Patents by Inventor Chen-Ke Hsu

Chen-Ke Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210050473
    Abstract: An LED packaging device includes a frame including a bottom wall having a bottom surface and a surrounding wall extending upwardly from the bottom wall, at least one LED chip, a plurality of spaced-apart reflectors and a packaging body. The bottom and surrounding walls cooperatively define a mounting space. The surrounding wall has an internal side surface facing the mounting space and a top surface facing away from the bottom surface. The LED chip is disposed on the bottom surface and is received in the mounting space. Each of the reflectors is disposed on a peripheral region of the bottom surface. The packaging body covers the LED chip and the reflectors, such that the LED chip is sealed inside the mounting space.
    Type: Application
    Filed: November 2, 2020
    Publication date: February 18, 2021
    Inventors: JUNPENG SHI, JUWEI LEE, CHEN-KE HSU
  • Patent number: 10916458
    Abstract: A transfer head for transferring micro elements includes a cavity with a plurality of vacuum paths; a suite having a plurality of suction nozzles and vacuum path components. The suction nozzles are connected to the vacuum path components respectively, and the vacuum path components are formed to connect to vacuum paths in the cavity respectively. The suction nozzles absorb or release the micro elements through vacuum pressure, which is transmitted by vacuum path components and vacuum paths of each path. When the suite is mounted in the cavity, the upper surface of the suite is arranged with optical switching components for controlling the switch of the vacuum path components and vacuum paths of each path so that the suction nozzles can absorb or release required micro element through vacuum pressure.
    Type: Grant
    Filed: December 31, 2017
    Date of Patent: February 9, 2021
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Chen-Ke Hsu, Jiansen Zheng, Xiaojuan Shao, Kechuang Lin
  • Publication number: 20210013388
    Abstract: A micro light-emitting device includes a support substrate, at least one micro light-emitting element, and a support structure. The support structure includes a bonding layer, an electrically conductive layer, and a protective insulation layer. The micro light-emitting element is supported by the support structure on the support substrate. The micro light-emitting element includes a light-emitting structure and first and second electrodes. First and second contact regions of the first electrode are respectively connected to a supporting post portion of the electrically conductive layer and a surrounding post portion of the protective insulation layer. A production method of the device and use of the element are also disclosed.
    Type: Application
    Filed: September 21, 2020
    Publication date: January 14, 2021
    Inventors: Zhibai ZHONG, Chia-En LEE, Jinjian ZHENG, Zheng WU, Chen-Ke HSU, Junyong KANG
  • Publication number: 20210005791
    Abstract: A light-emitting diode (LED) filament structure includes a substrate, an LED chip unit, a first chromic layer, and a light conversion layer. The LED chip unit is disposed on the substrate, and includes first and second LED chips emitting different excitation lights. The first chromic layer covers the first and second LED chips. The light conversion layer covers the LED chip unit and the first chromic layer. The first chromic layer is configured to transition between an inactivated state and an activated state to prevent or allow the excitation light from the first or second LED chips to pass therethrough, so as to excite the light conversion layer to emit different excited lights having different color temperatures.
    Type: Application
    Filed: September 18, 2020
    Publication date: January 7, 2021
    Inventors: JUNPENG SHI, ZHEN-DUAN LIN, CHEN-KE HSU, PING ZHANG
  • Publication number: 20210005782
    Abstract: A micro light-emitting device includes a support structure with a cavity and at least one micro light-emitting element that includes a semiconductor structure accommodated by the cavity, at least one bridge connection member disposed on the semiconductor structure to interconnect the semiconductor structure and the support structure, and a protruding contact member disposed on at least one of the semiconductor structure and the bridge connection member and protruding therefrom to be configured to contact with a transfer means. The device is configured to contact with the transfer means at the protruding contact member of the element. A transfer method using the device is also disclosed.
