Abstract: A system and method for depositing a photoresist and utilizing the photoresist are provided. In an embodiment a deposition chamber is utilized along with a first precursor material comprising carbon-carbon double bonds and a second precursor material comprising repeating units to deposit the photoresist onto a substrate. The first precursor material is turned into a plasma in a remote plasma chamber prior to being introduced into the deposition chamber. The resulting photoresist comprises a carbon backbone with carbon-carbon double bonds.

Abstract: An intelligent defecation device for living creature includes a device body, a supporting portion, an image module, and a first analysis module. The supporting portion is formed within the inner side of the device body for accommodating a moisture absorption member so as to allow the living creature to leave over its excrement therein. The image module is also arranged at the device body for dynamically capturing the images of the excrement in the supporting portion and outputting the image. The first analysis module is arranged in the device body and connected with the image module to analyze and calculate the defecation mode with the image based on preset or accumulated data, so as to generate a signal when an abnormal defecation mode is diagnosed.

Abstract: A system includes a microphone unit coupled to a roof of an autonomous vehicle. The microphone unit includes a microphone board having a first opening. The microphone unit also includes a first microphone positioned over the first opening and coupled to the microphone board. The microphone unit further includes an accelerometer. The system also includes a processor coupled to the microphone unit.

Abstract: A device includes a first transistor, a second transistor, and a dielectric structure. The first transistor is over a substrate and has a first gate structure. The second transistor is over the substrate and has a second gate structure. The dielectric structure is between the first gate structure and the second gate structure. The dielectric structure has a width increasing from a bottom position of the dielectric structure to a first position higher than the bottom position of the dielectric structure. A width of the first gate structure is less than the width of the dielectric structure at the first position.

Abstract: A power converter having a slew rate controlling mechanism is provided. A first terminal of a high-side switch is coupled to an input voltage. A first terminal of a low-side switch is connected to a second terminal of the high-side switch. A second terminal of a first capacitor is connected to a node between the second terminal of the high-side switch and the first terminal of the low-side switch. A first terminal of an inductor is connected to the second terminal of the first capacitor and to the node. A first terminal of a second capacitor is connected to a second terminal of the inductor. A second terminal of the second capacitor is grounded. An input terminal of a current controlling device is connected to a power output terminal of a high-side buffer. An output terminal of the current controlling device is connected to the node.

Abstract: An intelligent defecation device for living creature includes a device body, a supporting portion, an image module, and a first analysis module. The supporting portion is formed within the inner side of the device body for accommodating a moisture absorption member so as to allow the living creature to leave over its excrement therein. The image module is also arranged at the device body for dynamically capturing the images of the excrement in the supporting portion and outputting the image. The first analysis module is arranged in the device body and connected with the image module to analyze and calculate the defecation mode with the image based on preset or accumulated data, so as to generate a signal when an abnormal defecation mode is diagnosed.

Abstract: A system and method for depositing a photoresist and utilizing the photoresist are provided. In an embodiment a deposition chamber is utilized along with a first precursor material comprising carbon-carbon double bonds and a second precursor material comprising repeating units to deposit the photoresist onto a substrate. The first precursor material is turned into a plasma in a remote plasma chamber prior to being introduced into the deposition chamber. The resulting photoresist comprises a carbon backbone with carbon-carbon double bonds.

Abstract: Example embodiments described herein involve a system for testing a light-emitting module. The light-emitting module may include a mounting platform configured to hold a light-emitting module for a camera. The mounting platform may also be configured to rotate. The system may further include a housing holding a plurality of photodiodes arranged in an array over at least a 90 degree arc of a hemisphere. The system may also include a controller configured to control the photodiodes and the rotation of the mounting platform.

Abstract: Example embodiments described herein involve reducing the formation of ice on external modules by incorporating a heater within the module. The system may include a microphone module for an autonomous vehicle. The microphone module may include a housing and a microphone inside an opening of the housing. The system may further include a cover abutting the opening of the housing. The cover may enclose the microphone within the housing and seal the opening of the housing. The system may also include a heater adjacent to the opening of the housing and configured to prevent ice from forming over the opening. The heater may at least partially surround the opening.

Abstract: The present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, portions of an adhesion layer, barrier layer and/or seed layer is protected by a layer of an organic mask material as portions of the adhesion layer, barrier layer and/or seed layer are removed. The layer of organic mask material is modified to improve its resistance to penetration by wet etchants used to remove exposed portions of the adhesion layer, barrier layer and/or seed layer. An example modification includes treating the layer of organic mask material with a surfactant that is absorbed into the layer of organic mask material.

Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

Abstract: A dispensing system includes a dispense material supply that contains a dispense material and a dispensing pump connected downstream from the dispense material supply. The dispensing pump includes a body made of a first electrically conductive material, one or more first electrical contacts that are disposed on the body of the dispensing pump, and one or more first connection wires that are coupled between each one of the one or more first electrical contacts and ground. The dispensing system also includes a dispensing nozzle connected downstream from the dispensing pump and includes a tube made of a second electrically conductive material, one or more second electrical contacts that are disposed on an outer surface of the tube, and one or more second connection wires that are coupled between each one of the one or more second electrical contacts and the ground.

Abstract: Example embodiments described herein involve a system for testing a light-emitting module. The light-emitting module may include a mounting platform configured to hold a light-emitting module for a camera. The mounting platform may also be configured to rotate. The system may further include a housing holding a plurality of photodiodes arranged in an array over at least a 90 degree arc of a hemisphere. The system may also include a controller configured to control the photodiodes and the rotation of the mounting platform.

Abstract: A method for forming openings in an underlayer includes: forming a photoresist layer on an underlayer formed on a substrate; exposing the photoresist layer; forming photoresist patterns by developing the exposed photoresist layer, the photoresist patterns covering regions of the underlayer in which the openings are to be formed; forming a liquid layer over the photoresist patterns; after forming the liquid layer, performing a baking process so as to convert the liquid layer to an organic layer in a solid form; performing an etching back process to remove a portion of the organic layer on a level above the photoresist patterns; removing the photoresist patterns, so as to expose portions of the underlayer by the remaining portion of the organic layer; forming the openings in the underlayer by using the remaining portion of the organic layer as an etching mask; and removing the remaining portion of the organic layer.

Abstract: An IC structure includes a semiconductor fin, first and second gate structures, and an isolation structure. The semiconductor fin extends from a substrate. The first gate structure extends above a top surface of the semiconductor fin by a first gate height. The second gate structure is over the semiconductor fin. The isolation structure is between the first and second gate structures, and has a lower dielectric portion embedded in the semiconductor fin and an upper dielectric portion extending above the top surface of the semiconductor fin by a height that is the same as the first gate height. When viewed in a cross section taken along a longitudinal direction of the semiconductor fin, the upper dielectric portion of the isolation structure has a rectangular profile with a width greater than a bottom width of the lower dielectric portion of the isolation structure.

Abstract: A system includes multiple microphone arrays positioned at different locations on a roof of an autonomous vehicle. Each microphone array includes two or more microphones. Internal clocks of each microphone array are synchronized by a processor and used to generate timestamps indicating when microphones capture a sound. Based on the timestamps, the processor is configured to localize a source of the sound.

Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

Abstract: A power converter having a slew rate controlling mechanism is provided. A first terminal of a high-side switch is coupled to an input voltage. A first terminal of a low-side switch is connected to a second terminal of the high-side switch. A second terminal of a first capacitor is connected to a node between the second terminal of the high-side switch and the first terminal of the low-side switch. A first terminal of an inductor is connected to the second terminal of the first capacitor and to the node. A first terminal of a second capacitor is connected to a second terminal of the inductor. A second terminal of the second capacitor is grounded. An input terminal of a current controlling device is connected to a power output terminal of a high-side buffer. An output terminal of the current controlling device is connected to the node.

Abstract: A system includes multiple microphone arrays positioned at different locations on a roof of an autonomous vehicle. Each microphone array includes two or more microphones. Internal clocks of each microphone array are synchronized by a processor and used to generate timestamps indicating when microphones capture a sound. Based on the timestamps, the processor is configured to localize a source of the sound.

Abstract: A power converter including switch components having different safe operating areas is provided. A first terminal of a first high-side switch is coupled to a common voltage. A first terminal of a first low-side switch is connected to a second terminal of the first high-side switch. A second terminal of the first low-side switch is grounded. A first terminal of a second low-side switch is connected to a node between the second terminal of the first high-side switch and the first terminal of the first low-side switch. A second terminal of the second low-side switch is grounded. A safe operating area of the second low-side switch is larger than a safe operating area of the first low-side switch. After the first low-side switch is turned off, the second low-side switch is turned off Before the first low-side switch is turned on, the second low-side switch is turned on.