Patents by Inventor Cheng-Da Shaw

Cheng-Da Shaw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging for optical transceiver module
    Publication number: 20040008954
    Abstract: A packaging method of the optical transceiver module for transmitting optical signals is disclosed. The invention includes a base, a case, a transmission unit and receiving unit. The transmission unit and the receiving unit contain a circuit board, respectively. The base provides two fixing positions for the installation of the two circuit boards. The two circuit boards are installed horizontally and vertically, respectively. This design increase the utilization of the inner space providing ideal shielding for the elements and circuit boards. A central beam is used to fix the structure and case in a drawable way like a matchbox. This reduces covered area of the circuit board, making the elements easy to be tested and assembled.
    Type: Application
    Filed: July 14, 2003
    Publication date: January 15, 2004
    Applicant: Industrial Technology Research Institute
    Inventors: Cheng-Da Shaw, Min-Sheng Kao, Chiung-Hung Wang
  • Packaging for optical transceiver module
    Patent number: 6661565
    Abstract: A packaging method of the optical transceiver module for transmitting optical signals is disclosed. The invention includes a base, a case, a transmission unit and a receiving unit. The transmission unit and the receiving unit contain a circuit board, respectively. The base provides two fixing positions for the installation of the two circuit boards. The two circuit boards are installed horizontally and vertically, respectively. This design increases the utilization of the inner space, providing ideal shielding for the elements and circuit boards. A central beam is used to fix the structure and case in a drawable way like a matchbox. This reduces covered area of the circuit board, making the elements easy to be tested and assembled.
    Type: Grant
    Filed: July 23, 2002
    Date of Patent: December 9, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Da Shaw, Min-Sheng Kao, Chiung-Hung Wang
  • PACKAGING FOR OPTICAL TRANSCEIVER MODULE
    Publication number: 20030185572
    Abstract: A packaging method of the optical transceiver module for transmitting optical signals is disclosed. The invention includes a base, a case, a transmission unit and a receiving unit. The transmission unit and the receiving unit contain a circuit board, respectively. The base provides two fixing positions for the installation of the two circuit boards. The two circuit boards are installed horizontally and vertically, respectively. This design increases the utilization of the inner space, providing ideal shielding for the elements and circuit boards. A central beam is used to fix the structure and case in a drawable way like a matchbox. This reduces covered area of the circuit board, making the elements easy to be tested and assembled.
    Type: Application
    Filed: July 23, 2002
    Publication date: October 2, 2003
    Inventors: Cheng-Da Shaw, Min-Sheng Kao, Chiung-Hung Wang