    Type: Application
    Filed: September 17, 2020
    Publication date: January 7, 2021
    Inventors: Shao-ying TING, Junfeng FAN, Chia-en LEE, Chen-ke HSU
  • Publication number: 20200381603
    Abstract: A light emitting device includes a light emitting structure, first and second electrodes, and a shielding layer. The light emitting structure includes a first-type semiconductor layer, an active layer, and a second-type semiconductor layer that are stacked along a stacking direction in such order. The first electrode is electrically connected to the first-type semiconductor layer. The second electrode is electrically connected to the second-type semiconductor layer. The shielding layer is connected to aside of the light emitting structure and is adapted to absorb or reflect incident laser light.
    Type: Application
    Filed: August 17, 2020
    Publication date: December 3, 2020
    Inventors: SHAO-YING TING, JUNFENG FAN, CHIA-EN LEE, CHEN-KE HSU
  • Patent number: 10833232
    Abstract: A light-emitting diode (LED) includes: a base having an upward-opening accommodating space; an LED chip disposed at the base, and arranged in the accommodating space; a packaging adhesive covering the LED chip; a lens disposed over the packaging adhesive, wherein: the lens has a first surface proximal to the packaging adhesive; the first surface has: a first subsurface at a center area with a substantially spherical or parabolic shape; a second subsurface with a substantially ring shape and surrounding the first subsurface and extending downward with an increasing diameter; a third subsurface with a substantially ring shape and surrounding the second subsurface, having a top ring edge and extending downward with a decreasing diameter; and a fourth subsurface with a substantially planar shape and surrounding the top ring edge of the third subsurface and connected with the base.
    Type: Grant
    Filed: September 30, 2018
    Date of Patent: November 10, 2020
    Assignee: XIAMENC SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Xing-Long Li, Chi-Wei Liao, Chen-Ke Hsu, Weng Tack Wong
  • Publication number: 20200335383
    Abstract: A micro device transferring apparatus includes a first conveying mechanism, a carrier unit, a push device and a release device. The first conveying mechanism includes a release tape having a release adhesive, a first roller connected to an end of the release tape, and a conveying device connected to a horizontal section of the release tape to drive the release tape to move in a moving direction. The carrier unit includes a first carrier holding multiple micro devices, and a second carrier for receiving the micro devices. The push device is for pushing the release tape to pick up the micro devices with the release adhesive. The release device is for decomposing the release adhesive to release the micro devices.
    Type: Application
    Filed: June 17, 2020
    Publication date: October 22, 2020
    Inventors: CHEN-KE HSU, ZHIBAI ZHONG, CHIA-EN LEE, JINJIAN ZHENG, ZHENG WU, SHAO-YING TING
  • Publication number: 20200321392
    Abstract: Disclosed is a micro light-emitting component, a micro light-emitting diode, and a transfer layer. The transfer layer has a recess for receiving the micro light-emitting diode to permit the micro light-emitting diode to be retained by the transfer layer, and is transformable from a first state, in which the transfer layer is deformed by the micro light-emitting diode to form the recess, to a second state, in which the micro light-emitting diode received in the recess is retained by the transfer layer. Also disclosed are micro light-emitting component matrix and a method for manufacturing the micro light-emitting component matrix.
    Type: Application
    Filed: June 19, 2020
    Publication date: October 8, 2020
    Applicant: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
    Inventors: Shao-Ying TING, Junfeng FAN, Chia-En LEE, Chen-Ke HSU
  • Publication number: 20200303595
    Abstract: Disclosed is a light-emitting diode including an epitaxial laminate, a first electrode, and a second electrode. The epitaxial laminate includes a first type semiconductor layer, a second type semiconductor layer, and a light-emitting layer. The first type semiconductor layer has an outer surface, and a recess extending inwardly from the outer surface. Also disclosed is a method for transferring the light-emitting diode.
