Abstract: A fish identification method is provided. The fish identification method includes capturing an image through a processor, wherein the image includes a fish image. The fish identification method includes identifying a plurality of feature points of the fish image through a coordinate detection model and obtaining a plurality of sets of feature-point coordinates. Each of the plurality of sets of feature-point coordinates corresponds to each of the plurality of feature points. The fish identification method further includes calculating a body length or an overall length of the fish image according to the plurality of sets of feature-point coordinates of the image.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A method for operating a conveying system is provided. An overhead hoist transport (OHT) vehicle is provided, wherein the OHT vehicle includes a gripping member configured to grip and hold a carrier, and a receiver configured to receive a signal. The signal is transmitted to the receiver of the OHT vehicle. The OHT vehicle is moved toward the carrier, and the carrier is gripped by the gripping member of the OHT vehicle. A lifting force is determined based on a weight of a carrier, a number of workpieces in the carrier, or a vertical distance between the OHT vehicle and the carrier, and the lifting force is applied to the carrier.

Abstract: An image sensor device and methods of forming an image sensor device are provided. The image sensor device includes a plurality of image-sensing elements arranged within the device substrate. The image sensor device further includes an isolation grid structure extending into the device substrate and made up of a plurality of isolation grid segments that surround the outer perimeters of the plurality of image-sensing elements. The isolation grid structure includes a passivation liner and a conductive material in contact with the passivation liner. The conductive material may be an indium-tin-oxide film.

Abstract: Some implementations described herein provide for techniques to form a biased backside deep trench isolation and grid structure for a backside illumination image sensor. The techniques include forming an array of backside deep trench isolation structures and a biasing-pad that electrically connects to the array of metal-filled backside deep trench isolation structures through the grid structure. The array of backside deep trench isolation structures, the grid structure, and the biasing-pad structure may reduce a likelihood of electrical cross-talk and/or oblique light cross-talk between the photodiodes of the backside illumination image sensor. In this way, a performance of the backside illumination image sensor may be improved. Such improvements may include a suppression of a dark current within the backside illumination image sensor, a reduction in a number of white pixels, and a reduction in cross-talk within the backside illumination image sensor.

Abstract: An optical structure and methods of forming an optical structure are provided. In some embodiments, the optical structure includes a substrate having a frontside and a backside opposite the frontside, a plurality of image-sensing elements arranged within the substrate, and a deep trench isolation (DTI) structure disposed between adjacent image-sensing elements. The DTI structure extends from the backside of the substrate to a first depth within the substrate and laterally surrounds the plurality of image-sensing elements. The optical structure further includes a light transmission layer formed over the backside of the substrate. The light transmission layer includes a first side and a second side adjacent to the backside of the substrate. The optical structure further includes a buried grid structure in the light transmission layer, the buried grid structure extending from the first side of the light transmission layer to a second depth within the light transmission layer.

Abstract: A photosensing pixel includes a substrate, a photosensing region, a floating diffusion region, a transfer gate and a control electrode. The photosensing region is located within the substrate. The floating diffusion region is located within the substrate aside the photosensing region. The transfer gate is disposed on the substrate and extending into the photosensing region. The control electrode is located on the substrate and extending into the floating diffusion region.

Abstract: A photosensing pixel includes a substrate, a photosensing region, a floating diffusion region, a transfer gate and a control electrode. The photosensing region is located within the substrate. The floating diffusion region is located within the substrate aside the photosensing region. The transfer gate is disposed on the substrate and extending into the photosensing region. The control electrode is located on the substrate and extending into the floating diffusion region.

Abstract: A photosensing pixel includes a substrate, a photosensing region, a floating diffusion region, a transfer gate and a control electrode. The photosensing region is located within the substrate. The floating diffusion region is located within the substrate aside the photosensing region. The transfer gate is disposed on the substrate and extending into the photosensing region. The control electrode is located on the substrate and extending into the floating diffusion region.