Abstract: A waterproof electronic device that is waterproof and has pressure-equilibrium functions is provided. The waterproof electronic device includes a housing, a microphone, an elastic element, and a waterproof element. The housing has a chamber and an acoustic hole communicating with the chamber. The microphone is disposed in the chamber. The elastic element is disposed on the microphone. The elastic element includes a through hole facing the microphone, and a ventilation groove communicating with the through hole. The waterproof element is connected to the elastic element and the housing, and is configured to block liquid. The waterproof element includes pores communicating with the acoustic hole and the through hole.

Abstract: An object burr processing machine for trimming object burr, comprises a machine base, a positioning seat erected on the machine base, a processing arm provided on the positioning seat, an object stage coupled with the machine base for placing object, and control device. The control device comprises an object sensing unit, a processing path setting unit, and a process control unit. The object sensing unit is able to sense the shape of the object. The processing path setting unit is able to define a processing path based on the shape of the object. The process control unit communicates and links to the processing arm, the object stage, the object sensing unit, and the processing path setting unit. During the burr trimming process, the process control unit can use the established processing path to control other devices to conduct the burr trimming process to the object, which greatly increases the convenience and efficiency of the processing.

Abstract: A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112?) and an attaching plane (113?) perpendicular to each other, coating an adhesive (50) on the contact planes (112?), connecting the contact planes to make the attaching planes co-planar.

Abstract: A voltage converter includes a driver, a subsidiary voltage converter, an inductor, a capacitor, and a voltage detection unit. The subsidiary voltage converter generates a driving voltage transmitted to the driver to supply working power to the driver. The driver controls the capacitor to be alternately charged and discharged through the inductor, thereby generating an output voltage and output current between the inductor and the first capacitor. The voltage detection unit detects an electric potential difference of the inductor and generates a reference voltage according to the electric potential difference, and the subsidiary voltage converter receives the reference voltage and adjusts the driving voltage according to the reference voltage.

Abstract: A power supply system to provide power for a central processing unit (CPU) includes a bridge circuit, a pulse width modulation (PWM) controller and a pulse adjusting driver circuit. The bridge circuit detects a work state of the PWM controller to obtain a feedback signal output from the PWM controller, and provides the feedback signal to the CPU. The CPU outputs a control signal to the bridge circuit according to a work state of the CPU and the feedback signal, and the bridge circuit outputs a PWM signal to the pulse adjusting driver circuit according to the control signal. The pulse adjusting driver circuit receives a first driving signal provided by an external circuit, and adjusts the first driving signal according to the PWM signal to generate at least one second driving signal to drive the CPU.

Abstract: A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board. The LED circuit board covered by the coating layer is placed in an LED lamp tube to provide good heat dissipation effect.

Abstract: A heat sink having heat-dissipating fins capable of increasing heat-dissipating area-includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

Abstract: A heat sink system and a heat sinking method having auto switching function are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

Abstract: A heat dissipating structure of a lightweight lamp cup 10 made of a porous material includes a containing cavity 11 at an end of the lamp cup 10, a lamp holder 30 at another end of the containing cavity 11, a metal hood 60 sheathed with the lamp holder 30 and covered onto an external side of the lamp cup 10, a heat conduction medium 50 between the lamp cup 10 and the metal hood 60, and a light emitting unit 20 contained in the containing cavity 11 of the lamp cup 10, such that the heat produced by the light emitting unit 20 can be conducted form the lamp cup 10 to the metal hood 60 and dissipated from the metal hood 60 to the outside.

Abstract: A heat-dissipating fin capable of increasing heat-dissipating area includes a lower plate and an upper plate. The lower plate is provided with a through-hole. The upper plate extends from the lower plate and is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the fin.

Abstract: A heat pipe assembly includes a number of heat pipes and a fixing seat. Each of the heat pipes includes an evaporating section and at least a condensing section. A bottom of the evaporating section of each of the heat pipes is flat and has a flat heat absorbing surface. The evaporating sections of each of the heat pipes are parallel to and adjoin with each other, whereby the flat heat absorbing surfaces of the evaporating sections of the heat pipes being coplanar and adjoining with each other. A top surface of the evaporating section of each of the heat pipes has a top edge. The fixing seat, as a molded one-piece member, combines with the top edge of the evaporating section of each of the heat pipes, whereby the heat absorbing surfaces of the evaporating sections of the heat pipes are coplanar and adjoin with each other.

Abstract: A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112?) and an attaching plane (113?) perpendicular to each other, coating an adhesive (50) on the contact planes (112?), connecting the contact planes to make the attaching planes co-planar.

Abstract: A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13).

Abstract: A heat-dissipating fin of a large area is made of a metallic sheet and has a fin body. An outer edge of one side of the fin body extends to form a sheet-like expanding portion. The expanding portion is bent and overlapped on the fin body to obtain the heat-dissipating fin. A heat sink includes a plurality of heat-dissipating fins and a heat-conducting element, which is formed by means of penetrating the respective heat-dissipating fins with a condensing section of the heat-conducting element.

Abstract: An application burning device and at least one power PWM controller are mounted on a main board. The device includes a processor and a storage unit storing applications to be burned to the at least one power PWM controller. The processor determines whether there is a power PWM controller not burned yet, and burns a corresponding application to the controller. A related application burning method is also provided.

Abstract: A power supply system to provide power for a central processing unit (CPU) includes a bridge circuit, a pulse width modulation (PWM) controller and a pulse adjusting driver circuit. The bridge circuit detects a work state of the PWM controller to obtain a feedback signal output from the PWM controller, and provides the feedback signal to the CPU. The CPU outputs a control signal to the bridge circuit according to a work state of the CPU and the feedback signal, and the bridge circuit outputs a PWM signal to the pulse adjusting driver circuit according to the control signal. The pulse adjusting driver circuit receives a first driving signal provided by an external circuit, and adjusts the first driving signal according to the PWM signal to generate at least one second driving signal to drive the CPU.

Abstract: The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of the heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.

Abstract: A method for manufacturing a heat sink includes providing a heat-conducting base with a plurality of open troughs; providing a plurality of heat pipes, each having a heat-absorbing section and a heat-releasing section extending from the heat-absorbing section; the heat-absorbing section being accommodated in one open trough to have the heat pipe engaged with the heat-conducting base; providing a plurality of heat-dissipating fins, each of the heat-dissipating fins having a lower plate and an upper plate extending from the lower plate, the upper plate being folded to form an overlapping portion attached on the lower plate; forming a through-hole in the lower plate and the upper plate at the overlapping portion; and penetrating the through-holes of the heat-dissipating fins by the heat-releasing section of the heat pipe. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

Abstract: A digital pulse width modulation (PWM) controller is used for controlling the operating voltage of an electrical load and includes a setting module, a storage module and a control module. The setting module generates control parameters corresponding to different preset load currents and load voltages of the electrical load. The storage module stores the control parameters and the prestored load current and load voltage. The control module is in electronic communication with the storage module, and detects current load voltage and current load current of the electrical load, and compares the current load voltage and load current with the prestored load voltage. Thus, the control module can output the control parameters which are necessary to stabilize the operating voltage of the electrical load, by comparison with stored data.

Abstract: A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102).