin composition includes 10 vol % to 60 vol % of the polymeric based material and 1 vol % to 80 vol % of the fillers. The fillers include hollow fillers, and the hollow fillers include a first hollow filler. A material of the first hollow filler is silicon dioxide.

Abstract: An antenna structure capable of transmitting a WiGig band for a head-mounted wireless transmission display device including a display screen and an overhead device is disclosed. The antenna structure includes at least two body portions, each of the body portions having at least a signal transceiving end, the body portions are respectively arranged at left and right sides of the display screen, and signal transceiving ends of the body portions are extended outward from the left and right sides of the display screen respectively.

Abstract: A method for folding and extending an antenna structure capable of transmitting a WiGig band is provided. The method has the following steps: (1) mounting a WiGig module within a base; (2) pivotally arranging the antenna structure on the base; and (3) folding or extending the antenna structure relative to the base to correspondingly reduce or increase the antenna structure for transmitting and receiving a valid range of a wireless signal. The antenna structure has two body portions, and each of the two body portions has a pivoting end and a signal receiving end opposite to the pivoting end. Each of the pivoting ends is pivotally disposed on the base at a first specific angle with respect to a horizontal plane, and each of the signal receiving ends is inclined downward by a second specific angle with respect to the body portion and disposed away from the body portion.

Abstract: A linear guideway includes a rail, a slider disposed on the rail, and a load passage formed between the rail and the slider. The slider has two non-load passages penetrating through two opposite end surfaces of the slider. Each of two ends of each non-load passage is provided with a force sensor. Two end caps are disposed on two opposite end surfaces of the slider respectively and each have two circulation grooves. Each circulation groove is connected to an end of the load passage and an end of the non-load passage to form a circulation channel for balls to move therein. As a result, the linear guideway of the present invention employs force sensors to sense the force-receiving state of two ends of the non-load passages when they are impacted by the balls, so that it can be determined that if the balls have an abnormal pressing state.

Abstract: A method for folding and extending an antenna structure capable of transmitting a WiGig band is provided. The method has the following steps: (1) mounting a WiGig module within a base; (2) pivotally arranging the antenna structure on the base; and (3) folding or extending the antenna structure relative to the base to correspondingly reduce or increase the antenna structure for transmitting and receiving a valid range of a wireless signal. The antenna structure has two body portions, and each of the two body portions has a pivoting end and a signal receiving end opposite to the pivoting end. Each of the pivoting ends is pivotally disposed on the base at a first specific angle with respect to a horizontal plane, and each of the signal receiving ends is inclined downward by a second specific angle with respect to the body portion and disposed away from the body portion.

Abstract: A wafer container is provided. The wafer container includes a housing, a door and an air-tight device. The housing has a room with an opening formed therein, and a door frame surrounding the opening. The door fits in the door frame to close the opening. The air-tight device is disposed around the door, located between the door and the door frame, and having a protruding part extending toward the room. The protruding part has an early-stage pressure-adjusting element configured to exhaust a first gas from the room by pumping a second gas into the room when the door is closed.

Abstract: The present invention relates to gas distributors used in wafer carriers. The gas distributors comprise a body having an interior space, a separator configured at the front side of the body in the interior space, and an air inlet connected with the body. One edge of the separator and the front side of the body together form a passage. The configuration of the passage in the gas distributors enables the gas distributors to evenly distribute gases.

Abstract: An electronic device has a management data input/output (MDIO) bus, a control unit, and an MDIO master. The control circuit receives a host command from a host device, and outputs a plurality of MDIO commands in response to the host command. The MDIO master receives the MDIO commands from the control circuit, and transmits the MDIO commands to the MDIO bus.

Abstract: An electronic device includes a control circuit and a bus interface. The control circuit packs a plurality of commands in a compound command frame. The bus interface communicates with another electronic device via a bus between the electronic device and the another electronic device, and packs the compound command frame in a single packet and transmits the single packet over the bus.

Abstract: An electronic device includes a control circuit and a bus interface. The control circuit packs a plurality of commands in a compound command frame. The bus interface communicates with another electronic device via a bus between the electronic device and the another electronic device, and packs the compound command frame in a single packet and transmits the single packet over the bus.

Abstract: The present invention relates to gas distributors used in wafer carriers. The gas distributors comprise a body having an interior space, a separator configured at the front side of the body in the interior space, and an air inlet connected with the body. One edge of the separator and the front side of the body together form a passage. The configuration of the passage in the gas distributors enables the gas distributors to evenly distribute gases.

Abstract: An electronic device has a management data input/output (MDIO) bus, a control unit, and an MDIO master. The control circuit receives a host command from a host device, and outputs a plurality of MDIO commands in response to the host command. The MDIO master receives the MDIO commands from the control circuit, and transmits the MDIO commands to the MDIO bus.

Abstract: A wafer container is provided. The wafer container includes a housing, a door and an air-tight device. The housing has a room with an opening formed therein, and a door frame surrounding the opening. The door fits in the door frame to close the opening. The air-tight device is disposed around the door, located between the door and the door frame, and having a protruding part extending toward the room. The protruding part has an early-stage pressure-adjusting element configured to exhaust a first gas from the room by pumping a second gas into the room when the door is closed.