    Type: Application
    Filed: June 8, 2020
    Publication date: September 24, 2020
    Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Zheng WU, Chia-En LEE, Chen-Ke HSU
  • Publication number: 20200273848
    Abstract: A mass transfer method includes forming a photosensitive layer on a transfer substrate, heating the photosensitive layer at a temperature for the same to be in a partially cured state, disposing micro semiconductor elements on the photosensitive layer in the partially cured state, partially removing the photosensitive layer to form connecting structures, providing a package substrate and metallic support members, subjecting the metallic support members and the micro semiconductor elements to a eutectic process, breaking the connecting structures to separate the micro semiconductor elements from the transfer substrate, and removing the remaining connecting structures from the micro semiconductor elements.
    Type: Application
    Filed: May 15, 2020
    Publication date: August 27, 2020
    Inventors: ZHIBAI ZHONG, CHIA-EN LEE, JINJIAN ZHENG, JIANSEN ZHENG, CHEN-KE HSU, JUNYONG KANG
  • Publication number: 20200258861
    Abstract: A process for packaging at least one component includes the steps of: a) providing a substrate and a packaging material layer, b) forming the packaging material layer into an adhesively semi-cured packaging material layer, c) adhering the adhesively semi-cured packaging material layer to an array, d) providing a packaging unit including at least one eutectic metal bump pair, e) permitting the eutectic metal bump pair to be in contact with at least one electrode pair on the array, f) subjecting the electrode pair to eutectic bonding to the eutectic metal bump pair, g) encapsulating the component by pressing, h) completely curing the adhesively semi-cured packaging material layer, and i) removing the substrate.
    Type: Application
    Filed: May 1, 2020
    Publication date: August 13, 2020
    Inventors: Zhibai ZHONG, Chia-en LEE, Jinjian ZHENG, Lixun YANG, Chen-ke HSU, Junyong KANG
  • Publication number: 20200227302
    Abstract: A method for transferring a micro semiconductor element includes the following steps. A substrate, a bonding layer disposed on the substrate, and a supporting member disposed on the bonding layer opposite to the substrate are provided. The supporting member is bonded to a micro semiconductor element for supporting the same. A through hole is provided to extend through the substrate, the bonding layer, and the supporting member so as to forma transfer structure. A separation force is applied via the through hole to separate the micro semiconductor element from the supporting member.
    Type: Application
    Filed: March 26, 2020
    Publication date: July 16, 2020
    Inventors: ZHENG WU, SHAO-YING TING, CHIA-EN LEE, CHEN-KE HSU
  • Publication number: 20200227395
    Abstract: A LED device includes multiple LED chips each including opposite first and second surfaces, a side surface, and an electrode assembly disposed on the second surface and including first and second electrodes. The first surface of each of the LED chips is a light exit surface. The LED device further includes an electric circuit layer assembly disposed on the second surfaces of the LED chips and having opposite first and second surfaces and a side surface. The first surface is electrically connected to the first and second electrodes. The LED device further includes an encapsulating layer enclosing the LED chips and the electric circuit layer assembly to expose the second surface of the electric circuit layer assembly.
    Type: Application
    Filed: January 14, 2020
    Publication date: July 16, 2020
    Inventors: Junpeng SHI, Chen-Ke HSU, Chang-Chin YU, Yanqiu LIAO, Zhenduan LIN, Zhaowu HUANG, Senpeng HUANG
  • Publication number: 20200220048
    Abstract: An electrically conductive layered structure includes a lower transparent conductive layer having a bottom surface, an upper transparent conductive layer formed on the lower transparent conductive layer opposite to the bottom surface, and at least one hole extending from the top surface to the bottom surface. The at least one hole has a first diameter at a first side adjacent to the top surface and a second diameter at a second side opposite to the first side. The first diameter is smaller than the second diameter. A light-emitting diode device including the electrically conductive layered structure and a method for manufacturing the electrically conductive layered structure are also disclosed.
    Type: Application
    Filed: March 16, 2020
    Publication date: July 9, 2020
    Inventors: Huining WANG, Sheng-Hsien HSU, Ling-yuan HONG, Kang-Wei PENG, Su-hui LIN, Chen-ke HSU
  • Publication number: 20200220047
    Abstract: A micro-LED chip includes an epitaxial layered structure, and first and second electrodes. The epitaxial layered structure includes first-type and second-type semiconductor layers, and a light emitting layer sandwiched therebetween. The first and second electrodes are electrically connected to the first-type and second-type semiconductor layers, respectively. The micro-LED chip has a first distinctive region on an electrode surface of the first electrode. The first distinctive region has a surface morphology different from that of an adjacent region of the electrode surface of the first electrode. A method for manufacturing a micro-LED device including at least one micro-LED chip is also provided.
    Type: Application
    Filed: March 13, 2020
    Publication date: July 9, 2020
    Inventors: Chia-En Lee, Chen-Ke Hsu, Zheng Wu
  • Patent number: 10665748
    Abstract: A light-emitting diode includes from bottom to up: a substrate, a first-conductive type semiconductor layer, a super lattice, a multi-quantum well layer and a second-conductive type semiconductor layer. At least one layer of granular medium layer is inserted in the super lattice. The granular medium layer is used for forming V pits with different widths and depths in the super lattice. The multi-quantum well layer fills up the V pits and is over the top surface of the super lattice. The number of micro-particle generations, positions and densities can be adjusted by introducing granular medium layers and controlling the number of layers, position and growth conditions during super lattice growth process, to ensure V pits of different depths and densities. This can change hole injection effect, effectively improve hole injection efficiency and distribution uniformity in all quantum wells, thus improving LED light-emitting efficiency.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: May 26, 2020
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jie Zhang, Xiangxu Feng, Chengxiao Du, Jianming Liu, Chen-ke Hsu
  • Patent number: 10658550
    Abstract: A light-emitting diode (LED) package structure includes: a support; an LED chip; and a package cover, wherein: a support circuit is formed over the support; the LED chip is arranged over the support and electrically coupled to the support circuit; a lower surface periphery of the package cover is provided with a groove structure filled with organic binder; and the package cover is arranged over the LED chip and connected to the support via the organic binder.
    Type: Grant
    Filed: November 10, 2018
    Date of Patent: May 19, 2020
    Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
    Inventors: Junpeng Shi, Qiuxia Lin, Zhenduan Lin, Chen-Ke Hsu, Chih-Wei Chao
  • Patent number: 10643879
    Abstract: A transfer head for transferring micro element includes a cavity; a plurality of vacuum paths connected with the cavity respectively with valves configured at the connection between the cavity and the vacuum paths and used for opening/closing; a plurality of suction nozzles connected with the vacuum paths, wherein the suction nozzles hold or release the micro element via vacuum pressure; vacuum pressure is transmitted by each vacuum path; a switching component for controlling valve to open/close each vacuum path, so as to control the suction nozzles to hold or release required micro element via vacuum pressure. Further, the switching component includes a CMOS memory circuit and an address electrode array connected to the CMOS memory circuit to realize micro-switch array. The transfer head can selectively transfer a plurality of micro elements at one time.
    Type: Grant
    Filed: January 1, 2018
    Date of Patent: May 5, 2020
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Chen-ke Hsu, Xiaojuan Shao, Jiansen Zheng, Junpeng Shi, Kechuang Lin
  • Patent number: 10622234
    Abstract: A device configured to transfer a micro element includes: a pick-up head array configured to selectively pick up or release the micro element, and including a plurality of pick-up heads; and a test circuit having a plurality of sub-test circuits, each sub-test circuit corresponding to one pick-up head among the plurality of pick-up heads, and having at least two test electrodes for simultaneous testing of photoelectric parameters of the micro element when the transfer device transfers the micro element.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: April 14, 2020
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Chen-ke Hsu, Jiali Zhuo, Xiaojuan Shao, Jiansen Zheng